Littelfuses

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Littelfuses Eco-Design Strategy
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OUTLINE

• The Market
• Lead-Free Solders
• Littelfuse Strategy
• Lead-Free Product Portfolio

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Reason for the Lead-Free Initiatives

• Japan - Primarily Marketing Strategy in Asia
• Legislation in Europe
• Europe Legislation pending
• Competitive Pressure
• U.S.A Competitive Pressure

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European Environmental Legislation

• Waste Electrical and Electronic Equipment
  Directive (WEEE)
• Restriction of the use of certain Hazardous
  Substances in Electrical and Electronic
  Equipment (RoHS)
• OBJECTIVE
• - To increase the recycling of WEEE. In order
  to do so safely the concentrations of
  hazardous materials such as heavy metals,
  lead, cadmium and mercury must be
  significantly reduced. Halogenated materials
  must also be reduced as the tend to form
  dioxins and furans.
• - RoHS concentrates on eliminating/reducing the
  use of hazardous materials in the manufacturing
  processes of EEE. (Directly applicable to
  Littelfuse)
• Date of Application - July 1st 2006

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European Environmental Legislation

• WHAT WILL BUSINESSES HAVE TO DO TO COMPLY
• The design and production of Electrical
  Electronic Equipment must include consideration
  of,
• - easily recyclable/recoverable materials,
• control of hazardous substances, Lead (Pb),
  Cadmium (Cd), Mercury (Hg), Hexavalent Chromium
  (Cr6), Specific Halogenated Materials etc.
• - use where feasible of recycled materials
• - common component and materials coding
  standards
• - implementation of take-back policies for
  equipment from
• the customers

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European Lead-Free Technology Roadmap Soldertec
- February 2002

• Key Questions / Answers
• What is the preferred solder ?
• Reflow Sn/Ag/Cu
• Wave SnCu
• What component coating finishes are preferred ?
• 100 Sn
• What about cost ?
• Increases anticipated in,
• - standard solder paste - board
  substrate cost
• - higher overall process cost

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European Lead-Free Technology Roadmap Soldertec
- Ver1 February 2002

• Key Recommendations
• Lead levels for lead-free solders should be
  defined as 0.1wt. Pb or below.
• Consumable and component manufacturers should
  already have lead-free products available.
  Assemblers should be actively participating in
  implementation activities and have had their
  first product introductions at the end 2002
• Witin Europe there is poor co-operation between
  organisations/companies and it is recommended
  that companies move to work together to produce
  the body of data necessary to help make this
  transition as painless as possible.

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U.S.A Lead-Free Technology Roadmap
IPC Roadmap Draft IV 2000 Suggests that
lead-free solders will be defined as ?
0.1 NEMI Roadmap Defines lead-free as lt
0.1 Current Lead-free Technology projects
Purpose is to build up level of reliability
data participants include, Celestica,
Delphi/Delco, Intel, Lucent, Alcatel Canada,
Kodak, Compaq, IBM
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Lead-Free Solders
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Summary of Current Position on Lead-Free Solders

• Multicore, Kester, AIM, Tamura etc. all have a
  range of lead- free solders available
• There is no single drop in replacement
• In Europe U.S. SnAgCu alloys are favoured for
  reflow processing
• In Japan preference for alloys with Bi
  additions
• General agreement that Sn/Pb finished
  components can be used with SnAgCu alloys except
  where the parts will be exposed to high ambient
  working conditions i.e. gt 150ºC due to the
  formation of low melting intermetallics

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Summary of Current Position on Lead-Free Solders

• SnAgCu solders typically require process
  temperatures 30C higher than standard SnPb
• Cost of lead-free solders higher than standard
  Sn/Pb
• Kester estimates that currently running at x2.7
  cost
• However, Cost will decrease as volumes increase
• Due to density of the metals, pastes will
  have lower metals content.

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Typical Lead-Free Soldering Reflow Profile
255 ?5ºC
20 sec. max

• Recommended Pb-FreeReflow Solder - SnAgCu

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Littelfuses Eco-Design Strategy
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Eco-Design Strategy

• Extension of our Lead-Free product portfolio
• Up-grading of materials composition data base
  to provide more detailed information to
  customers on what trace elements may or are not
  present to ensure compliance with EU directives
• Testing of standard lead based products to
  ensure that they are compatible with the higher
  temperature solder processing necessary with
  typical lead-free solders
• Embedding consideration of materials
  environmental impact into our new product
  development process
• In-process of gaining ISO 14000 across all
  Littelfuse locations. (Des Plaines and Ireland
  achieved this in Dec. 2002)

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Lead-Free Product Portfolio