When it comes to reducing the manufacturing cost of a PCB, it is important to remember that a significant part of the cost of a PCB assembly is already baked in at the design concept stage. The product concept defines the PCB size and shape, while the performance of the system dictates the microprocessor, memory and other functional elements of the circuit.
HDI stands for High Density Interconnect. HDI PCBs have finer traces and trace spacing, laser drilled micro vias and higher connection pad density. Its two chief advantages are that it permits the use of fine pitch BGAs and it reduces the number of PCB layers required because the finer traces and smaller vias allow more circuitry in a smaller area.
No company can excel at every aspect of new product development and trying to do everything can dilute an organization’s focus on the tasks that are essential to its success. For example, most companies have long ago outsourced the PCB design and fabrication steps of new product development. This same need to focus on the essential is true of software development too.