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TVT Interfaces for TTPD

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TVT Interfaces for T/TPD & U/UPD at NSPO. Presented by. Chia-Ray (Steven) Chen ... shrouds: -196oC, -173oC ~ 127oC ... Test Interfaces Test Configuration ... – PowerPoint PPT presentation

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Title: TVT Interfaces for TTPD


1
TVT Interfaces for T/TPD U/UPD at NSPO
AMS-02
  • Presented by
  • Chia-Ray (Steven) Chen
  • Jih-Run (J. R.) Tsai
  • National Space Program Office
  • March 2, 2005

2
Content
  • Thermal Vacuum Test Facility
  • Temperature Profile
  • Test Interfaces
  • Required Information
  • Test Window Arrangement

3
Thermal Vacuum Test Facility
  • Small Thermal Vacuum Chamber
  • working volume 1.5m x 1.5m
  • shrouds -196oC, -173oC 127oC
  • thermal baseplate 1m x 1.25m, -60oC 100oC,
    100kg loading capacity with 2g requirement

Thermal baseplate
STVC
4
Temperature Profile

Temperature (Proto-flight Test Level)
Pump Down
Thermal Balance Phase
Return To Ambient
Thermal Cycling Phase


Chamber Environments Pressure?1.0x10-5 mbar



Hot non-operation (85oC)
1 hr
2 hrs Hot soak
2 hrs Hot soak
1 hr
1 hr
Hot Operation (55oC)
Transient Cool-Down
Hot Balance
Ambient
Cold Balance
Cold Operation (-25oC)
Operation (on)
2 hrs cold soak
2 hrs cold soak
Non-operation (off)
Cold non-operation (-45oC)
1 hr
1 hr
1 hr
1 hr
Turn on
Turn off
I
A
B
C
D
E
F
G
H
J
K
L
O
Q
M
N
P
5
Test Interfaces Flight Configuration
Wake Radiator
Ram Radiator
6
Test Interfaces Test Configuration
  • Electronic crates are suggested to be separated
    from their power boxes according to the flight
    configuration.
  • The dimensions of crates will be updated when
    engineering drawings are received.

1.25 m
1.25 m
31.3 cm
31.3 cm
20.4 cm
20.0 cm
1 m
34.2 cm
T
1 m
U
23.7 cm
TPD
UPD
40.3 cm
27.5 cm
Test adapter
Test adapter
Thermal baseplate
STVC door (feedthroughs)
STVC door (feedthroughs)
Thermal baseplate
7
Test Interfaces Electrical
  • Four 55 pins of feedthroughs (95-44 CD951 B07H
    22-55PS) will be used for electrical signals and
    two 24 pins of feedthroughs (DM5623-37-2-PP) for
    power. ---- Reserved for T/TPD and U/UPD
  • NSPO will use three 24 pins of feedthroughs
    (DM5623-37-2-PP) for heater and seven 37 pins of
    feedthroughs (DM5623-37-37-PP) for thermocouples.
  • Is there any EGSE box inside small thermal vacuum
    chamber (STVC)? gt TFS UFS? Power
    dissipations? Temperature range? Vacuum
    approved?
  • Corona issue for T/TPD/U/UPD?

DM5623-37-2-PP
DM5623-37-37-PP
95-44 CD951 B07H 22-55PS
8
Test Interfaces Mechanical
  • Test adapter will be prepared by NSPO to simulate
    AMS-02 radiator panel during Crates TV test. Test
    heaters and thermocouples will be installed on
    test adapter for precise temperature control. gt
    Engineering Drawings are required.
  • Cho-Therm will be used between crates and test
    adapter to simulate thermal coupling of flight
    condition.
  • Is there any MGSE required for TV tests?

crate
Cho-Therm
screws
Test adapter
thermal baseplate
Cho-Therm (enhanced thermal control)
9
Test Interfaces Thermal
  • Test heaters and thermocouples will be installed
    on thermal baseplate, test adapter, crate inside
    and outside to control and monitor temperature
    variations during test.
  • Locations of test thermocouples inside and
    outside crates will be decided by NSPO (with
    comments from CGS, MIT, and CSIST) based on test
    prediction results including interfaces of PCBs
    and case.
  • Thermocouple locations on chips or parts will be
    decided by crate design engineers before test
    preparations.

10
Test Interfaces Thermal (Continued)
  • Test thermocouples will be installed on the hot
    zones of T crate and TPD.
  • Will all PCBs be turned on all the time?
  • Are the power dissipations correct?

11
Test Interfaces Thermal (Continued)
  • Test thermocouples will be installed on the hot
    zones of U crate and UPD.
  • Will all PCBs be turned on all the time?
  • Are the power dissipations correct?

12
Test Interfaces Test Area
  • STVC and TDHSHCS are located in test high bay,
    but remotely controlled in TVC control room.
    (facility team)
  • Thermal engineers will use real-time monitoring
    system in TV test checkout room to trace
    temperature control. (thermal team)
  • AMS-02 test engineers will reside at TV test
    checkout room. (crate test team)

STVC
TDHSHCS
IT Highbay
20m
Trench (signal and power cables)
thermal and crate test teams
TV test checkout room
TVC control room
facility team
20m
13
Required Information
  • Test requirements
  • Any change on test requirements?
  • Pre-test predictions
  • Thermal models for T, TPD, U, and UPD were
    received from CGS recently, and need to be
    reviewed and discussed.
  • Compared with J crate, is there any change on T
    and U crate mechanics besides the number of
    slots? If yes, the updated parameters should be
    provided.
  • Updated power dissipations if any
  • Delivered items needed (2 months before test)
  • Engineering drawings for T, TPD, U, and UPD
  • Electrical test procedures
  • Material lists and outgassing data (including
    EGSE boxes)
  • Lists of crate test engineers and their personal
    information

14
Test Window Arrangement
  • Possible test window is allocated for AMS-02
    crates thermal vacuum tests by using NSPO test
    facility as follows

Some FORMOSAT-3 AIT activities may be conducted
in this window.
01/01/2005
06/15/2005
9/30/2005
12/30/2005
ROCSAT-3 launch preps. flight operation
FORMOSAT-3 AIT
Possible window
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