Tutorials on Systems Miniaturization Luiz Ot

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Tutorials on Systems Miniaturization Luiz Otávio
S. Ferreira - LNLSNovember 28, 2001
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Outline

• Introduction to Systems Miniaturization
• Microfabrication Technologies
• Microsystems Development and Packaging
• Microfabrication in Brazil

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Introduction to Systems Miniaturization

• Microsystems
• Sets of microdevices capable of integrated
  sensing, analysis and actuation.
• Microdevices
• Microstructures capable of actuation, or signal
  transduction, or chemical reaction, etc.

Ivo M. Raimundo Jr. IQ/UNICAMPMUSA2000
Nobuo OkiUNESP Ilha SolteiraMUSA2000
Luiz O.S. Ferreira LNLS
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Why Miniaturization?

• Reduction on mass and size.
• Integration with electronics.
• Exploitation of new effects due to small size.
• Cost/performance advantages.
• Improved reproducibility, accuracy and
  reliability.
• Redundancy and arrays.
• Low power consumption.
• Less material used for manufacturing.
• Avoiding of rare or aggressive to environment
  material.
• Easy disposal.

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Vocabulary

• USA
• MEMS
• Microelectromechanical Systems
• Europe
• Micro SystemsMicro Systems Technology
• Asia
• Mechatronics
• Micromanufacturing
• Other names
• Micromechanics
• Nanotechnology
• Microtechnology
• Meso Systems

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Market Demands on Miniature Systems

• Environment
• Medicin Technology
• Information Technology
• Biotechnology
• Automotive
• Consumer electronics
• Projected sales for 200332 B (US)

Source Solid State Technology, July 1999, pp.
63-65.
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Technological Possibilites - 1

• Microtechnology for electronics
• Technologies developed or improved on last 20
  years
• Silicon crystal production.
• Thin film technology.
• Lithography and etching.
• Modeling.
• Characterization.
• Non electronic interations
• Springs, membranes, piezoresistive effect,
  heaters, etc.
• Well developed material and technology low cost
  if large scale production.
• Systems integration.

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Technological Possibilities - 2

• Full system approach
• Technologies for
• Assembly
• Interconnection
• Housing
• System integration
• Bonding and joining
• SMD, COB, TAB, DCA, Wire bonding, Flip Chip
• Analysis of the interactions
• Reliability
• Performance and cost
• Volume

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Technology Adaptation

• Old technologies, from micro-electronics and from
  mechanics, are adapted for use on micro-systems
  integration.
• Some new steps must be developed.
• Old materials are used on new ways different
  properties.
• Only a whole system approach leads to effective
  systems.
• Numerical analysis of interdependencies.

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Why Integration?

• Better shielding of weak electric signals from
  sensors.
• Individual sensor calibration on factory. Lower
  calibration cost.
• On board intelligence.
• Reduction of connection cables.
• Standard communication protocols.
• Save cost on extra electronics housing.

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How to Integrate?

• Monolithic Integration
• Very difficult and expensive.
• Very large scale of production.
• Large number of interconnects.
• Number of masks.
• Time of development.
• Yield.
• MCM
• Hybrid Integration
• In 1997, 8 of the pressure sensors and 12 of
  the accelerometers where monolithically
  integrated.

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Product Oriented Approach

• Problem and product oriented approach YES!
• Technology oriented approach NO!
• Technology manufacturability.
• Important technologies are not silicon based
• Mechanical micromachining.
• High aspect ratio microstructuring (LIGA).
• Replication methods
• Electroplating,
• Injection molding.
• Hot embossing.

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Availability of Production

• Many prototypes of sensors.
• Small number on the market.
• Prototyping labs are not equipped to make 100,000
  devices batchs.
• Moving the prototype to a foundry implies on
  starting again from the scratch.
• Orders of less than 250,000 devices are not
  attractive to silicon foundries.
• Multi-User prototyping approach (The MUSA
  Project).

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COSTS

• CMOS foundry for monolithically integrated
  sensors US30 Millions.
• Micromechanical parts line (if the ion
  implantation is made externally) US4 Million.
• Hybrid integration (assembly and thick film
  line) US1 Million.
• CMOS processed silicon US 2.5 to 8. Cent per
  mm2 US750 to 2100 for a processed 20cm waver.
• Sensor process US0.35 per mm2 for batch of more
  than 50,000 chips.
• Surface micromachining US1.80 per mm2 for
  10,000 Chips batch, and 30 cents per mm2 for
  500,000 chips batch.
• Less than 1 Million chips per year is a risk.
• Bellow 10,000 chips a year a big problem.

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People Demand

• 1996 total 48,000
• USA Japan Europe
• 29,000 13,000 6,000
• 2002 projected total100,000