Report from Module Bonding Working Group

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Report fromModule BondingWorking Group

• Salvatore Costa
• Università di Catania and INFN Sezione di
  Catania

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Outline

1. Global info on production bonding of the Modules
2. Global review of Module bonding quality
   indicators
3. Open issues
4. Selected highlights from individual Center
   reports

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Global review of Module bonding qualitythat
is, Module Pull Test results
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Modules Pull Tested
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Mean pull forces
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Mean pull forces
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StDev/Mean of pull forces
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StDev/Mean of pull forces
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Open issues
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Hybrid-related issues

• Bonding problems on PA encountered while bonding
  APVs to PA in some TIB hybrids mentioned by
  Alan/Gabriella
• Display additional warning in Pre-bonding section
  of DB Interface
• Faulty hybrids, with intermittent FHIT errors,
  erroneously sent to CERN from HAS, then to Gantry
  Centers and some already built into modules.
  mentioned by Gabriella
• All Gantry and Bonding/Testing Centers alerted
• I plan to generate from DB and distribute
  affected Module list

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ModProd DB Browser Tool

• At Gian Marios request, non-prod quality objects
  (modules, sensors, hybrids) now excluded

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Jigs for TEC Module bonding
We are continuing to monitor the preparation of
attidional jigs for Center backup in TEC. This
is a table already showed at last Meeting, but
with updates added yesterday.
TEC Center Module Types to bond ( Mod) Who made jigs ( jigs) Backup center for this Rings Modules Who makes additional jigs ( jigs)
Aachen R6 Aachen (1) R3,R5p,R5s Aachen (2)
Hamburg R1p,R1s, R3 Hamburg (2/2/2) R7 Hamburg (2) Told Didier they can make jigs for other centers
Karlsruhe R5p,R5 R3 in preparation
Strasbourg R7 Strasbourg (1) R6 Karlsruhe (1)
Vienna R2p,R2s Vienna (1) Not decided yet Not decided yet Can make R2 jigs for other centers
Zurich R4 (1100) Karl./Zurich (2) R6, R7? Karl./Zurich (11) Has R7 jig on loan from Strasbourg
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Selected highlights fromindividual Center
Reports
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Catania new facilities

• New bonding machine Delvotec 6400 (100 kHz)
• Since March 8th
• Oldest of 2 Hughes dismissed
• Now in clean room Delvotec, newest of 2 Hughes
• Bonding times down
• TIB34 8 10 vs. 45 x
• TIB12 12 15 vs. 65 x
• Backs 15 vs. 1 x
• Reliability improved
• Machine failure rate negligible
• Bonding failures negligible
• PHL- (DEAD) channels none so far
• Experience
• 45 modules bonded w/ new machine
• Programs for all module types ready TIB34,
  TIB12, TIB12sl, TIB12sr (back/front/pulltest/after
  _pulltest)
• Usable bonding parameters window narrower than in
  Hughes
• Best Pull forces achieved 10g

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Catanias Delvotec 6400
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Other Centers highlights

• FNAL Last 2 weeks found problems related to
  excessive flex of PA ends. Had to ask assemblers
  to move glue points. This helped but not yet
  satisfactory.
• Firenze In some latest TIB modules dirty area of
  PA near end (but not at end) made bond difficult
  there.
• Padova Uploaded pull test data after shipping
  modules to Pisa ? usual DB problem pull test
  appears performed in Pisa
• recommendation upload all of your data before
  shipping modules to another center
• Torino Due to share with Alice had to change
  Delvotecs U/S frequency from 100 to 60 kHz. New
  parameters. Similar performance.
• Vienna Bonded 25 modules with new Delvotec 6400
  (140 kHz). Pull forces were marginally better
  than 100kHz. Observes whiskers on 2nd bond (on
  PA).
• Zurich Machines now equipped with additional USB
  camera ( PC) to ease the strain of looking all
  the time through microscope during bonding. Model
  details available.