Global 3D IC and TSV Interconnect Market worth $6.55 billion by 2016

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MarketsandMarkets Presents
Global 3D IC and TSV Interconnect Market worth
6.55 billion by 2016

http//www.marketsandmarkets.com/Market-Reports/3D
-IC-Chip-and-TSV-Interconnect-Market-117.html
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According to a new market research
report Three-dimensional Integrated Circuit (3D
IC/Chip) Through-Silicon Via (TSV)
Interconnects Market - Global Forecast Trend
Analysis (2011 - 2016) By Technology (Substrate,
Bonding Techniques, Process Realization,
Fabrication), Products (Memory, LED, Sensor,
MEMS, Power Analog Components) Applications
(Mobile Devices, Processors, ICT, Networking,
Automotive, Defense) published by
MarketsandMarkets, the total 3D IC market is
expected to reach 6.55 billion by 2016 at a CAGR
of 16.9 from 2011 to 2016. Browse gtgt
70 data tables. 14 figures.
in-depth TOC on 3D IC Chip and TSV
Interconnect Market.  http//www.marketsandmarke
ts.com/Market-Reports/3D-IC-Chip-and-TSV-Interconn
ect-Market-117.html Early buyers will receive
10 customization on this report. Request to
Download Free PDF Brochure _at_
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d117
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The transition from 2 dimensional (2D) packaging
to 3D packaging is considered to be one of the
major developments in the semiconductor industry.
3D packaging is observed to pave way for the
concept of More than Moore with comparatively
lesser investment. This has led to strategic
innovation with respect to 3D integration despite
the economic downturn. The use of TSV
interconnects within die stack instead of
wirebond interconnect and board-level routing
helps to save the system energy consumption to a
large extent. Some of the early innovations
related to TSV include that from Samsung (South
Korea) and Xilinx (U.S.). The global 3D IC
market is expected to grow from 2.21 billion in
2009 to 6.55 billion in 2016 at a CAGR of 16.9
from 2011 to 2016. Asian region is observed to
have the highest growth rate. This is mainly
attributed to the presence of a huge number of
companies such as Taiwan Semiconductor
Manufacturing Company Limited (Taiwan), Samsung
(South Korea), United Microelectronics
Corporation (Taiwan), and more who contribute to
different aspects of 3D IC manufacturing and thus
help to address the challenges associated with
its manufacture in a cost effective
manner. Inquire Before Buying _at_
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ying.asp?id117
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-IC-Chip-and-TSV-Interconnect-Market-117.html