MutualTek Industries Co. Ltd

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Mutual-Tek Industries Co. Ltd

• Building partnerships for the long term in
  specialized PCB manufacturing

TEL [phone] FAX [phone] E-mail
mutualtek_at_ms21.hinet.net http//www.mutualtek.com.
tw
NO 25, LANE 195, HUA CHENG ROAD HSIN CHUANG CITY,
TAIPEI HSIEN TAIWAN, R.O.C
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Mutual Tek Company Profile
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Mutual-Tek Mission

• Focus on the latest premium technologies
• Emphasize high value processes, materials,
  products over volume
• Keep preeminence as a niche and keep it
• Be the best/only or dont do it
• Keep up with the latest technologies and market
  trends

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Milestones
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Organization
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Specialties

• Power, MW and RF products
• Copper
• Aluminum
• UL certification
• High efficiency PCB
• High precision
• High density
• High heat conductivity
• High immunity to signal noise
• Specialized Thermal Applications
• IMS
• Heavy copper power module (Multi-layer)
• Dc-Dc Converter

• Optical components
• SC, SFF transceiver (Single to Multi Channels)
• IRDA
• LED
• Wireless communications
• 2.4GHz, 5.8GHz, Home RF, Bluetooth
• 20-40GHz
• Digital Camera modules
• Chip-On-Board
• Research Development (prototype to production
  Stage)
• R/D MMIC QFN Packaging
• Carryless Bumpless packaging
• Emboss circuit
• Embeded circuit

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Current Capabilities

• Rigid Circuit Boards (mass production)
• FR-4, FR-5, BT, Getek, Polyimide, Teflon
• 4-20 layers
• Flex Board
• Single, double, multi layers (Maximum 14 layers)
• Rigid-Flex Boards (Maximum 10 layers)

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Current Capabilities

• Metal core process (mass production)
• Heavy copper mass production (5oz-10oz)
• Solder mask coating LPSM
• PSR 4000 TAIYO
• DSR 2200 TAMURA
• Promiber 77
• COB/SMT
• Gold Wire Bonding, Gold plating
• Electroless soft gold (flash to 20 u inch)
• Electrolytic soft gold (flash to 80 u inch)
• Electric hard gold

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Current Capabilities

• Special material manufacture
• Immersion Tin
• Immersion Silver
• Immersion Gold
• Entek

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Capabilities
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Lead Time
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Out layer Capacity Expansion
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Material Sources
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ExamplesHigh Frequency RF Power
Hybrid RF multi layer from 2.45GHz 5.8GHz
Teflon high power /metal Grounding Parts Over
5.8GHz appreciation
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ExamplesHeavy Copper Power Parts
High current power of DC DC Converter Inner
layer copper thickness over 3oz , Max to 6oz
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ExamplesHeavy Copper Inductance
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Examples Metal Core Substrate
Heavy metal ( IMS ) Substrate from 1oz to 10oz
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ExamplesFlex /Multi Flex PCB
Flex , Multi Flex Module parts from 2 to 10
layers
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ExamplesRigid Flex PCB
Rigid Flex PCB for Module parts from 4 10
layers
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ExamplesCavity Parts for COB
Cavity PCB with soft gold plating support to do
wire bonding
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ExamplesFR Multi-layer
Traditional FR PCB for module parts
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Examples2.45GHz COB Module Parts
2.45GHz RF Module with COB function
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ExamplesBump-Less /Carry-Less PCB
Transfer bumpless and carryless for IC package
technology
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Copper Thickness Product Mix
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Product Layer-count2004
Mutual-Tek Confidential 8
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Product Surface
Immersion Tin
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Immersion Silver
4
Gold Surface(Soft/Hard)
Immersion Gold(Flash-
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Heavy)
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Entek
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Product Applications
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Patents
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New Technology in Mutual-tek

• 1. Emboss circuit transfer technology
• 2. Emboss circuit transfer to do Embed PCB
• 3. Emboss circuit transfer to do thinner and
• fine flex circuit
• 4. Emboss circuit transfer to do bump less
• Package device .
• 5. Emboss circuit transfer to carried , carry
• transfer to Metal , heavy copper , cavity
• appreciation

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Expansion Plans

• Manufacturing space
• Sales and marketing
• International distributor, sales, service
  networks
• E-Business online product specification, design
  submission, RFQ, customer service
• Partnerships with North American and European
  firms as a specialty out-sourcing partner

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What We Can Offer

• Volume production of specialized designs
• Seamless support for customers
• Direct customer support
• Indirect support through outsourcing partner
• Interactive, collaborative design and production
  process
• Lower design, development, and production costs
  for volume production

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Thank You !
Mutual-Tek Industries Co. Ltd
Building partnerships for the long term in
specialized PCB manufacturing