Title: Flip Chip Market by Packaging Technology (3D IC, 2.5D IC, 2D IC) and Trends - Research Beam - PowerPoint PPT Presentation

Description: Flip chip market is mainly driven by the emerging internet of things: a network of physical devices, vehicles, buildings, and other items that include embedded electronics, software, sensors, actuators, and network connectivity. In addition, its technological superiority over the traditional wire bond electrical connection makes it the exceptional alternative. However, the technology is still in mutation. The rate of flip chip is propelled by bumping cost and assembly process cost. Get More Here – PowerPoint PPT presentation