Thermal Interface Pads Market by Type & Products - 2020 | MarketsandMarkets

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MarketsandMarkets Presents
Thermal Interface Pads Material Market worth
1379.02 Million by 2020
Thermal Interface Pads Material Market by Type
(Phase Change Material, Thermal Grease, Thermal
Pads), Products (MOSFET, Thyristor, IGBT),
Application (Consumer Electronics, Telecom
Equipment, Power Supply Units) - Forecast to
2020
http//www.marketsandmarkets.com/Market-Reports/th
ermal-interface-pad-market-211218297.html
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According to a new market research
report Thermal Interface Pads Material
Market by Type (Phase Change Material, Thermal
Grease, Thermal Pads), Products (MOSFET,
Thyristor, IGBT), Application (Consumer
Electronics, Telecom Equipment, Power Supply
Units) - Forecast to 2020, published by
MarketsandMarkets, the total thermal interface
pads material market is expected to reach
1379.02 million by 2020. Browse 80 market
data tables and 53 figures spread through 165
pages and in-depth TOC on Thermal Interface Pads
Material Market - Forecast to 2020"Early
buyers will receive 10 customization on this
report.
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The thermal interface pads material market
comprises products used for transferring heat
from electronic components to heat sinks in a
wide range of electronic applications in
different industries. Thermal interface pads
materials are widely used in consumer
electronics, telecom equipment, power supply
units, aerospace, and other industries. The
global market for thermal interface pads
materials is expected to reach 1379.02 Million
by 2020, at a CAGR of 8.47 from 2015 to
2020. For More Details _at_ http//www.marketsandmar
kets.com/pdfdownload.asp?id211218297 The
report segments the thermal interface pads
material market on the basis of type, product,
application, and geography. Furthermore, it
estimates and forecasts the market, along with
analyzing various trends in the same. The
geographical analysis contains an in-depth
classification of the market into the Americas,
Europe, and APAC, which comprise the major
regions pertaining to the said market. These
regions have been further split into the major
countries which comprise the market for this
product. Furthermore, North America has been
segmented into the U.S., Canada, and Mexico
Europe comprises U.K, Germany, France, France,
Italy, and Spain APAC comprises Japan, China,
South Korea, and India and the ROW region
comprises the Middle-East, Africa, and Latin
America. The sections and the sub-segments in the
report include the drivers, restraints,
opportunities, and current market trends and the
technologies expected to revolutionize the
industry.
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The thermal interface pads materials market
has been segmented based on application into
consumer electronics, telecom equipment, power
supply units, and others. The market has also
been segmented based on type into phase change
material, thermal pads, thermal grease, and
others. Furthermore, the market has been
segmented on the basis of product into MOSFET,
Thyristor, IGBT, and others. Inquiry Before
Buying _at_ http//www.marketsandmarkets.com/Enquiry_
Before_Buying.asp?id211218297 This report
focuses on providing an insight into the overall
thermal interface pads material market, with
detailed market segmentations, combined with the
qualitative analysis of each and every aspect of
classification on the basis of type, product,
application, and geography. The said market has
been estimated and forecasted till 2020, to
identify the key revenue pockets for the
same. The global thermal interface pads
material market is expected to reach 1379.02
Million by 2020, at an estimated CAGR of 8.47.
The market for PCM materials is expected to grow
at a high CAGR during the forecast period. Some
of the prominent companies in this thermal
interface pads material market include 3M
(U.S.), Dow Corning (U.S.), Parker Chomerics
(U.S.), and Laird Technologies (U.K.)

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