CSP???????????? ????? Board Level Reliability of Chip Scale Package Under Cyclic Thermomechanical Loading

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CSP?????????????????Board Level Reliability of
Chip Scale Package Under Cyclic Thermomechanical
Loading

• Yeong-Jyh Lin
• Department of Mechanical Engineering
• National Cheng Kung University
• Tainan, Taiwan
• June 15, 2000

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????

• CSP????
• ?????
• ?????????
• ???????????
• ??????????
• ??

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CSP????

• ????????(Footprint)????(Die)?1.2?
• ?????????
• Flex Circuit Interposer
• Rigid Substrate Interposer
• Lead Frame (Lead-on-Chip)
• Wafer Level Assembly

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???CSP??

• ????SOC(Substrate On Chip)??

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?????

• ??????
• ????????????????????
• ???????
• ??????
• ????
• ?????

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??????????

• ?????
• Thermal Cycling Test??TCT
• ??????????????
• ?????
• Thermal Shock Test??TST
• Pressure Cooler Test(PCA)
• ?????

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????????
8
????

• ??????????????
• ?100??????????????
• ?????,????????
• ????????????
• ?????????????

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????????????

• ??????
• ??????????
• ?????????????
• ??????
• ??????(Fatigue Model)????????

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????

• ?????????????????,???????,???????
• ????????????????
• ????????
• ??????,???????

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??????

• ??????????,?????(Viscoplastic)?????
• ????ANSYS??Rate-Dependent Plasticity
• ??Anands Model???????

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Anands Model

• ?ANSYS??
• ???9?????
• ????????????

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????

• ?????,????????
• ???????
• ???????????????
• ??????????????(Ideal Adhesion)
• ???????,??????????

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????

• ??2-D??

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????(continue)

• ??3-D??

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????

• ????,???????????

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????(continue)

• ???????

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????

• ????25????235?
• ??????????????
• ??????????

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3-D??????
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?????

• Shadow Moirè ???????(????)

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?????

• ????????????
• ?5min??-65????150 ?
• ??????150???15min
• ?????6min???-65?
• ?????-65???15min
• ??Anands Model????????
• ??8?TCT??

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??????

• 2???

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????

• ????????????
• ??
• ????
• ????
• ????
• ??
• ????????????????

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?????????????

• Modified Coffin-Manson (Engelmaier)
• ???????????

total number of cycles to failure (63.5 )
plastic shear strain
fatigue ductility coefficient (0.65)
mean cyclic solder joint temperature in ? (42.5)
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???????????

• 2-D?3-D??????
• ?????

crack propagation rate
number of cycles to crack initiation
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?????????

• 2???

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????????

• ??????????????

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????????(continue)

• ??2??3??????

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?????????

• ??1??????????

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?????????(continue)

• ??1??????????

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?????????
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?????

• ??????????
• ?????????(Fatigue Model)???
• ????????????
• ??????(Fatigue Model)??????????

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?????

• 2-D
• ?????????????
• ??????????Fatigue Model
• 3-D
• ?????Package??????????
• Modify Coffin-Manson Equation

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???????????
??? (Cycles) ???? (hr) ??? (Cycles) ?? ()
2-D 592 6(8??) 650 8
3-D 438 72(1??) 401 9
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??

• ????????????

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??(continue)

• ????
• 2-D???????????????
• 3-D?????????????
• ?????
• 2-D?????????????????
• 3-D??????????,??????????
• ?????????????