Product History - PowerPoint PPT Presentation

1 / 10
About This Presentation
Title:

Product History

Description:

Designed to increase sensitivity headroom to enable detection of ... Substantial detection headroom to detect 'extreme' wafers that are yet to be introduced ... – PowerPoint PPT presentation

Number of Views:19
Avg rating:3.0/5.0
Slides: 11
Provided by: christy83
Category:

less

Transcript and Presenter's Notes

Title: Product History


1
Product History
WX, ZX, EX sensors required multiple gain
adjustments for robust detection
2
Why did we build the EX-Q?
  • Wanted a sensor that could provide
  • Consistent wafer detection without frequent gain
    adjustments
  • "Through beam like" performance
  • Backward compatibility with existing EX sensors
  • Maintaining flexible, off-the-shelf package of a
    reflective sensor

3
What's required for accurate wafer mapping?
  • Any mapping sensor (regardless of technology)
    must have consistent and accurate Apparent Wafer
    Thickness for reliable mapping performance
  • Apparent Wafer Thickness the scan distance
    between the beginning (ON) pulse and the end
    (OFF) pulse of the sensor's output signal

4
How did we do it?
  • Reduced the thickness of the laser stripe to
    0.05mm while maintaining peak response
    (sensitivity)
  • Reduces the laser stripe's skirt or "noise" to
    provide a more accurate, consistent AWT

5
EX-Q Performance vs. Wafer Reflectivity
  • EX-Q maintains consistent Apparent Wafer
    Thickness regardless of wafer reflectivity

Max/Min Range Expect gt99.8 of sensor
measurements to be within Max/Min range
Mapping Algorithm Safety Region Able to classify
absent, present, cross slot
6
Detecting future wafers
  • EX-Q has the sensitivity and detection headroom
    to detect ultra thin and/or other wafers with
    extreme characteristics

Detection Headroom (on axis)
gt 1000X
gt 100X
gt 100X
gt 10X
Threshold signal detection (data normalized to 1)
7
EX-Q doesn't need gain adjustments
  • EX-Q delivers both detection and accurate AWT at
    the factory gain setting for most wafer types
    or, all SEMI standard wafers
  • EX required a trade-off between detection and AWT
    which demanded gain adjustments in the field as a
    function of wafer type

8
Vertical tilt results in stray reflection
immunity
  • EX-Q sensors have a 3 vertical tilt integrated
    into the sensor to avoid FOUP back reflections

9
EX-Q Improvements
10
Backwards Compatibility
  • Upgrading is easy and convenient
  • EX-Q sensors have the same mechanical footprint,
    electrical interface and digital output as the EX
    and WX
  • Plug-and-play compatible with existing software
    algorithms for the EX, requiring only reteaching
    the robot at setup
  • Upgrading from the WX requires reteaching the
    robot at setup and appropriate parameter
    adjustment
Write a Comment
User Comments (0)
About PowerShow.com