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Automotive Electronics: A Blueprint for the Future

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Title: Automotive Electronics: A Blueprint for the Future


1
Automotive ElectronicsA Blueprint for the Future
  • Martin Baker
  • CEO, Invirtech
  • ViEWcon09
  • Detroit, February 4, 2009

2
Agenda
  • Trends and Challenges
  • Growth, Technology Evolution, Complexity, Speed,
    Quality, Cost, etc.
  • Synthesis the Future
  • Super-integration, separation of SW and HW, rise
    of architects and system integrators,
    virtualization.
  • Implications
  • Current OEMs, Tier 1s, Tool suppliers, etc
  • New entrants

3
Agenda
  • Trends and Challenges
  • Synthesis the Future
  • Implications

4
The Challenges
  • THE Innovative Technology
  • 95 of new features SW controlled
  • Exponential Feature/SW Growth
  • 2M to 10M LOC in 5 years, accelerating
  • Distributed, Interactive Features
  • 60 of all new features MUST be distributed
  • Business
  • Time to Market (consumer electronics)
  • Cost, Resources
  • Engineering far more complex

5
Key Trends
  • Moores Law
  • Multiple Sources of IP
  • Autosar, Green Hills, etc.
  • Disaggregation of Hardware and Software
  • Pervasive connectivity
  • Unpredictable innovation
  • Safety standards
  • Model-Based Approaches, Virtualization

6
Agenda
  • Trends and Challenges
  • Synthesis the Future
  • Implications

7
Synthesis Future Architecture
  • Super-integrated Architecture
  • A few, large controllers handle bulk of control.
  • Remote I/O nodes, smart sensors/actuators
  • Separation of safety elements within ECU
  • Small ECUs for some low-take/new features.
  • Why?
  • Saves 50-250 per car
  • Interactions easier to manage, bus load down
  • Give-away avoided by ECU families
  • Computing power, AutoSAR etc enables

8
Synthesis Future Software sourcing
  • Software sourced separately
  • Multiple SW components in each ECU
  • Demands standard SW architecture and interfaces
    (e.g. AutoSAR)
  • Why?
  • Tracks sourcing of IP
  • Enables re-use of most critical element
  • Enables feature sourcing
  • Done correctly, reduces time to market for
    innovation

9
Synthesis Future Roles
  • Two roles dominate
  • Architect
  • Systems Integrator
  • Why?
  • Architecture critical to cost, expandability
  • SW and Functional architectures now critical
  • Integration now the biggest challenge in
    automotive
  • Tier 1 integration no longer a good option

10
Synthesis Future Process
  • Model Based/Virtualization Essential
  • Correct by design approach
  • Work done earlier, at higher level
  • Exploits growing tool capabilities
  • Why?
  • Complexity overwhelms physical approaches
  • Interfaces driven inside ECUs, no more black
    box
  • Only way to meet combined speed, efficiency and
    quality challenges

11
Agenda
  • Trends and Challenges
  • Synthesis the Future
  • Implications
  • Existing Players
  • New Entrants

12
Implication for OEMs
  • Engineering approaches must change
  • Distributed features require feature/function
    engineering axis separate from hardware axis
  • Architecture design/spec must be more detailed,
    (esp. SW) and more forward looking
  • Need system integration capability
  • Culture challenge
  • Mechanical history, culture, process
  • Product evolving to become primarily electronic

13
Implication for OEMs (cont)
  • Value Chain critical
  • Greater competition in HW supply
  • Re-use of IP/models/SW key to managing complexity
  • Delegation of risk/responsibility harder
  • Power to drive Process/Method/Tools
  • Drive virtualization, demand models, drive tool
    integration

14
Implication for Tier 1s
  • Facing the biggest threat
  • Most affected by recession
  • Most affected by technology change
  • Who owns the value chain?
  • Disaggregation of SW and HW threatens existing
    model
  • Large OEMs may insource, small/med OEMs more
    dependent on Tier 1
  • Opportunity to sell more IP/SW, less HW
  • Collaboration unavoidable
  • No-one can own all the IP.

15
Implication for Tier 2s
  • Software
  • Easier to enter market (no longer HW barrier)
  • Hardware
  • Easier to enter market (no longer SW barrier)
  • Re-ordering of EE and ME
  • As E/E becomes more dominant, todays E/E Tier 2s
    may replace todays Mechanical Tier 1s
  • Distressed Tier 1 suppliers may create unexpected
    opportunities

16
Implication for Tool/Method Suppliers
  • Likely to stay fragmented for some time
  • Underlying technologies still evolving
  • Different tools for different domains
  • Many tools still maturing
  • Benefits from integration/automation are massive
  • Open architecture/exchange format key
  • Be realistic about how much of this market you
    can truly serve
  • New roles drive new tools and methods

17
Opportunities for New Entrants
  • Software only
  • Entry barriers reduced, smaller entrants possible
  • Standard OS, architectures sell to multiple
    customers
  • Disinterested System Integrator
  • Outsourcing at lower levels of V
  • Off-board/Cloud Computing
  • New Tools and Methods
  • Virtualization
  • Automation
  • Integration

18
Summary
  • Exciting times!
  • Challenges have never been greater
  • Some distinct changes in future
  • Super-integration
  • Separation of SW from HW sourcing
  • Rise of Architect and Systems Integrator
  • Model Based approaches essential

19
Summary (cont)
  • Both threats and opportunities
  • For existing players
  • For new entrants
  • Virtualization one of the key themes
  • Speed, Efficiency
  • Management of complexity
  • Game changer new entrants

20
Thank you!Questions?
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