Reliability of Recolumned Area Array Packages FY 07- New

1
Reliability of Recolumned Area Array PackagesFY
07- New
PCK-2
Description
FY 07 Plans

• Develop qualification guideline based on
  reliability test data for reworked area array
  packages. Schedule and cost are of significant
  concern when CCGA columns are bend/damage due to
  shipping/mishandling and use of non-compatible
  balls (e.g. lead-free balls).
• JPL Will
• Rework 12 CCGA 1144 I/Os and recolumn using new
  columns structure
• Assemble these on board and document processes
• Perform long-term solder joint reliability test
  for recolumned package assemblies until failure
  using baseline thermal cycle profile (-55/100C).
• Analyze thermal cycle reliability and
  microstructural changes inc comparison to
  packages with virgin columns.
• Generate guideline for package recolumning as
  well as reliability changes due to such package
  rework both internal/external to package.

• Review literature rework procedure and plan
  rework
• Initiate rework for one part that had already
  failed after cycling
• Establish rework procedure, lessons learned
• Rework other parts as become available when
  failed
• Send to vendor for recolumning
• Assemble recolumn package on board
• Inspection and document quality
• Start thermal cycling (-55/100C-first)
• Monitor cycling at intervals and inspection
• Document test results
• Start guideline document

Schedule/Costs
Deliverable

• Guideline document covering literature search
  summary for rework, inspection indicators,
  quality and reliability test data after rework

NASA and Non-NASA Organizations/Procurements
All package/PWB, and additional equipment needed
are included in the overall budget
Lead Center/PI JPL, Dr. Reza Ghaffarian
FTE 0.35