International Master of Science Program in System-on-Chip (SoC) Design at KTH SoC Masters - PowerPoint PPT Presentation

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International Master of Science Program in System-on-Chip (SoC) Design at KTH SoC Masters

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in System-on-Chip (SoC) Design at KTH SoC Masters Axel Jantsch Royal Institute of Technology Electronic System Design Laboratory Email:axel_at_ele.kth.se – PowerPoint PPT presentation

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Title: International Master of Science Program in System-on-Chip (SoC) Design at KTH SoC Masters


1
International Master of Science Program in
System-on-Chip (SoC) Design at KTHSoC Masters
  • Axel Jantsch
  • Royal Institute of Technology
  • Electronic System Design Laboratory
  • Emailaxel_at_ele.kth.se

2
Background
3
The challenge
4
The challenge example
  • In year 2005 our students are launching a design
    project for I-Phone with the following
    properties
  • Single chip phone, PDA, TV, mini-DVD recorder,
    GPS, and medical monitoring device inttegrated to
    a compact handheld device
  • On-chip RF (Bluetooth, GSM, W-CDMA and local 4th
    generation wideband), optical I/F to home theater
    system
  • Clock internally at 2.8 GHz, externally 820 MHz,
    300 MHz JTAG
  • 135 million gates, 256Mb embedded RAM (of which
    144 Mb used by 3-D engine mainly for textures)
  • Single 1.5 V battery (AAA), 1 month standby, 4
    hour DVD, 24 h web, 2 day phone
  • Full user and location awareness, build-in
    software agents for user adaptation and network
    adaptation (cognitive radio)
  • 4 Terabit all-electronic harddisk
  • What are the open issues?
  • System noise budgets (even for digital parts)
  • System interference of its own analog and RF
    functionality deep submicron effects
  • Specification and design of functionality and
    performance characteristics
  • Verfication
  • Globalisation of the product design and
    industrial activities with multi-cultural and
    geographically distributed teams

5
System-on-Chip int. M.Sc. program SoC Masters
www.ele.kth.se/SoC/
6
Three Lines of Courses
  • Group A Design of heterogeneous SoC
    architectures containing custom hardware, digital
    signal processors (DSP), microprocessors, and
    embedded software.
  • Group B Physical integration and implementation
    of heterogeneous blocks such as hardware, analog
    interfaces while optimizing power consumption,
    performance, cost, and noise.
  • Group C SoC design methodology issues such as
    specification and validation, integrating the
    separate design flows for tightly coupled
    hardware and software development and supporting
    CAD tools.

7
Courses
  • Course Credit units Quarter
  • Hardware modeling (C) 4 1
  • Embedded systems (A) 5 1
  • Digital circuit design (B) 5 1-2
  • Digital hardware organization (A) 4 2
  • Design of fault-tolerant systems (A) 4 2
  • SoC Architectures (A) 4 2
  • Digital systems engineering (B) 5 3
  • Design documentation IPR issues (C) 4 3
  • Anatomy of CAD tools for electronic
  • design automation (C) 5 3

8
Courses
  • System modeling (C) 5 3
  • Electronic system packaging (B) 5 4
  • Radio electronics (B) 5 4
  • Low power analog
  • mixed signal ICs (B) 5 4
  • System ASIC design (A) 5 4
  • Special topics in SoC (C) 4 4
  • Master's thesis (2nd year) (A-B-C) 20 1-2
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