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Title: Microfabrication Mentoring Environment


1
Microfabrication Mentoring Environment Summer 2003
Undergraduate Student Participants Joshua
Beutler Mark Lowther Jeff Campbell Ghassan
Sanber Elizabeth Despain Eli Tamanaha Justin
Henrie Ran Wang Ben Ipson Sarrah Wilson Boaz
Khan
Faculty Participants Aaron Hawkins Richard
Selfridge Stephen Schultz
2
MME Participants E-mail Addresses
Students Joshua Beutler jlbeutler_at_emstar2.net J
eff Campbell kjcdb8er_at_yahoo.com Elizabeth
Despain edespain_at_email.byu.edu Justin
Henrie justin_henrie_at_hotmail.com Ben
Ipson bli3_at_email.byu.edu Boaz
Khan boazkhan_at_hotmail.com Mark
Lowther mal79_at_email.byu.edu Ghassan Sanber
gss28_at_email.byu.edu Eli Tamanaha eli_tamanaha_at_m
sn.com Ran Wang rw92_at_email.byu.edu Sarrah
Wilson ser45_at_email.byu.edu Faculty Aaron
Hawkins hawkins_at_ee.byu.edu Richard
Selfridge selfridge_at_ee.byu.edu Steve
Schultz schultz_at_ee.byu.edu
3
MME - Structure
Entire MME Project
Fiber Patterning
Diffraction Gratings
Advanced Layout
Advanced Lithography
Documentation
Microchambers
Coordinator Sarrah Team Everyone Faculty All
Thur. 1pm
Coordinator Jeff Team Boaz Elizabeth Ben Facu
lty Selfridge Thur. 11am
Coordinator Eli Team Boaz Justin Elizabeth Fa
culty Schultz Thur. 2pm
Coordinator Ghassan Team Justin Elizabeth Fac
ulty Hawkins Tues. 1pm
Coordinator Ran Team Mark Josh Faculty Hawki
ns Thur. 2pm
Coordinator Elizabeth Team Mark Ghassan Facul
ty Hawkins Tues 1pm
4
Project Descriptions - Documentation
This goal of this project is to produce written
instructions describing cleanroom processes and
equipment. These instructions will include
recipes on how to produce desired material layers
or micro-features. For example, optical
lithography will be described with enough detail
that a future student can use the instructions to
operate our mask aligner and produce lithographic
features of a desired geometry. All instructions
will be stored on-line on an intranet site
specifically for the cleanroom. Parts of this
site will be accessible through the Web. A model
site we want to emulate can be found at the
following link Georgia Tech http//grover.mirc.
gatech.edu/
Equipment Instructions MA150 Aligner Canon
Aligner Solitec Spinner Laurell Spinner E-beam
Evaporator Thermal Evaporator Tube
Furnaces Anelva RIE Etcher PECVD
Machine RTA Ellipsometer Profilometer HP 4145
Processing Recipes Positive Lithography Negative
Lithography RIE Etching (various
materials) PECVD Deposition (various
materials) Growth of oxides Semiconductor
doping Metal depositions Annealing
conditions MOSFET Process Layout/Cadence Mask
Production
5
Project Descriptions Fiber Patterning
The purpose of this project is to produce
structures onto the surface of a D-shaped optical
fiber. The structures include metallic
electrodes, polymer waveguide patterning, etc.
The structures must be aligned to the core of the
optical fiber.
Project relies on Process Development -
Jeff Lithography Mark SEM Characterization -
Elizabeth
6
Project Descriptions Diffraction Gratings
The purpose of this project is to produce
gratings onto the surface of a glass substrate.
Diffraction gratings are periodic structures with
a period around 1 micron that are etched into the
surface. Gratings will be produced using laser
holography and with standard photolithography.
The end goal of the project is the production of
a grating illuminator and grating coupler.
Project relies on Process Development -
Eli RIE Etching Justin
SEM Characterization Elizabeth PECVD Deposition
- Boaz
7
Project Descriptions - Microchambers
The purpose of this project is to produce very
small microchambers on a silicon wafer into which
a gas can be sealed. This project is important
because etching a hole in a surface is easy, but
later sealing the whole to create the chamber has
not been done before. If a successful method can
be developed, this technique will have many
applications, especially in the photonics field.
Project relies on Process Development -
Ghassan Lithography Mark RIE Etching Justin
SEM Characterization Elizabeth PECVD Deposition
- Boaz
8
Project Descriptions Advanced Layout
The goal of this project is the design and
production of lithography masks that can be used
for ECEn classes as well as for research
projects. The mask layout will be done with
Cadence and one of its important aspects will be
documenting how to go from Cadence layout screen
to a production mask.
Project relies on Mask Design - Ran Process
Development and Testing Mark and Josh
Major Mask Sets for Design ECEn 452 MOSFET
mask ECEn 452 3 Color Picture mask ECEn 542
Detector, LED, and Laser masks Curved Gratings
Mask interface with Matlab Grayscale Mask
interface with Matlab
9
Project Descriptions Advanced Lithography
Main focus will be the development of new
lithography processes that can be run on the Karl
Suss, Canon, and Perkin Elmer Aligners, and the
Spinners. The goal is a reproducible process for
1 micron feature sizes for thin photoresist, and
1.5 micron features for thicker photoresist.
Project relies on SEM Characterization -
Elizabeth Process Development and Testing Mark
and Ghassan
  • Major Tasks
  • Photoresist/Polymer application and adhesion
    develop optimal processes. Major test will be
    adhesion to SiO2 during HF etching
  • Optimize exposure and development times for
    different photoresists and developers using Canon
    and Karl Suss Aligners. Tests of linewidths will
    be using optical microscopes and SEM.
  • Determine ultimate minimum linewidth for each
    machine

Materials for study Resists Adhesion
Promoters Developers AZHIR1075
HMDS AZ300MIF AZ3312 SP3T2201 Shipley
MF26A AZ3330 SP4T9906 Shipley
351 AZnLOF2020 Shipley SPR700-1.8L Shipley
SPR700-1.2L
10
Meeting Structure
  • Weekly MME Meeting Entire Group
  • Discuss Documentation
  • Bring Up Common Problems and Concerns
  • Student Presentations on Projects
  • Led by Faculty Members
  • Weekly Project Meetings Sub Groups
  • Correlate Weekly Goals and Strategy
  • Report Results
  • Coordinator Sets Agenda
  • Faculty Member Present

11
Individual Responsibility Joshua Beutler
Main focus will be on the RTA, and mask creation
for the cleanroom. Will be a part of the
Advanced Layout group and perform some process
development using the masks created.
RTA Clean up existing system and determine
operating conditions. Make any repairs or
adjustments to the system necessary. Test the
performance using implanted wafers that have been
annealed. Provide necessary documentation for
using the machine and typical anneal recipes.
Work closely with Don Dawson on equipment. Mask
Creation Document the mask making process using
the Pattern Generator as well as High resolution
Print Services printer. This will include
transferring patterns from a Cadence Generated
GDS file to a chrome mask. Work closely with Joe
Bussio on this process. Process Development
Specifically assist with the Color Picture Mask
process development, providing documentation for
producing picture.
Goals for first 2 Weeks Get certified for
cleanroom entrance. Background reading from Sze
Chapter 1, 11, 12, 13. Begin initial look at
RTA, also begin work with Joe on documenting mask
making process.
12
Individual Responsibility Jeff Campbell
Main focus will be the development of the process
for D-fiber patterning. This involves
fabrication of a V-groove structure to hold and
align the D-fibers to a photolithography mask,
attaching the fiber to the V-groove, and
patterning the fiber.
  • After developing the D-fiber patterning process
    perform the following research tasks
  • Fabricate metal electrodes on the flat side of
    a D-fiber.
  • Use the electrodes as a chemical etching mask
  • Remove polymer off of the flat surface of a
    D-fiber.
  • Help develop the documentation for the E-beam
    evaporator

13
Individual Responsibility Elizabeth Despain
Main focus will be on SEM characterization and
coordinating the Advanced Lithography project.
Will also provide key SEM support to the
Microchamber, Fiber Patterning, and Gratings
Projects as well as Justins RIE work.
SEM Will use Scanning Electron Microscope to
take high resolution pictures of features
on Wafers including lithography lines and etch
features. Advanced Lithography Design
experiment to investigate properties of multiple
resists And developers. These experiments will
involve various exposure and development
recipes With the end goal of a reproducible 1 um
linewidth photoresist with good adhesion.
Deliverables will be SEM images of these
features. Provide documentation for optimal
Processes for website.
Goals for first 2 Weeks Get certified for
cleanroom entrance and Aligner Use. Background
reading from Sze Chapter 1, 11, 12. Begin
initial SEMs of etched structures. Design
Lithography experiment.
14
Individual Responsibility Justin Henrie
Main focus will be the characterization of the
Anelva RIE system including documentation for
running the machine as well as optimal recipes.
Will be a part of the Diffraction Gratings and
Microchambers groups to supply etch support using
the RIE.
Conduct experiments over the following variable
space Gas mixture, flow-rate, pressure, and
power to provide etch rate, anisotropy, and
selectivity information. Etches for the
following materials Silicon Silicon
Dioxide Silicon Nitride Photoresist/Polymer Glass
slides
15
Individual Responsibility Ben Ipson
Main focus will be the etching of D-fibers and
subsequent polymer waveguide formation.
  • Support Jeff in the etching of D-fibers with a
    metal mask
  • Work with Jeff on removing the polymer from the
    flat surface of the fiber
  • Produce etched fibers with low loss polymer
    waveguides for thermal modulation
    characterization
  • Test the thermal modulation characteristics of
    the fibers
  • Fabricate low-loss polymer waveguides with
    metallic electrodes
  • Test the D-fiber modulator for electro-optic
    modulation

16
Individual Responsibility Boaz Khan
Main focus will be the characterization of the
PECVD system including documentation for running
the machine as well as optimal recipes. Will be
a part of the Diffraction Gratings and Fiber
Electrode groups to supply thin-film support
using the PECVD.
Conduct experiments over the following variable
space Gas mixture, flow-rate, pressure, power,
and temperature to provide deposition rates,
refractive index index information, and material
strength data. Depositions for the following
materials Silicon Dioxide Silicon
Nitride Silicon Oxy-Nitride Poly/Amorphous Silicon
Goals for first 2 Weeks Get certified for
cleanroom entry, provide write-up for PECVD
operation, continue nitride index measurements.
Background reading from Sze Chapter 1, 11, 12.
17
Individual Responsibility Mark Lowther
Main focus will be on the installation and
characterization of the thermal evaporator now
located in the cleanroom. Will be a part of the
Advanced Layout and Lithography groups and
perform some process development.
Thermal Evaporator Complete install of system
including vacuum systems, electrical systems,
and mechanical lift system. Also modify system
to provide multiple evaporation electrodes.
Conduct initial evaporations using aluminum and
chrome metals also evaluating thickness
monitor. Work closely with Don Dawson on the
completion of this project. Process Development
Specifically assist with the development of new
lithography processes Down to 1 micron linewidths
especially involving photoresist adhesion.
Provide documentation on the use of the Karl Suss
and Canon Aligners.
Goals for first 2 Weeks Get certified for
Aligner Use. Determine exact condition of the
evaporator, order necessary components to make it
work, make sure all necessary utilities are
available electricity, nitrogen, compressed
air. Assist in Design of Experiment for
Lithography process
18
Individual Responsibility Ghassan Sanber
Will be the coordinator of the Microchamber
project. The goal of this project is to produce
a sealed microchamber containing a gas vapor.
Ideally these chambers will be coupled to optical
waveguides. Will also be involved in the
Advanced Lithography project working on getting
linewidths down to 1um.
  • Major Tasks
  • Design of photomask containing structures for
    line and micro-chamber etching.
  • Etch lines and chambers in silicon
  • Develop and test sealing technique using thick
    polymer coating
  • Seal detectible gas into chamber
  • Apply technique to waveguiding material SiNx or
    SiO2

Goals for first 2 Weeks Get certified for
cleanroom entry and aligner use, complete mask
layout, Background reading from Sze Chapter 1,
11, 12, Begin etching first lines and holes in
silicon wafers.
19
Individual Responsibility Eli Tamanaha
Main focus will be on grating fabrication and
testing as well as on two pieces of equipment
located in the cleanroom - the Profilometer, and
the HP4145. Will be a part of the Diffraction
Gratings group.
Fabricate and test diffraction grating patterns.
These patterns will be fabricated to produce
grating couplers and the grating illuminator.
This process will involve both holographic and
photolithographic fabrication. Profilometer
Interface with computer using Labview to store
surface profiles. Can work closely with Joe
Bussio and Sysops. Provide documentation on
running machine and saving profiles. HP4145
Interface with computer using Labview to store
measurements. Can work closely with Joe Bussio
and Sysops. Provide documentation on running
machine and saving profiles.
20
Individual Responsibility Ran Wang
Will be the coordinator of the Advanced Layout
project. The goal of this project is to produce
several lithography mask sets and verify they
work correctly in the production of semiconductor
structures. Will also develop a process to
produce a mask in Cadence using a Matlab file as
well as document the layout process. Will work
closely with Josh and Mark for process
development.
  • Major Tasks
  • MOSFET Mask layout, production, and verification
  • Optoelectronic Mask layout, production, and
    verification
  • Dyeless picture layout, production, and
    verification
  • Matlab to Cadence conversion process
  • Layout Documentation

Goals for first 2 Weeks Get certified for
cleanroom entry, Background reading from Sze
Chapter 1, 11, 12,, Begin layout of MOSFET Mask.
21
Individual Responsibility Sarrah Wilson
Main focus will be on documentation. This
documentation will involve both equipment
operating procedures and process. Each specific
piece of equipment and process will have a
responsible student researcher as listed below.
Sarrah will be in charge of coordinating the
entire documentation effort. This effort is very
important and will be discussed at every group
meeting throughout the summer.
Equipment Instructions MA150 Aligner
Mark Canon Aligner Mark Solitec Spinner
Ghassan Laurell Spinner Ghassan E-beam
Evaporator - Jeff Thermal Evaporator - Mark Tube
Furnaces - Jeff Anelva RIE Etcher - Justin PECVD
Machine - Boaz RTA - Josh Ellipsometer -
Boaz Profilometer - Eli HP 4145 - Eil
Processing Recipes Positive Lithography
Elizabeth Negative Lithography Elizabeth RIE
Etching (various materials) - Justin PECVD
Deposition (various materials) - Boaz Metal
depositions Jeff/Mark Annealing conditions -
Josh Layout/Cadence Ran Mask Production - Josh
Goals for first 2 Weeks Get certified for
cleanroom entry, Background reading from Sze
Chapter 1, 11, 12, Tag-along with experienced
students Justin, Jeff, Eli. Begin architecting
website
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