The ZEUS Micro Vertex Detector - PowerPoint PPT Presentation

1 / 29
About This Presentation
Title:

The ZEUS Micro Vertex Detector

Description:

sandwich Shells. Forward flange: Nomex honeycomb ... ghost' hit. Angle a. Angle b. Signal. Signal. 15. V.Chiochia: The ZEUS Silicon Micro Vertex Detector ... – PowerPoint PPT presentation

Number of Views:98
Avg rating:3.0/5.0
Slides: 30
Provided by: vincenzo1
Category:
Tags: zeus | detector | ghost | in | micro | shell | the | vertex

less

Transcript and Presenter's Notes

Title: The ZEUS Micro Vertex Detector


1
The ZEUS Micro Vertex Detector
Vertex 2001 Workshop Brunnen, Switzerland 23-28
September 2001
  • Vincenzo Chiochia
  • DESY - Hamburg
  • for the ZEUS MVD Group

ZEUS MVD Group Bonn Univ., DESY-Hamburg,
DESY-Zeuthen, Hamburg Univ., KEK-Japan, NIKHEF,
Oxford Univ., Padova, Torino, Bologna, Firenze
Univ. and INFN, UCL.
2
Outlook
  • Technical specifications and design
  • Assembly steps
  • Detector tests before installation
  • Measurements with cosmic ray setup
  • Test Beam measurements
  • Radiation monitoring

3
Technical requirements and design constraints for
a vertex detector
  • Requirements
  • Three spatial measurements in two projections for
    each track
  • lt20 mm intrinsic hit resolution for perpendicular
    tracks
  • Impact parameter resolution of order 100 mm
  • High efficiency (gt97)
  • Constraints
  • Elliptical beampipe to give space to synchrotron
    radiation (max diameter 12 cm)
  • Central Tracker inner diameter 32 cm
  • Bunch crossing time 96 ns
  • Operating at room temperature
  • Extended interaction region in z direction

4
The MVD layout
5
Silicon microstrip detectors
  • n-doped silicon wafers (300 mm thickness) with p
    implantations (12 or 14 mm wide), HAMAMATSU PH.
    K.K.
  • 512 readout channels.
  • Using the capacitive charge sharing, the
    analogue readout of one strip every 6 allows a
    good resolution (lt20 mm) despite the readout
    pitch of 120 mm.
  • Highest coupling to the front end electronics if

Cc gtgt Cint gt Cb
6
Ladder and module structure
7
Production summary
  • Half-Modules production
  • Front-end chips Helix 3.0, 0.8 mm CMOS AMS, 128
    channels. 70 wafers (58 chip/wafer). Yield 70
  • Hybrids Test of 4 chips in chain
  • Final yield after improvement of production and
    transportation 70.
  • Detectors
  • Category A Idarklt10 mA _at_ 200 V category B
    Idarklt50 mA _at_ 100 V
  • Overall yield after Long Term Test 94.5 (6
    production steps)
  • Overall yield between hybrid gluing and laser
    scan 98.3 (3 production steps)
  • Ladder production
  • Consists of positioning, gluing and 3D survey.
  • Readout tests before and after module gluing
  • Total of 30 pieces produced plus 2 spares and 1
    prototype.
  • 4 rejected Half-Modules
  • Wheel production
  • 4 wheels produced. 4 weeks assembly. 1.5 year
    overall
  • 2 damaged modules during assembly
  • Tests Electrical, laser scan, survey

8
Ladder installation
  • Half cylinder
  • 15 ladders
  • 300 sensors, 75.000 channels
  • Assembly 7 weeks
  • 2 technicians 2 physicists
  • Full time

9
3D survey
forward flange overview
  • Bullets position compared to design

10
Wheels assembly
  • L-shaped carbon fiber half ring with seven
    straight sections
  • Supported by three points to half cylinder
  • The sensors are mounted side by side and stagged
    by 3 mm with an active overlap of 2 mm
  • The long side of the support provides housing for
    cooling pipes and supports the hybrides

11
Laser alignment measurement
12
Assembly timeline
  • Feb-Oct 00 303 ladders produced at NIKHEF (1.5
    ladder/week)
  • Mid Oct 00 Start read out chain preparation at
    DESY. First tests with a prototype ladder
  • Oct-Dec 00 Bottom MVD half assembly (15
    ladders4 half wheels) at NIKHEF
  • Mid Dec 00 MVD bottom half at DESY. Start laser
    alignment measurements and read out tests
  • Dec-Feb 00/01 Top MVD half assembly at NIKHEF
  • Mid Feb 01 MVD top half at DESY. Start tests
  • End Feb Beam pipe and radiation monitor diodes
    installation. Assembly of two MVD halves
  • Mar 01 Cosmic ray run with scintillator trigger
    (4 weeks). 2.5 Million events on disk!
  • End Mar 01 MVD installation in ZEUS

13
System test with cosmic rays
  • Extensive tests of detector electronics before
    installation
  • At arrival, check response of readout chips after
    programming sequence (fast scope test)
  • Proceed with acquisition in random trigger mode
  • Noise distributions in all modules and
    calibration files
  • Data acquisition with scintillators trigger
  • The full final VME read out chain and slow
    control has been assembled and tested before the
    installation
  • Test of ADCs acquisition modes (pedestal
    subtraction, zero suppression, clustering)
  • High/Low Voltage, humidity, temperature and drip
    sensors, etc.

Faulty full modules 4 of 206
(2 recoverable) Faulty single hybrids 1
14
Cosmic test results
  • Position reconstruction with a center of gravity
    algorithm
  • Require hits in two modules of outer layer
  • Kalman fit with straight line

15
Cosmic test results
16
Test of detector I/V properties
  • During the system test we have observed
    increasing leakage currents in some modules.
    Further studies have shown
  • At decreasing temperature the relative humidity
    rises and the breakdown voltage decreases
  • Relation between leakage current and temperature
    is well known

A careful checking and control of the humidity
is required for the ZEUS MVD!
17
Hit reconstruction
  • Non linear algorithm h (2 strips)
  • where
  • Algorithm balance of 3 strips
  • where posleft/right represent the centers
    of gravity between the central and lateral
    strips

18
Hit reconstruction test beam results
19
Radiation Monitoring
  • Sources protons, electron, synchrotron radiation
  • Three independent measurement systems
  • 1 ms 16 PIN diodes in 8 modules (zfwd110,
    zrear-100 cm) ? beam dump
  • 30 min 8 Radfets (zfwd200, zrear-160 cm)
  • 1 month 6 TLDs (Thermo Luminescent Dosimeters),
    sensitive to g and neutrons
  • 1krad absorbed so far (diode measurements,
    confirmed by radfets)
  • Max expected dose 50 krad/year
  • Final system commissioned

20
Final remarks
  • Assembly, overall tests and installation of the
    ZEUS MVD have been successfully completed.
  • System test data show very good performances
  • Detector has run smoothly for 4 weeks under bias
  • Only 2 faulty modules. 70 mm track resolution
    already achieved!
  • Leakage current of our sensors depends on
    humidity. Need to control air flow in the
    detector
  • Analysis of test beam data has shown that a hit
    resolution better then 20 mm can be achieved
    despite the read out pitch of 120 mm
  • HERA machine tuning in progress. ZEUS
    contributing with three independent measurements
    of radiation dose
  • Luminosity run foreseen January

21
OTHER SLIDES
22
Half Modules production summary
  • Single sensor I/V measurements Yield 99.7
  • HM gluing 421 half modules
  • Upilex connector gluing 420
  • Diode bonding 406
  • Long term test 398
  • Hybrid gluing 358
  • Hybrid bonding 354
  • Laser Test 352
  • Shipped to NIKHEF 344

Not all Half Modules have been bonded to hybrid
circuits
To ladder production
23
HERA II and ZEUS Upgrade
  • Increase instantaneous luminosity by a factor 5
  • instantaneous expected
  • L 7.5 1031cm-2 s-1
  • delivered per year 150 pb-1
  • General upgrade of the tracking system
  • Silicon Microvertex Detector (MVD)
  • Straw Tube Tracker (STT)

24
Half Module production history
25
Beam pipe assembly
Beam pipe shielding installation on MVD
bottom Half (rear side view)
Beam pipe shielding
Tubes for Passive radiation Monitors (TLD)
Beam pipe end switches
26
Cooling
  • Water cooled
  • T water 15 Celsius
  • T hybrid 25 Celsius
  • Stainless steel tubes
  • diameter 2.5 - 2.7 mm
  • flow 0.25 l/min
  • Material budget
  • Total 3 X0 per ladder

27
Material in a ladder
3 X0
28
Total barrel material
29
Physics at HERA
  • The lepton-proton interaction proceeds via the
    exchange of a virtual vector boson (g, Z, W)
    which plays the role of a probe.
  • The usual variables to describe the scattering
    process are
  • Q2 -q2 -(k-k)2
  • x Q2 / (2pq)
  • y (qp) / (kp)
  • Given a certain virtuality Q2 the resolution
    power DR of the probe is given by
  • DR ?c / Q 0.197 / Q GeVfm
Write a Comment
User Comments (0)
About PowerShow.com