Meetings Committee Summary

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Meetings Committee Summary August 2005
Anantha Chandrakasan Meetings Committee Chair
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Overview

• Technical Sponsorship Update (10 minutes each)
• Request for sponsorship of the Organics Workshop
  2006 (Charles Sodini)
• Sponsored Conference Updates 40 minutes
• ISSCC (T. Tredwell)
• CICC (L. Starr)
• VLSI Symposium (B. Bidermann)
• A-SSCC (C-K. Wang)
• Open topics/Discussion

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Conference Statistics for Technically
Co-Sponsored Conferences
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Technical Sponsorship DAC

• Join DAC/ISSCC Student Design Contest - Major
  success
• Joint publicity and shared judging
• Floor presentations at DAC05, poster session at
  ISSCC 05
• 2005 Chairs Alan Mantooth (DAC), David Greenhill
  (ISSCC)
• 13 judges (mostly from ISSCC TPC)
• categories Operational conceptual, 3 winners
  each with one overall winner
• Maybe a 3th category for system designs
• 2006 chair from ISSCC William Bowhill (Intel)
• 48 entries for 2005 contest
• Down from 59 in 2004
• Operational 1st and 2nd place are also ISSCC
  papers
• Sponsors EDA and semiconductor companies
• Highlights of DAC at ISSCC not a big success
• New ideas?
• Highlights of Wireless at ISSCC at DAC05
• Special session in the technical program on
  wireless day
• New ideas joint tutorial
• E.g. repeat of successful tutorial Statistical
  Performance Analysis and Optimization of Digital
  Circuits

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Technical Sponsorship ICCAD

•  
•    For SSCS
• ICCAD is the premiere conference in design
  technology and automation
• Strong focus on design technology for nano
  technologies
• Strong technical conference, no exhibition
• Good for SSCS to link with this conference
• For ICCAD SSCS co-sponsorship provides
  additional quality label
• Logistic advantages
• mutual distribution of Cfp / conference program
  via attendee database
• mutual link on website

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Technical Sponsorship DATE

•  For SSCS it is good to link with a growing
  successful conference that targets designers
• DATE is Europes largest event for Design,
  Automation and Test in Europe
• Strong focus on (embedded) system design besides
  IC design
• Attracts many (European) designers
• Highlights evolutions in EDA and test towards
  designers
• For DATE
• SSCS co-sponsorship gives additional quality
  label
• SSCS could also sponsor a (student) design
  contest or other design activities at the
  conference would make SSCS more actively
  visible in Europe
• Logistic advantages
• mutual distribution of CfP / conference program
  via attendee database
• mutual link on website

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Technical Sponsorship RFIC

• 2005 Publication of expanded RFIC manuscripts in
  T-MTT J-SSC
• As RF-IC grows
• Emphasize higher manuscript technical quality
  rather than growth in number of manuscripts
• TPC membership manuscript review process
• Continue certain activities independent (apart)
  from IMS
• TPC meeting, coordinate it w/ ISSCC (location
  time)
• Separate Paper Submission System
• Strengthen RFIC Leadership positions transition
  of new chairs
• Junior TPC Co-Chair identified 1 year in advance
• Expected rotation of Senior TPC Co-Chair to
  General Chair
• Executive Committee focus on longer term
  strategic decisions
• Technical Co-sponsorship Opportunities
• Support RFIC in conducting TPC at ISSCC
• Support advertising the RFIC Symposium
• CFP in the transactions
• Email RFIC CFP to SSCS members
• Mass email notification of the Symposium
• Support a limited number (lt10) expanded RFIC
  Symposium manuscripts in a Mini Special Issue of
  the J-SSC

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Technical Sponsorship ESSCIRC

• Global discussions on the key conferences in the
  field
• Avoiding overlap in scheduling these key
  conferences
• Technical sponsoring by IEEE
• Enhanced publicity through IEEE channels
• Proceedings available on IEEE Xplore
• Last ESSCIRC Proceedings were already on the SSCS
  DVD

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Technical Sponsorship CSICS

• CSICS Reasons for having SSCS
• CSIC visibility in traditional si-IC design
  community
• Report record IC performance in the JSSC special
  issue of the CSIC and BCTM conferences
• To help the traditional silicon and Compound
  semiconductor design communities cross polinate.

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Technical Sponsorship BCTM

• Our main link with SSCS in the past has been the
  Special Issue of the Journal of Solid-State
  Circuits (September) shared between BCTM and the
  Compound Semiconductor IC Symposium, and listing
  BCTM on the SSCS website.
• About 40 of BCTM attendees are primarily circuit
  designers. BCTM combines process technology,
  device designers, modeling/simulation and circuit
  specialists in one meeting. Although there is a
  strong circuit design presence at BCTM, SSCS has
  less visibility than it should at the moment, in
  our opinion.
• The SSCS could provide more value to BCTM by
  assisting us in publicizing the conference
• A link to the BCTM website from the SSCS website
  would be helpful.
• Facilitate contact with SSCS members to inform
  them of the call for papers, paper submission
  deadlines, the advance program, and conference
  registration deadlines. EDS does this for BCTM
  now, but this has not been done by SSCS in the
  past.
• Information about BCTM (as above) in the SSCS
  Newsletter.

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Technical Sponsorship VLSI Design

• Government sponsorship Government of India,
  Ministry of Information Technology
• Affiliations with Professional Societies
• IEEE Circuits and Systems Society
• IEEE Electron Device Society
• ACM Special Interest Group on Design Automation
• VLSI Society of India
• Fellowships The conference typically provides
  several hundred fellowships for faculty and
  students in Indian universities to attend the
  conference. Fellowships include train fare,
  hotel costs, and a meal allowance
• SSCC Advantage
• The conference has always had solid state papers
  to some extent
• Recently, the number of such papers has
  dramatically increased in
• Nanotechology spintronics, SETs, carbon
  nanotubes, RTDs, Quantum Dots, etc.
• MEMS
• Optical Devices
• Therefore, SSCC sponsorship makes sense because
  of these common interests

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Summary
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Technical Co-Sponsorship

• Motion brought from the Meetings Committee SSCS
  agrees to technically Co-sponsor the following
  conferences
• DAC 2007
• DATE 2006 and DATE 2007
• ICCAD 2006
• RFIC 2006
• ESSCIRC 2006
• ISLPED 2006
• CSICS 2006 (formerly GaAs IC Symposium)
• BCTM 2006
• VLSI-DAT 2006 and VLSI-TSA 2006
• VLSI Design 2006

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Organic Microelectronics Workshop

• First Workshop July 10-13, 2005 Newport RI
• Sponsors ACS MRS IEEE - CPMT
• IEEE CPMT Representative - Philip Garrou
• Technical Content
• Materials Chemistry
• Materials Processing
• Device Physics
• Seeking Circuits papers
• Papers invited - (20 papers, single session, very
  high quality)
• 300 attendees
• Meeting to solicit other IEEE Societies to
  participate
• SSCS
• CAS
• EDS
• LEOS - no representative

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Results of Planning Meeting

• Evolve Organic microelectronics workshop into
  full conference sponsored by ACS, MRS, IEEE and
  later APS
• Ensure a mix of invited tutorial talks and
  contributed papers.
• Societies will not have competing exclusive
  conferences for Organic Microelectronics.
• IEEE Technical Rep. - Ananth Dodabalapur - EDS
• IEEE Administrative Rep. - Marsha Tickman - CPMT
• SSCS Representative Steering Committee - Charlie
  Sodini
• Financial Implications -
• Last year Revenue - 86K Expenses - 70K
• Next year - Continue to budget for 15 surplus
• SSCS share 10-12 depending on number of IEEE
  societies
• SSCS maximum exposure 10K
• 2006 conference Toronto (mid July)
• Motion brought from the Meetings Committee SSCS
  agrees to Co-sponsor 2006 Organic
  Microelectronics Workshop