SEMICONDUCTOR TECHNOLOGY -CMOS-

1
SEMICONDUCTOR TECHNOLOGY-CMOS-

• Fire Tom Wada

2
What is semiconductor and LSIs

• Huge number of transistors can be integrated in a
  small Si chip.
• The size of the chip is roughly the size of
  nails.
• Currently, 10M transistors can be integrated.
• 1000 times integration comparing to 20 yrs ago.
• The cost of the chip is roughly same.
• All electronic equipments are powered by LSIs.
• PCs, Cellular phones, 3D graphics, Internet.

3
PC mother board
Large Scale Integration
4
SONY PLAYSTATION 2 MAINBOARD
Graphics LSI
Rendering LSI
High Speed Memory
Direct RDRAM
5
Mobile Phone Mainboard
Memory, Logic, Analog
6
Key device is LSI
INTEL Pentium III module
7
This is a packaged LSI-Pentium III 300MHz Cache
LSI-
20 mm
15 mm
8
Si chip is molded in the package.
2 million transistor Chip is connected to the
pins thru wires.
9
6 inches Si wafer
10
8 inches Si wafer
Hundreds of Chips on a Si Wafer
11
Several hundreds of chips are fabricated on a
wafer simultaneously.
12
Chip photo- Motion Estimation Chip for HDTV
camera -
9.1 mm
Your small fingers nail size. 200M transistors.
8.6 mm
13
Scanning Electron Microscope photo-
Cross-section of the LSI -
0.5 micron
14
Structure Of CMOS LSI

• Isolation
• PN-Isolation, Local oxidation
• Si Substrate
• Bulk, epitaxial , SOI
• Well Structure
• N-type well in P-type Substrate
• Latch Up
• PNP Bipolar Transistor and NPN Bipolar Transistor
• Fabrication Process Technology

15
Cross-section of the LSI
Metal wiring
Poly-silicon
Poly-silicon
N
N
P
P
P-type MOS transistor
N-type MOS transistor
N-type well
P-type Si substrate
Si wafer
16
Advanced Process Development
Multi-level Metalization Module (BEP)
65nm
Transistor module (FEP)
Lithography(VUV, EPL) Mask
Fine Cu interconnect
SiGe/Metal gate
Low ? interdielectric
High ? Gate insulator
CMPplanarization
Low Resistance Ultra shallow junction
Low Resistance Contact with High Aspect ratio
Low stress Shallow Trench Isolation
17
LSI integration trend- Moores law -
10B
DVD-RAM
Digital HDTV receiver
DVD recorder
DVD player
1B
DVD-ROM
100M
10M
The number of transistors are increasing by 58
per year. - Moores Law -
Wide-TV, PHS phone
Number of transistors on a chip
1M
100K
0.8
0.5
0.3
0.18
0.13
10K
CHANNEL LENGTH (MICRON)
Source SEMATEC
1K
81
83
85
87
89
91
93
95
97
99
01
03
05
07
09
18
Communications and Consumer Products Drive
Semiconductor
Cellular Phones
45
Digital Camera
40
Set-TopBox
DVDPlayer
35
Internet Game Consoles
Smart Cards/Kiosks
30
SmartAppliance-Phone
Application MarketGrowth
Advanced DesktopPC and Workstation
25
MultimediaPC
CAGR (1997-2002)
AutomotiveApplications/GPS
20
PortableComputing
Switching LAN
1st Generation
2nd Generation
Video Camera
15
HDTV
3rd Generation
10
CarRadio
ColorTV
SemiconductorIndustry
5
0
0
5
10
15
20
25
30
35
40
45
50
55
SC Content (As of Equipment Cost)
Sources Applied Materials Corporate Marketing
estimates, Dataquest
19
Fabrication Process Issues
20
Ultra Clean Room
21
Basic LSI process
Layer Deposition
SEM photo of Logic LSIs
lithography
etching
cleaning
22
Light Source
Lens
Mask
A
Lens
Si Wafer
A A A A A A A A A A A A A A A A A A A
A A A A A A A A A A A A A A A A A A A A
Stage
Y
X
Projection
23
Packaging Test
Remove Process defect Chips
Wafer Test
Testing
Wafer
Functional Test,DC Test
Pre Test
Final Test I
scribing
Functional Test,DC/AC Test
Chips
Burn-In
Ex.)Vcc7V,Temp.125?, 2442hrs
Mounting
Assembly Flow
Bonding
Shipping Test
Final Test II
Functional Test(at Speed),DC/AC Test
Enclosing
Sample
marking
24
Large Scale Integration

• NMOS , PMOS and Wiring
• All Logic Function can be made
• Memory Element Can be made
• Billions of Transistors and wiring make LSI!

25
CMOS NOT (Inverter)
26
CMOS NAND ? NOR
27
Classification Of LSI

• Logic LSI Micro Processor, Digital Signal
  Processor (DSP), FPGA
• Memory LSI RAM (DRAM, SRAM), ROM (Flash Memory)
• Analog LSI ADC, DAC, Filter, Amplifier
• Micro Processor (PCs central processing Unit)
• Perform Digital computation according to the
  program in Memory
• Integration in 7000 times in 25 years, (Moors
  Law)
• Clock Speed 700 times in 25 years
• Memory LSI
• Dynamic Random Access Memory Main memory for
  Computer, 4-times density in 4 years
• Static Random Access Memory work memory for
  mobile equipments
• Flash Memory Nonvolatile memory , Digital
  Camera Storage
• Analog LSI
• Used for interface, high speed RF interface,
  Analog to Digital Conversion, Digital to Analog
  Conversion

28
Analog to Digital Conversion

• Analog to Digital
• Sample the analog wave
• Convert to Digital format in Binary
• Same as f(t) to An

ADC LSI
29
Chip photo
SoC
Flash Memory