Hspice PowerPoint PPT Presentations

A signal integrity simulation platform by Agilent Technology The best simulation tool to create correlated s-parameter model High Speed Design Center * * Title:

Title: HSPICE model Author: ivan Last modified by: ivan Created Date: 7/18/2006 12:13:29 AM Document presentation format: Company: ivan

Title: HSPICE Author: Terence Shieh Last modified by: Terence Created Date: 12/29/1997 6:17:52 AM Document presentation format: A4 (210x297 )

How To Use HSpice Dr. Mark C ... please see http://cobweb.ecn.purdue.edu/~mcjohnso/cae_tools/Cygwin.html To access documentation from an account that is setup ...

PARAM Tain=58 .param trans_pt=trans_pt_low. ... ad=0 pd=0 as=788 ps=732. m1002 GND ain t1 GND nch w=Tain l=2 ad=0 pd=0 as=0 ps=0 ...

HSPICE Highlights and Introductions

IBIS buffers. HSPICE for SI. 3. Good Practices. Modularize with sub-circuits and/or libraries! ... This too could be more complicated transistor or IBIS circuit. ...

Demonstrate alternative HSPICE behavioral simulation methods. ... Start with 'testckt' file from pervious class. MYBUFF will be our new generator ...

... (worst case) Impedance Impedance Deviation Insertion Loss Pair-to-Pair Skew Jitter Return Loss MDNEXT other HSPICE(?)

David_Harris@hmc.edu 2/2/03 * Find the response of RC circuit to rising input ... (1) run a bunch of sims with different P size (2) let HSPICE optimizer do it for us ...

Critical Path. 8 Clock Cycles original. 4 clock cycles now for Registers. Flow through large mux ... New Hspice Results. M2: Team Paradigm. LVS'ed Components ...

Created from the Health Sciences Partnerships in Interprofessional Clinical Education (HSPICE) ... activities are creating new opportunities for collaboration ...

... MCP, and summed in the anode ... into an HSPICE simulation of the summing anode ... With this anode a resolution of around 10 to 20 picoseconds could be ...

Electrical Engineering and Computer Science. University of Michigan ... Electrical Engineering and Computer Science. OBD HSPICE Model. Post-breakdown leakage modeling ...

Don't bother making the symbol shape pretty because Cadence will crash. ... Cadence will put the netlist in CELLNAME/ hspiceS/extracted/netlist/hspiceFinal ...

Add these lines at the end of the file. source /usr/usc/hspice/default/setup.csh ... Setup aludra Account (cont) Logout of your Xwin session. Log on again using Xwin ...

The MOS-AK aims to encourage interaction and sharing of all ... SIMetrix, SmartSpice, Smash, Spice-Opus, Spectre, Star-HSpice, Synopsis, Spice3, WinSpice. ...

... functional (Verilog) simulation of the system as a whole, logic (Verilog or ... Can choose Verilog or Hspice as appropriate. Raymond Ciarcia. ESE 570, Spring 2004 ...

Title: Computer-Aided Verification of Electronic Circuits and Systems Author: Vincent H. Peng Last modified by: CK Created Date: 6/21/2002 11:00:00 PM

CLOCK DISTRIBUTION Shobha Vasudevan The clock distribution problem Large Chip Area Different flop densities Non-uniform distribution of flops All flops need to get ...

Modeling flow and models improvement for I3T ON Semiconductor technologies Petr Betak, Petr Zavrel, Lenka Sochova, Jan Plojhar

Crosstalk Calculation and SLEM Topics Crosstalk and Impedance Superposition Examples SLEM Cross Talk and Impedance Impedance is an electromagnetic parameter and is ...

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The insertion loss of each pair of the CX4 cable assembly shall be less than: ... This includes the attenuation of the differential cabling pairs, and the connector ...

2 test benches for each set of parameters at 27 and 150 C: ... Ic vs. Vce characteristic at Ib=cst. The comparisons are made with Device, Pr. ...

... to 0 Optimization Rules ... Design rules established to reduce noise EE 201A Modeling and Optimization for VLSI Layout Jeff Wong and Dan ...

to FIND an optimum design for this LMC within given constraints such that a ... The read-out chip is a custom designed ASIC by the Microelectronics Group at CERN ...

... High Speed Switch Fabric IC. Overall Architecture. Features ... Data are encapsulated in switching packets across the fabric. Switching packet size is 64 bytes ...

Title: PowerPoint Presentation Author: David Harris Last modified by: Harris Created Date: 12/29/2003 3:13:39 AM Document presentation format: On-screen Show

Title: On applicability of Universal Logic Gates for Designing Masked Programmable Gate Array Architectures Author: KIM Last modified by: w1637917a

e-mail: petrenko@cad.kiev.ua ...

An Active Glitch Elimination Technique for FPGAs by Julien Lamoureux, Guy Lemieux, and Steven J.E. Wilton

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CMC Model QA and Release Subcommittee Meeting Rob Jones

HICUM users meeting in Monterey. September 2002. 11/14/09. Sophie ... of parameters, one with self heating. 3 test benches for each set of parameters at 27 and ...

... the Tyco Electronics Elastomeric Technologies product Tyco Electronics Elastomeric Technologies product line has created a mat material having .063mm line has ...

OPTIMAL ELECTRONIC CIRCUITS and. MICROSYSTEMS NETWORKED DESIGNER. Prof. ANATOLY ... versions of this system (named SPARS, PRAM-01, PRAM-PK, PRANS for EC and SM ...

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Impedance is an electromagnetic parameter and is therefore effected by the ... Excite the coupled simulation in the desired state and back calculate the ...

Multilingual approach is limited in practice to package/interconnect or the buffer, not both ... package or die interconnect model together with multilingual ...

Capacitive coupling between on-chip wires is becoming more significant! Wire spacing is shrinking. Wire height is not shrinking ...

Passive Distortion Compensation for Package Level Interconnect Chung-Kuan Cheng UC San Diego Dongsheng Ma & Janet Wang Univ. of Arizona

File names will be in italics, e.g. /ccs/issl/micro/users/tan/myfile.vhd ... Copy the entire directory /ccs/issl/micro/users/tan/tutorials/design_flow into ...

reciprocal current regulation. proposal. Schematic of a bias circuit with analytic model ... error of the reciprocal charge-discharge current variation ...

Title: voor dia serie SNS-Utrecth/'t Gooi Author: Carla Otten Last modified by: system Created Date: 4/19/1995 10:16:14 AM Document presentation format

Title: Author: darry wang Last modified by: Hung-Yu Li Created Date: 2/9/1997 1:12:19 AM Document presentation format: A4 (210x297 mm)

Performance and Variability Driven Guidelines for BEOL Layout Decomposition with LELE Double Patterning. MOTIVATION. BIMODALITY IN DPL. RC VARIATION ANALYSIS

Title: PSpice using for Analog ASIC Design Author: Jovanovic All Last modified by: Jovanovic All Created Date: 12/4/2003 6:54:53 PM Document presentation format

LokWon Kim UCLA EE Ph.D. student Based on Anand Rajaram, Jiang Hu, and Rabi Mahapatra Dept. of Electrical Engineering Dept. of Computer Science

Title: TestBencher Pro Author: Dan Notestein Last modified by: oka Created Date: 6/19/2000 4:49:47 PM Document presentation format:

Passive Distortion Compensation for Package Level Interconnect Chung-Kuan Cheng UC San Diego Dongsheng Ma & Janet Wang Univ. of Arizona

Develop nanoelectronics to extend performance limits of electron device technologies ... Agilent 8510 Network Analyzer. Single sweep 0.045 - 110 GHz ...

High Performance Interconnect and Packaging Chung-Kuan Cheng CSE Department UC San Diego ckcheng@ucsd.edu

Introduction to CMOS VLSI Design Lecture 7: SPICE Simulation David Harris Harvey Mudd College Spring 2004 Outline Introduction to SPICE DC Analysis Transient Analysis ...

LEMap: Controlling Leakage in Large Chip-multiprocessor Caches via Profile-guided Virtual Address Translation Jugash Chandarlapati Mainak Chaudhuri