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Low Power and Reliable Sensor NODE DesigN

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Energy is typically more limited in sensor networks than ... Oscilloscope. Power Supply. FPGA Board. for Development & Testing. Chip Test. Board(Interconnection ... – PowerPoint PPT presentation

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Title: Low Power and Reliable Sensor NODE DesigN


1
Low Power and Reliable Sensor NODE DesigN
  • Baeg, Sanghyeon
  • Reliable high Speed Computing Lab.
  • Hanyang University

2
Introduction
3
Sensor Nodes
4
Components of Sensor node
External Memory
Sensors
Micro Controller
Communication device
Power Source
5
Why low power ? (1/2)
  • Energy is typically more limited in sensor
    networks than in other wireless networks because
    of the nature of the sensing devices and the
    difficulty in recharging their power sources.
  • Power consumption in the sensor node is for the
    Sensing, Communication and Data Processing.
  • Ex) monitoring or at detecting phenomena.
    Examples include office building environment
    control, wild-life habitat monitoring, etc.

6
Why low power ? (1/2)
  • More energy is typically required for data
    communication in sensor node. Energy expenditure
    is less for sensing and data processing.
  • The energy cost of transmitting 1 Kb a distance
    of 100 m is approximately the same as that for
    the executing 3 million instructions by 100
    million instructions per second/W processor

7
Why reliability ? (1/2)
  • IC should perform in accordance with expectations
    for a predetermined period.
  • Sudden death of sensor nodes cost replacing and
    management efforts.
  • Sensor nodes are typically exposed to extreme
    environmental situations such as temperature
    changes, weathers, animals.

8
Why reliability ? (2/2)
  • Mission critical sensor nodes needs high
    probability of surviving through
    self-guarding/diagnosis features.

9
Memory Low Power
  • Power reduction for memories used in sensor
    network

10
Memory Reliability
  • Research for cross talks in memory cells
  • Increasing memory density and decreasing
    technology geometry
  • ? Increasing capacitive cross talks
  • Reduced reliability because of additional power
    consumption and noise paths
  • ? Becomes the source of intermittent failure
  • Crosstalk in marginal size is not detected by
    normal test
  • ? Increasing costs for test
  • Test method using negative voltage stress
  • ? Testable method with low cost

11
Communication Interconnect
  • Analysis for High-speed Interface Issues

12
Interface I/O Design
  • Chip Schematic Test Result

13
low power micro processor
  • Micro Processor(8051) as underlying uP
  • Implement Processor in FPGA as initial stage with
    reduced instruction for power saving

14
Custom IP Implementation
  • Customized IP Design is beneficial in low power
    design by reducing unnecessary capacitance in
    design.

15
Design and Test Environment
  • Equipment for development and testing
  • Logic Analyzer
  • Function Generator
  • BER Tester
  • Oscilloscope
  • Power Supply
  • FPGA Board
  • for Development
  • Testing

16
Chip and Board design Examples
  • Chip Test
  • Board(Interconnection
  • Testing Board)
  • Memory Test Board

17
Summary
  • In the second year of sensor hardware nodes
  • Focused on development in low power and reliable
    sensor node system
  • Currently focusing on IP development
  • Will be moving to FPGA system development
  • Eventually, single chip solution

18
  • Thanks
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