Corporate Presentation

1
Corporate Presentation

• March 2004

2
Agenda

• About Optimal Corporation
• Mission Statement
• Design Challenges
• Optimal Solutions
• Customer Commitment
• Summary

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About Optimal Corporation

• Founded 1995, 24 employees
• Technology driven, first products 2000
• Headquarters San Jose, California
• Sales offices Taipei, Taiwan and Shin-Yokohama,
  Japan
• World-class management team and BOD

4
Optimal Mission
To provide industry-leading, innovative Signal
Integrity solutions for high-speed IC, Package
and PCB designs
5
Todays IC/Package Design Challenges

• At 0.15um and below, chip complexity skyrockets
• Integration
• Logic and memory
• Analog and digital
• Phase lock loop control essential
• Operating frequencies soar
• On chip speeds to 15 GHz
• I/O speeds to 3 GHz
• Signal Power Integrity A major challenge
• Chip designer must anticipate system issues
• Chip ? Package ? PCB ? System
• No integrated tools to meet the above SI/PI
  challenges

Optimal A comprehensive solution
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Optimal Solutions

• Optimal provides the first-ever complete signal
  integrity design flow solution from IC to Package
  to PCB

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Optimal Solutions

• PakSi
• Advanced 3D simulation and analysis tools
• Electrical, Thermal-Mechanical, Solder Joint
  Fatigue
• O-Wave
• Advanced 3D full-wave simulation, extraction and
  analysis tools
• SIDEA
• A one-stop shop of Signal Integrity Design
  Assistants
• PowerGrid
• DC and high frequency Power Integrity tool
  dealing with IR drop and ground bounce noise

Optimal Stability, Accuracy, Performance
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PakSi E3D Quasi-Static Simulation, Extraction
Analysis

• Unique quasi-static FEM solver capable of whole
  package extraction including power and ground
  planes

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PakSi TM, PakSi SJFAdvanced 3D
Thermal-Mechanical Analysis

• A complete thermal/mechanical/solder joint
  fatigue simulation tool from package to PCB

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O-Wave Innovative Technologies

• The only FEM solver to use the state-of-the-art
  Multi-Grid AV preconditioning technique
• Uses the latest Krylov adaptive frequency
  expansion algorithm

S Parameters
O-Wave High Performance, Precision Accuracy
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Accurate, Speedy and Memory Efficient

• O-Wave solves large cases with efficiency,
  precision accuracy AND has significantly smaller
  memory requirement

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How do we know the simulated or
measuredS-parameters are correct?

• SIDEA WB Convert corrects passivity errors in
  simulated or measured data

Criterion Eigenvalues of Re(Y)gt0
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PowerGrid

• Fast IR drop (DC) and ground bounce (AC)
  simulators for package and PCB power integrity
  analysis

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Efficiency and Ease of Use
From CAD database to SI analysis in one
continuous flow
8 programs in one place
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Optimal Product Families

• Unified engines for all products
• Optimal Signal Integrity

Signal Power Integrity
PakSi
O-Wave
SIDEA
Power Grid
Solver Engines (Quasi-Static, Full-Wave)
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Integrated Design Flow

• Most advanced full-wave solver engine available
  today
• Homogeneous approach

Signal Power Integrity
IC
Package
PCB
System
Solver Engines
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Customer Commitment

• Stability
• Extensive QA cycles prior to releases for total
  customer satisfaction
• Accuracy
• Simulated results compare well with known
  solutions or measurements
• Performance
• Innovative algorithms to reduce design cycle time
  and improve time to market
• Ease-of-use
• Fully-automated turn-key solutions designed for
  both senior and junior engineers alike

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Customer Testimonials

• We, at Intel, are impressed with the accuracy of
  the PakSi-E software. PakSi is a very fast
  simulator and is much faster than its
  competitors.
• Ilya Gurevich, Assembly Process Development
  Engineer, Intel Corporation
• We, at Agere, use Optimals PakSi-E software for
  complete package parasitic extraction of all
  designs including very high pin count. Weve
  designated Pak-Si-E as our current tool in the
  design flow for full package parasitic
  extraction.
• Ramani Tatikola, Ph.D., Member of Technical
  Staff, Agere Systems
• We have successfully matched PakSi-E's simulated
  data to actual TDR-measured data within 95
  correlation. Add into the mix the company's
  history of top-notch customer support, we were
  immediately sold on the product.
• Daniel Kim, Senior Electrical Characterization
  Package Engineer, Xilinx, Inc.