Liquid Encapsulation Materials Market worth 1,397.46 million USD by 2020

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MarketsandMarkets Presents
Liquid Encapsulation Materials Market is
projected to grow at a CAGR of 6.7 between 2015
and 2020 Browse 76 market data Tables and 105
Figures spread through 187 Pages and in-depth TOC
on "Liquid Encapsulation Materials Market -
Global Forecast to 2020"
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Encapsulation is one of the advanced packaging
processes of almost all semiconductor devices
that offer low stress, low warpage, and high
thermal conductivity. Encapsulation can be of two
forms, namely, solid and liquid. Solid
encapsulants are epoxy-molding compounds (EMC)
that are a blend of solid epoxy resins,
hardeners, flame retardants, fillers, and several
additives. Liquid encapsulants have similar
compositions, but the resin and hardener are
liquid and allow the material to be directly
applied onto the chip they interconnect
typically by wire bonding instead of molding.
Furthermore, the encapsulants can be of three
types, namely, glass, ceramic, metal (hermetic
type), plastic (non-hermetic type), and polymer
(near-hermetic package (NHP)). http//www.markets
andmarkets.com/Market-Reports/liquid-encapsulation
-material-market-189457289.html One of the major
reasons for choosing the encapsulation technique
for devices is the growing trend of
miniaturization, where smaller and complex
structures of devices can be managed without
harming its performance. In the liquid
encapsulation process, liquid encapsulant
materials are implanted on the device to overcome
issues such as misconnection of electrical
components on devices and to ensure the proper
functioning of the device.
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The report describes the market trends and
challenges for the global liquid encapsulation
materials market and forecasts the market till
2020, on the basis of material, product,
application, and geography. It also features a
detailed competitive landscape which includes the
identification of the key players in the global
market, in addition to identifying the major
strategies adopted by these players. The report
provides the drivers, restraints, opportunities,
and challenges for the global market. The report
estimates the global liquid encapsulation
materials market in terms of value and also
forecasts the same for the different regions,
namely, the Americas, Europe, AsiaPacific
(APAC), and Rest of the World (RoW. Ask for PDF
_at_ http//www.marketsandmarkets.com/pdfdownload.asp
?id189457289 The major players in the global
liquid encapsulation materials market are
Shin-Etsu Chemical Co., Ltd. (Japan), Sumitomo
Bakelite Co., Ltd. (Japan), Hitachi Chemical Co.
Ltd. (Japan), Henkel AG and Co. KGaA (Germany),
Kyocera Corporation (Japan), Nagase Co., Ltd.
(Japan), Nitto Denko Corporation (Japan),
Panasonic Corporation (Japan), BASF Se (Germany),
Sanyu Rec Co. Ltd. (Japan), Resin Technical
Systems (U.K.), and Epic Resins (U.S.) among
others.
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