SNAP NIR Detector Packaging Development: Towards a Universal SiC Detector Package

1
SNAP NIR Detector Packaging DevelopmentTowards
a Universal SiC Detector Package

• Bruce C. Bigelow
• Department of Physics, University of Michigan
• 20 July 2005

2
SiC NIR Package Design Issues

• Neither NIR device vendor is producing a package
  we want to use for SNAP
• SiC is currently favored for SNAP focal plane
  components
• It would be useful to have a NIR package design
  that can accommodate either RSC or RVS detectors
• These designs shown here have the center of the
  Rockwell sensor area located at the center of the
  Raytheon sensor area.

3
Current Rockwell Package Design
Rockwell PGA PCB presents wire-bonding pads for
connector on front side of mother-board
4
Current Rockwell Package Design
H2RG package and mounting details
5
Current RVS Package Dimensions
Raytheon PCB presents wire-bonding pads for
connector on back side of mother-board
6
Current RVS Package
Raytheon Proprietary / Competition Sensitive
7
Rockwell device on universal package
Wire-bonds attach green PCB to front side of
magenta mother board.
Rockwell device is undersized for the SNAP focal
plane detector pitch
8
Raytheon device on universal package
Wire-bonds attach green PCB to back side of
magenta mother board.
Raytheon device is well sized for the SNAP focal
plane detector pitch
9
Common SiC package design
10
Conclusions

• A conceptual design for a SiC NIR detector
  package that could accommodate either Rockwell or
  Raytheon detectors, and meets all of the current
  SNAP requirements, has been presented.
• Pending review of the quotation drawings,
  requests for quotations for fabrication of the
  package will be sent out, and prototype parts
  will be ordered from at least one vendor