Phonon Ultrasonic Bonder

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Phonon Ultrasonic Bonder
Team Members Thomas Carignan- EE Eric Carlson-
EE Steven LaBarre- COMPE

• Advisor
• Lei Wang
• Sponsor
• Phonon Corp.
• -Thomas Reinwald

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OUTLINE

• Background
• Problem
• Solution
• Specifications
• Time Line
• Budget
• Conclusion

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The Bonder

• Phonon Corp.
• What is being done now?
• What is an ultrasonic wire bonder?
• What its used for?
• Piezoelectric Transducers?

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Background

• One of the metallic surfaces are indirectly
  connected to a base by silicon adhesive.

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Problem

• Wire bonds vary for different components
  (silicone, material characteristics, apparatus
  configuration).
• Currently there is no calibration technique to
  assure a proper bond.

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Purpose

• Overall purpose is to improve the wire bonding
  process.
• Ability to
• - Analyze data retrieved from DAQ.
• - Test theories gained from data.
• - Standardize wire bonding specifications for
  specific components.

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Solution

• Measure the function generators output power in
  the time domain.
• Measure the horizontal vibrations.
• Measure the pressure exerted.
• Collect data via a data acquisition board.
• Analyze data and present in a graphical
  interface.

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Pressure Sensor

• How we use the load cell.

Parameters - Input 0 to 150 grams of
downward force - Output millivolts
(10-100mV) - Maximum physical size 2.0 cm2

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Piezoelectric Theory

• Piezoelectric Crystals
• Piezoelectric effect
• Converts mechanical vibrations to electrical
  pulses.

Diagrams taken from Cornell University website.
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Piezoelectric Application
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Wiring Flow Chart
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Data Acquisition

• We will use a DAQ board to read voltages from the
  sensors.
• Values are transferred to computer by PCI
  interface for speed.

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Specifications

• DATA AQUISTION
• PCI-DAS4020/12 by Measurement Computing Inc.
• Parameters
• - 4 analog Channels with A/D
  converters
• - 12 bit Resolution
• - Input range Software selectable
  5,1 Volts
• - Sample Rate 10 MHz/Ch
• - Power consumption PCI
• - Cost 1,299.00

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Software Engineering

• Reliability
• Performance
• Usability (UI)
• Reusability

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User Interface
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General Structure
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Use-Case
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Program Flow
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RUN PROCESS
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Problems

• Power measuring device disables function
  generators phase locked loop.
• This can only be used to determine power signal
  properties without bonding.

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Results

• Propagation properties noticed in bonding
  procedure using small piezo.

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Timeline
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BudgetTotal Budget 1500.00

• DAQ 1,299.00
• Sensors 549.50
• Misc. 0 - 50.00
• (wire, connectors, etc.)
• Machining 100 - 200.00
• Materials 50 - 100.00
• Stainless Steel
• Estimated Budget 1848.00

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Acknowledgments

• Phonon Corporation
• Thomas Reinwald
• George G. Harmans
• Wire Bonding in Microelectronics
• Cornell University http//www.mse.cornell.edu/cour
  ses/engri111/piezo.htm
• NDT Research Center
• Boston Piezo-Optics Inc.
• Norm Benoit
• UCONN ENGR Advisor
• Lei Wang

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Questions?