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RAMLAB

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Title: RAMLAB


1


2
APEX Center - Overview
  • Like the art of mountaineering, Semiconductor
    Technology is a very practically oriented science
    with very high peaks that few can scale
  • Working professionals in industry are at
    different levels of height in terms of expertise
  • High-end expertise is to be found only in very
    small pockets within the industry and academia
    across the globe
  • Due to fast pace of innovation, Industry and
    Academia need to come closely together for
    pursuing Applied Research
  • At BITS-RIT APEX Center, we will attempt to bring
    together top experts from industry and academia
    to help the working professionals attain global
    heights in professional excellence
  • Applied research will be a key focus through
    close collaboration with industry and top
    academic institutions

Birla Institute of Technology Science Pilani,
Rajasthan
3
Goals
  • Applied Research
  • PhD Program for working professional full
    time students
  • Projects sponsored by Indian US
    semiconductor Industry
  • Active research collaboration between RIT
    BITS faculty
  • Exchange of researchers between RIT BITS
  • Education
  • Short Courses to meet specific industry needs
  • Structural Masters degree program

Birla Institute of Technology Science Pilani,
Rajasthan
4
Program for Professional Excellence
  • A world-class education, training, and hands-on
    program offered in Bangalore
  • To upgrade skills of VLSI professionals and
    managers to the world-class level
  • Offered by the best faculty members and industry
    professionals from India and across the world
  • OLAB extension will be set up at the center in
    Bangalore with state-of-the-art EDA tools
  • Offered to professionals from Center Affiliates
    companies
  • The program will consist of multiple courses and
    access to OLAB
  • Each course will be a complete unit in itself
    with appropriate credits awarded from BITS -
    Pilani
  • Accumulation of enough credits and completion of
    a thesis will entitle for a masters degree from
    BITS
  • Will be taught by some of the best faculty and
    Industry professionals from India and abroad

Birla Institute of Technology Science Pilani,
Rajasthan
5
BITS-RIT Collaboration
  • BITS will take ownership in setting up the
    center, the labs, the equipment and the
    management responsibilities for the center. All
    investments towards this will come from BITS
  • BITS will also drive the Professional Excellence
    Program with involvement from faculty from RIT as
    well as from across the world
  • Award of degrees / certificates for Professional
    Excellence programs will be managed by BITS
  • RIT will play the lead role in Applied Research,
    particularly in the area of RF, Analog and Mixed
    Signal Design with involvement from BITS faculty
    and others in Industry
  • Prof. P. R. Mukund, Director RAMLAB at RIT will
    be visiting Bangalore often to supervise the
    research programs.
  • At least one or more research associates from
    RAMLAB of RIT will be located in Bangalore to
    carry on with the applied research work.
  • PhD degrees may be awarded by RIT and BITS
    jointly or separately depending on the nature of
    association of the lead researchers
  • BITS and RIT will jointly promote the center

Birla Institute of Technology Science Pilani,
Rajasthan
6
Course Structure
  • Each course will normally be about 20-30 people
    and will have a tuition fee of about INR 10K
    30K per course per student (including access to
    OLAB as well)
  • These courses will be offered as
  • intensive courses (10 to 30 hours of teaching
    over a period of one, two or three weeks), or
  • over a semester

Birla Institute of Technology Science Pilani,
Rajasthan
7
Corporate Sponsors
  • Each interested company will become a Corporate
    Sponsor for the Center with an annual fee of INR
    75K INR 200K based on their employee strength
  • Corporate Sponsors will also be able to provide
    input on courses offered and choice of faculty
    members
  • Corporate Sponsors will ensure that the Center
    remains world class and dynamic
  • Annual Corporate Sponsorship Fee
  • Employee Strength lt 50 INR 75K
  • Employee Strength 50-100 INR 125K
  • Employee Strength gt 100 INR 200K

Birla Institute of Technology Science Pilani,
Rajasthan
8
Corporate Sponsorship Benefits
  • Professionals from Sponsor Companies will be
    given preference in enrollment in these courses
  • Representatives from sponsor Companies will be
    invited to be a member of the Technical Advisory
    Board to guide the Center to meet their specific
    needs and the needs of Indian Semiconductor
    Industry.
  • Professionals from their companies would be able
    to enroll for an M. Eng. Degree from BITS and
    credit these courses towards their degree
    program.
  • Resources of the center will be extended for
    research and development including supervision
    for Ph.D. programs. Corporate Sponsor will be
    able to directly benefit from this activity.

Birla Institute of Technology Science Pilani,
Rajasthan
9
Suggested List of Courses
VLSI Technology and Systems VLSI Technology and Systems VLSI Technology and Systems
Foundation Courses Hours Lab
Introduction to VLSI Technology 18 No
Fundamentals of ASIC design 30 Yes
Digital Design using Verilog 30 Yes
Design for Test 30 Yes
FPGA Design with Xilinx 30 Yes
Integrated Circuit Packaging 15 No
Principles of Logic Synthesis 30 Yes
Custom Layout of Integrated Circuits 30 Yes
Birla Institute of Technology Science Pilani,
Rajasthan
10
Suggested List of Courses
VLSI Technology and Systems VLSI Technology and Systems VLSI Technology and Systems
Advanced Courses Hours Lab
Phase-Locked Loop Systems and Clock Gen Circuits 15 Yes
Signal Integrity Analysis for Integrated Circuit Interfacing 15 Yes
Advanced ASIC Physical Design 30 Yes
Advanced Static Timing Analysis 15 Yes
Circuit Modeling and Simulation 15 No
Advanced HDL Coding Techniques 15 Yes
RF Design 30 Yes
Low Power Design Techniques 15 No
Design of System Level Test Benches 15 Yes
Birla Institute of Technology Science Pilani,
Rajasthan
11
Suggested List of Courses
VLSI Technology and Systems VLSI Technology and Systems VLSI Technology and Systems
Programming Hours Lab
Perl Scripting for Electronic Design Automation 30 Yes
Embedded Systems, DSP and misc. hardware engineering    
Real-Time Programming and Embedded Systems Design 30 Yes
Embedded and Real-Time Linux 30 Yes
Practical Digital Signal Processing 30 Yes
Birla Institute of Technology Science Pilani,
Rajasthan
12
Other Possible Courses
  • In addition to the courses on VLSI, the scope may
    be expanded to offer additional practice oriented
    courses relevant for Industry
  • Few Practitioners Courses identified
  • Software Testing
  • Technical Writing
  • Embedded SW development
  • Bio-Technology

Birla Institute of Technology Science Pilani,
Rajasthan
13
Value Proposition for Professionals
  • Never before opportunity to enrich knowledge and
    expertise where it matters
  • Learn from best in class experts from all over
    the world, right here
  • Opportunity for people not having a Masters
    degree to earn one through part-time route
  • Opportunity for pursuing research through PhD
    enrollments, while working
  • A stronger alternative to distance learning
    options available from US based universities

Birla Institute of Technology Science Pilani,
Rajasthan
14
Value Proposition for Industry
  • Move up the value chain through skills and
    expertise gained
  • Possible avenue for better employee retention
  • Compelling cost structure to try new ideas
  • Excellent design infrastructure
  • Instant access to university expertise on
    fundamental knowledge

Birla Institute of Technology Science Pilani,
Rajasthan
15
Value Proposition for Faculty
  • Chance to contribute to Indias success
    especially for NRI industry professionals
    professors coming from overseas
  • Chance for strategic relationship with Indian
    University system
  • Joint research programs with BITS and working
    professionals from industry in India
  • Better understanding of the emerging markets
  • Opportunity for fulfilling the passion for
    teaching
  • World class remuneration

Birla Institute of Technology Science Pilani,
Rajasthan
16
Value Proposition for Academia
  • Through continuous interaction and help from the
    top experts participating in BITS-RIT APEX
    programs, academic curriculums at the University
    will be constantly enhanced to keep pace with the
    latest
  • Some of the courses offered at BITS-RIT APEX
    center will be beamed remotely to the university
    campuses through video conferencing with an
    option for the students at the campus to enroll
    against credits. BITS may consider extending such
    facilities to other interested universities as
    well at a future date
  • Plan to fund fundamental and applied research at
    the university with the resources generated at
    the BITS-RIT APEX center
  • Chance to contribute to growth of Indias
    semiconductor industry by facilitating high end
    talent generation and applied research programs

Birla Institute of Technology Science Pilani,
Rajasthan
17

BITS - Pilani
OLAB (Oysters Lab) VLSI DESIGN LABORATORY
Integrated efforts of BITS,
BITS Alumni and Industry
Professionals
Birla Institute of Technology Science Pilani,
Rajasthan
18
OLAB at BITS, Pilani
19
  • OLAB - Industry Sponsors

Open Silicon
Mentor Graphics
CADENCE
SUN Microsystems
WIPRO
20
  • OLAB FACILITIES

21
  • A powerful centralized compute server farm for
    EDA tools in Layer 1
  • Sun Fire v250, NAS 3300 SDLT320
  • Sun Ray software
  • EDA tools user files
  • Automatic tape back-up

22
  • Number of powerful SUNSPARC workstations as
    compute servers in layer 2
  • 20 Ultra 2 Enterprise server-class workstations
  • Computing share through Sun Grid Engine
  • 40 SUN THIN Clients as nodes in layer 3.
  • Connected with 1.0 Gbps network connectivity

23
  • Tool Suite from MAGMA
  • (About 15 sets of licenses of back-end design
    tools for mixed signal and a complete package for
    RTL to GDS flow)
  • Tool Suite From CADENCE
  • Foundry access for fabrication of parts
  • FPGA design infrastructure for prototyping

24
  • OLAB ACTIVITIES
  • Students of M.E. Microelectronics for
    conducting
  • laboratory sessions
  • Students of First Degree Programme for courses
  • in the area of VLSI Design
  • To Facilitate Research activities
  • To conduct short term courses for Industry
  • Professionals
  • To support entrepreneurs in Technology
  • Development
  • To undertake Industry Sponsored Projects

25
A Sample list Dissertation projects
  • Design of CISC Microprocessor ( M68010
    compatible)
  • Design of Application Specific Instruction set
    Processor
  • for text to speech conversion
  • Design of A/D and D/A converters
  • Design of switched capacitor circuits
  • Design of a CAD tool for synthesis of OPAMPs

26
Currently a Project on ZigBeeenabled wireless
sensor network is taken up with joint efforts of
faculty, students and BITS Alumni.
27
Sensor/Slave module
Master/Controller module
Processors and wireless transceivers are the same
for both the master and slave modules.
Sensor/Slave module
WIRELESS MESHED SENSOR NETWORK ARCHITECTURE
28
OLAB will support a full chip design capability
at BITS through state-of-the-art EDA tools
29
RF/Analog/Mixed Signal Lab (RAMLAB)
RF/Analog/Mixed signal Laboratory (RAMLAB)
Dept. of Electrical Engineering Building 9, 3rd
Floor, Room 3271 Rochester Institute of
Technology Rochester, NY 14623
30
RAMLAB - Overview
RAMLAB specializes in developing cutting edge
design solutions for RF, analog and mixed signal
circuits
People Research Faculty Graduate
Students Distinguished Researcher
Technology Used 0.25 um TSMC CMOS 0.25 um IBM
CMOS
Equipment Unix Workstations with Cadence
Suite ATE with probe station, spectrum analyzer
Network Analyzer for RF Characterization
Industry Liaisons
Ph.D. Students Anand Gopalan Sripriya
Bandi Tejasvi Das
Sharmila Sridharan Mark Pude Jeff Lillie
31
RAMLAB - Current Projects
  • Chip-Package Co-Design Of RF-Mixed signal
    Microsystems
  • Built in Self Test Strategies for RF/Mixed Signal
    Systems
  • High-speed circuit design and Characterization
  • Mixed-Signal IC Design beyond 10 GHz

32
Work with Harris Corporation
Collaboration with Harris Corporation
Tunable Wideband LNA Design
RF Front end circuitry is designed to be either
only narrowband or wideband. For military
applications wherein frequency hopping is popular
for secure communications, the above mentioned
circuitry is not suitable. Objective design
tunable RF LNA with very wide frequency range and
very fine selectivity
LNA Schematic
Simulation Results
Simulation results summary
Noise Figure v/s frequency
Input return loss S11 v/s frequency
LNA was fabricated on a 10mm2 Chip using IBMs
0.25um CMOS RF 6-metal layer process
33
Chip-Package Co-Design of RF Microsystems
Chip-Package Co-Design
  • Convert intricate analysis into a set of simple
  • design rules that can be used by the designer
  • Make trade-off analysis simpler
  • Make intricate problems opaque
  • to the designer
  • First Time Right
  • Lower time to market

Research Objectives
To analyze different functional blocks in a RF
microsystem, in the 2-5GHz range for Chip-Package
Co-Design, and develop a software package that
performs early analysis of various functional
blocks
Accomplishments
  • Integrated Passive Design
  • Embedded Inductor on Si Substrates
  • Developed Inductor Library for Embedded Process
  • Development of Design Rules Methodologies
  • Design constraints of ESD protection circuitry
  • Vertically Integrated Designs Developed
  • Early Design Software Developed for Chip-Package
    Co-Design DREAM
  • Suited for Early Design
  • Applications are diverse including RF, Mixed
    Signal, Digital and Power Distribution
  • Circuit Components Designed and Fabricated using
    IBMs 0.25um CMOS
  • Low Noise Amplifier
  • Single Balanced Mixer
  • Low Phase Noise VCO

G. Nayak, P.R. Mukund, Chip-Package Co-Design of
a Heterogeneously Integrated 2.45GHz CMOS VCO
using embedded passives in a silicon package,
17th International Conference on VLSI Design and
3rd International Conference on Embedded Systems,
Mumbai, India, January 2004
34
DREAM Digital-RF Early Analysis Methodology
Design Methodologies
Passive Characterization
Inductor Library
Novel Design Techniques
Inductor Libraries for RF Design
Inductor Modeling and Characterization
Vertically Integrated Designs (Si on Si)
35
Application Specific Reduced Order Modeling
Technique
Proposed SiP Design Methodology
S-parameters comparison with and without package
parasitics
Model Reduction for power pin
Model Reduction for signal pin
Equivalent circuit model for ground pin
G. Nayak, C. Washburn, P.R. Mukund, System in a
Package Design of a RF Front End System using
Application Specific Reduced Order Models
,Accepted at the 18th International Conference
on VLSI Design and 4th International Conference
on Embedded Systems, Calcutta, India, January
2005
36
Built-In-Self Test (BiST) for RF systems
37
Motivation RF Testing Challenges
38
Current sensor for GHz applications
  • Requirements of a sensor
  • High Bandwidth
  • Low Sensitivity to process variations
  • High Dynamic Range
  • High Sensitivity

Stage 1 Sensing Resistor (Rs)
Source Follower Stage 2 Inverting
Amplifier Stage 3 Current Amplifying Cell
  • DESIGN FEATURES
  • Sensing Resistor 7 O
  • Feedback structure
  • Reduction in number of Gain Stages
  • Addition of bypass capacitor

39
BiST for LNA, Mixer, VCO
  • Low real estate and power overheads!!
  • Similar techniques can be used to quantify
  • Output Match (S22), Gain (S21), and Linearity
    (1dB compression) of LNA
  • Entire self-test can be carried out in less than
    20µs.

1.9GHz LNA and BIST circuit fabricated in IBM
0.25 micron
40
Self-Calibrating RF circuits
  • Wide tolerance ranges of package parasitics
  • Dependence of E.S.D. protection on

  • environmental conditions
  • Package portability
  • Design time and cost

Hence, a circuit topology that dynamically
self-corrects its performance in the presence of
process faults and package parasitics is desired!
41
Self-Calibration Methodology
  • Robust -gt Two-tonal approach
  • Cuts down design cycle cost and time
  • Low overheads
  • Self-correction on-the-fly
  • Non-intrusive current sensing
  • Baseband processing

42
Self-Calibration Results
43
LSI Logic High-speed circuit design and
Characterization
  • Collaborative effort with LSI for device
    characterization in high-speed circuits.
  • Current empirical models require that every
    device size used in design has to be fabricated
    and the data curve-fitted.
  • Model scalability with respect to both device
    size and technology is required.
  • 0.18um, 0.13um, 90nm 65nm foundry and data
    access from LSI

44
Kawasaki Mixed-Signal IC Design beyond 10 GHz
  • 3-year project begins May 2005
  • Switching noise dependencies on logic activity
    and packaging
  • High speed clock distribution in a large chip
  • Simultaneous switching outputs and containment
    strategies
  • Analog and digital isolation in a SoC design
  • Circuit techniques to monitor core noise

45
  • Thank You

Birla Institute of Technology Science Pilani,
Rajasthan
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