A Quality and Technology Network

1
A Quality and Technology Network
ELECTRONICS MANUFACTURING
ELFNET Formulates the way forward for
Sustainable Electronics Interconnections
November 1-2, 2006
INTERNATIONAL WORKSHOP ON POLLUTION PREVENTION
AND SUSTAINABLE DEVELOPMENT Bringing Synergy to
Pollution Prevention
Margarida Pinto
instituto de soldadura e qualidade
2
ELFNET formulates the way forward for
Sustainable Electronics Interconnections
2nd November 2006
3
Sustainable Electronics Interconnections

• About ELFNET
• Results from ELFNET
• ELFNET 2 CONNECT
• Key Activities
• Roadmaps
• Interconnection Strategy
• Summary

4
Foreword
The EU RoHS Directive and other similar
legislation targeted for 2006-2010, has forced
the widespread implementation of lead-free
soldering and changed the basic glue holding
electronic and electrical equipment together.
Electronic interconnection technologies are key
to global communication, security, safety and
quality of life.
5
ELFNET Launched April 2004

• To urgently coordinate, integrate and optimise
  the critical mass of European research in
  lead-free soldering providing pan-European
  support for implementation of the RoHS
  Directive
• To a deadline of July 2006 for consumer products
• To a deadline of 2010 or before for IT-network
  products
• To implement lead-free technology in sectors
  outside scope of RoHS (e.g. automotive,
  aerospace)
• 2.3M (230 person-months) over 3 years
• April 2004 March 2007

6
ELFNET Structure
7
European Lead-Free Soldering Network 300 European
expert members 400 electronics industry
members 100 lead-free projects 300,000 website
visits
Knowledge Base Research project reports ELFNET
reviews Topic webpages Primary RoHS news
source Guidance documents Contacts directory
Expert Meetings/Presentations Industry
leaders Research project coordinators Trade
bodies Standards bodies
Collaborative Opportunities Heterogeneous
Assembly Reliability Test Methods Tin Whiskers F7
Proposals
Solder Alloy Properties Database Fully
comprehensive33 SAC Alloy compositions
8
Where RoHS Applies In Europe
ELFNET WP5
9
Sustainable Electronics Interconnections

• About ELFNET
• Results from ELFNET
• ELFNET 2 CONNECT
• Key Activities
• Roadmaps
• Interconnection Strategy
• Summary

10
1 - Reliable Interconnections

• The major systems and tools that modern society
  has come to rely on all include transmission of
  electric current through joint interfaces. Yet
• European industry has yet to be environmentally
  compliant
• Technology utilised now is still lacking in
  integration and synergy, particularly with regard
  to joint Reliability
• Lack of information and data is creating an area
  of uncertainty which affects both safety and
  economic viability

11
2 - Interconnection Needs

• New interconnection materials and process
  technologies are currently undergoing a global
  revolution.
• Technology drivers are applying pressure to adapt
  interconnection materials technologies to ever
  smaller products with greater functionality and a
  more transparent and efficient life cycle.
• Significant research and implementation gaps
  still exist.
• High reliability sectors such as Aerospace and
  Defence, Communications and Transport
  applications are investigating future options.
• A need exists in Consumer, IT,Telecoms,
  Industrial, Automotive and Medical Industry
  sectors for reliable and cost effective options.

12
Interconnection Issues

• ELFNET has already delivered
• European industrys key Issues relating to
  Lead-Free Interconnection implementation
• 55 aspects
• 6 areas of activity
• Supply chain (6), Design (6), Materials (14),
  Process (13), Quality Reliability (9),
  Recycling (7)
• European Technology solutions development
  programmes for 25 out of the 55 Issues, including
  
• Heterogeneous Assembly (FP7 submission)
• Solder Alloy Properties
• Reliability Data
• Test Methods
• Implementation Status

13
Interconnection Roadmaps

• ELFNET will deliver
• European Industry roadmaps covering
  interconnection needs for
• Telecomms
• Consumer
• Automotive
• Aerospace Defence
• European Technology roadmaps covering
  interconnection needs for
• Solders
• Components
• Assembly
• Reliability
• Recycling

.By March 2007
14
the outcome of ELFNET .
.. there is still an urgent need for further
research and development of new materials and
methodologies to ensure that European industry
will be able to utilise compliant, sustainable
technology for interconnections, particularly in
high reliability applications such as defence and
aerospace
. CONNECT
15
Sustainable Electronics Interconnections

• About ELFNET
• Results from ELFNET
• ELFNET 2 CONNECT
• Key Activities
• Roadmaps
• Interconnection Strategy
• Summary

16
ELFNET 2 . Extending the boundaries
17
The European Coordinating Network for development
of New Electronics InterConnection Technologies
(Reliable Materials for Advanced Sustainable
Electronics Interconnection)
A proposal now being generated by ELFNET for a
European FP7 Coordination Action
18
Interconnection Targets
KEY OBJECTIVE to enable European Industry to
provide a world class capability of the most
reliable electronics therefore being first
choice for supply to Global systems, by
undertaking priority actions

• to ensure new joining technologies are
  implemented across the European electronics and
  electrical equipment manufacturing industries in
  a coherent, reliable, eco-efficient and
  competitive manner.
• to research new material options for
  interconnection technologies to meet challenges
  of miniaturisation, requiring new materials
  processing technologies and exploiting emerging
  nanotechnology.
• to win global leadership for European knowledge
  and innovation in electronics interconnection

19
Sustainable Interconnections

• Electrical and Electronic Joining technologies
  that will be developed for sustainability in
  terms of
• Environmental Impact
• Life Cycle
• Manufacturability
• In Service performance
• End of Life disposal
• Low Environmental Impact . with Business
  Efficiency

20
Sustainable Electronics Interconnections

• About ELFNET
• Results from ELFNET
• ELFNET 2 CONNECT
• Key Activities
• Roadmaps
• Interconnection Strategy
• Summary

21

• CONNECT . is about
• Technology domains that are all related to
  aspects of an electronic system interconnection.
• Developing new materials, new processes, new
  joining methods, new modelling tools, new testing
  methodologies, new evaluation techniques.
• Design requirements for reliability, recycling
  and reuse of systems incorporating new electronic
  joining technologies.

22
Key thematic Aspects
Specific issues are Modelling Design A need
for data and modelling tools for characterising
behaviour of the new solder joints Materials
Process Development Continued coherent evolution
over the next 5-10 years to deal with
compatibility, thermal management, economic
optimisation and use in extreme
environments Testing Reliability Quality and
reliability testing for the new technologies is
vitally important Sustainability
Recycling Socio-economic impact of new
technologies to be fully explored and integrated
with the impending large-scale recycling of
electronics
23
Joining Technology
Key Aspects of the Electronic Interconnection
Joint ( Technical work packages)
KA1 - Modelling Design KA2 - Materials
Development KA3 - Applied Nanotechnology KA4 -
Substrate Matching KA5 - Equipment
Processes KA6 - Testing Reliability KA7 -
Sustainability Recycling KA8 - Environment
Matching
24
Electronics Interconnection Mindmap
25
KA-1 Modelling Design
26
KA-2 Materials Development
27
KA-3 Applying Nanotechnology
28
KA-4 Substrate Matching
29
KA-5 Equipment Processes
30
KA-6 Testing Reliability
31
KA-7 Sustainability Re-Cycling

• Long-term wear
• Cost Down processes
• Environmental impacts
• Etc

• Design
• Re-Use Blocks
• Traceability
• Dis-Assembly
• Toxicity

32
KA-8 Environment Matching
33
Sustainable Electronics Interconnections

• About ELFNET
• Results from ELFNET
• ELFNET 2 CONNECT
• Key Activities
• Roadmaps
• Interconnection Strategy
• Summary

34
Integration with Industry Roadmaps from

• IPC
• iNEMI
• ITRS
• ECOLIFE
• MEDEA
• ENIAC
• EPOSS
• IPMMAN

35
Packaging Roadmaps
SmallerFasterCheaper But .. More
complex, more integrated and more of Moore !
(ITRS etc)
Source Prof. H Reichl - ISS Berlin Feb 2005
36
Heterogeneous Assembly Project 2005 Actual
demands
Key data - published in the IPMMAN roadmap
37
Heterogeneous Assembly Project 2009 Future
demands
38
ELFNET roadmaps Solution Gaps

• Today
• Basic Tables from
• Technical expert Groups
• To Come
• Another 4 events for Industry networks
  (Nov/Dec/Jan)
• Integration of metrics
• Data checking by email
• Final report for March 2007

39
ELFNET roadmaps Solution Gaps
40
ELFNET roadmaps Solutions RD Gaps 2006-7

• Assembly TEG
• Reliability data
• Stability of Materials
• Materials declaration
• Secondary issues
• Sn whiskers
• Repair capability.

• Solders TEG
• Reliability
• Temp Effects
• Cost
• Secondary issues
• Heterogeneous assembly
• Hand soldering

•  Components TEG
• Whiskers
• Obsolescence
• High Temp Applications 
• Secondary issues
• Intermetalics (IMC's)

•  Reliabilty TEG
• Test methods
• Modelling
• Harsh environments
• Secondary issues
• materials declaration,
• mixed materials assembly
• recycled reused parts
• alloys properties
• Hand soldering
• Complex boards.

• Recycling TEG
• Labelling
• Eco vs Dis assy
• Green markings 
• Secondary issues
• Re-usable parts,
• Test standards
• Mixed Solder assemblies

41
ELFNET 2 roadmaps Interconnection Gaps
Sample of Roadmap results on new areas of
Interconnection Technology

• Key Gaps are
• Intermetallics
• New Materials
• Inks
• Adhesives
• Processes
• Substrates

42
ELFNET 2 roadmaps Interconnection Gaps
Sample of Roadmap results on new areas of
Interconnection Technology

• Key Gaps are
• RD unknowns
• Knowledge
• Information Communication

43
Sustainable Electronics Interconnections

• About ELFNET
• Results from ELFNET
• ELFNET 2 CONNECT
• Key Activities
• Roadmaps
• Interconnection Strategy
• Summary

44
ELFNET 2 Web Page .

• Linked from ELFNET home page
• Also available via Nursery and Search
• Forum with access limited to members
• Join up as affiliate to access Contribute ASAP
• Content covers .
• Forum
• Minutes of meetings
• FP7 ETPs
• Documents
• Updated with all new developments

www.europeanleadfree.net
45
Sustainable Electronics Interconnections

• About ELFNET
• Results from ELFNET
• ELFNET 2 CONNECT
• Key Activities
• Roadmaps
• Interconnection Strategy
• Summary

46
SUMMARY

• New interconnection needs are being determined
  for microsystem packaging, nano-technologies,
  photonics and silicon devices
• Significant research and implementation gaps
  still exist
• High reliability sectors such as Aerospace and
  Defence, Communications and Transport
  applications are investigating options
• A need also in Consumer, IT,Telecoms, Industrial,
  Automotive and Medical Industry sectors for
  reliable and cost effective options

CONNECT will coordinate and facilitate the
research agenda together with selected and
supported projects and Networking.
47
In conclusion
The way forward for Sustainable Electronics
Interconnections

• Academia, Industry and Research to formulate
  Interconnection Roadmap
• CONNECT to coordinate strategies and direction to
  enable European Industry to urgently develop
  Reliable Interconnection Technology
• Support key RD projects

48
Acknowledgments
Jeremy Pearce, Tin Technology (UK) Andy
Longford, Panda Europe (UK) Dag Andersson, IVF
(SE)
49

• Thank you for your attention