TEMTPS TRR

1
TEM/TPS TRR
GLAST Large Area Telescope Presented by G.
Haller SLAC haller_at_slac.stanford.edu (650)
926-4257
2
Contents

• Introduction
• Overview
• Significant Changes since CDR
• Objectives
• Status
• Requirements/Verification
• EGSE and Test-Procedures
• Verification Test Plan and Flow
• At Assembly Vendor
• Test-plan and Flow
• Facility
• Man-Power
• Quality Assurance
• Vibration
• At SLAC
• Test-plan and Flow
• Thermal Vacuum Test
• Mass Property
• EMI/EMC (at sub-contractor)

3
LAT Electronics
TKR Front-End Electronics (MCM)
ACD Front-End Electronics (FREE)
TKR
CAL Front-End Electronics (AFEE)
16 Tower Electronics Modules Tower Power
Supplies
CAL
Global-Trigger/ACD-EM/Signal-Distribution Unit

• 3 Event-Processor Units (EPU) (2 1 spare)
• Event processing CPU
• LAT Communication Board
• SIB

• Spacecraft Interface Units (SIU)
• Storage Interface Board (SIB) Spacecraft
  interface, control telemetry
• LAT control CPU
• LAT Communication Board (LCB) LAT command and
  data interface

• Power-Distribution Unit (PDU)
• Spacecraft interface, power
• LAT power distribution
• LAT health monitoring

Primary Secondary Units shown in one chassis
4
TEM/TPS Mounted to CAL
TKR not shown
LAT GRID with 16 CAL/TEM/TPS Modules
CAL
TEM
TPS
5
Tower Electronics Module
EM Tower Electronics Module (TEM) before
coating/staking

• Main DAQ module, one on each tower
• Controls and reads out data from TKR MCM and CAL
  AFEE front-end electronics
• Zero-suppresses CAL event data
• Buffers events in cable ASIC FIFOs
• Assembles CAL and TKR event fragments to tower
  event
• Transmits data to GASU
• Contains monitoring and low-rate science circuits
• LVDS interface to front-end electronics and GASU

TEM Assembly
6
Tower Power Supply
EM Tower Power Supply (TPS) before
coating/staking

• Tower Power Supply module, one on each tower
• Input 28V
• Generates low-noise voltages for
• TKR (2.65V analog, 2.65V Digital)
• CAL (3.3V analog, 3.3V digital)
• TEM (3.3V and 2.5V digital)
• TKR Bias (20V-140V programmable)
• CAL (20V to 90V programmable)
• Temperature sensors

TPS Assembly
7
TEM/TPS Assembly
After TEM and TPS are tested individually, the
two modules are mated and the TEM/TPS package is
tested
TPS
TEM
Shown upside-down
TPS
TEM
8
Changes since TEM CDR and Power-Supply Delta CDR

• Power Supply Review from 9-22-03
• SLAC GLAST web-site -gt Electronics DAQ -gt
  Reviews
• TEM
• Modification of FPGA code
• To fix a couple of bugs
• To change flow-control slightly to optimize
  dataflow throughout system
• Code was reviewed by GSFC reviewer (Dr Rod)
• Some resistor/capacitor values have changed to
  optimize monitoring ranges
• Details of monitoring circuit have changed and a
  sub-set of current monitoring functions were
  eliminated
• TPS
• Resistor/capacitor changes to optimize circuit
  performance over temperature
• Changes in poly-switch values to protect better
  over temperature (instead of RXE185, split the
  load into two paths with a RXE110 each),
  increased the current sensing resistor from a 1W
  to a 3W resistor.
• Changed resistor values to
• Modify TKR 2.5V to 2.65V
• Decrease maximum CAL Bias from 120V to 90V
• Changed Zener diodes at Bias output voltage for
  new max values
• Changed resistor values to optimize in-rush
  current level
• Worst Case Analysis updated to incorporate
  changes
• Thermal Analysis from CDR/Delta-CDR remained
  since changes dont impact thermal performance

9
Objectives

• Demonstrate that hardware, software, procedures,
  and support equipment are prepared to support
  system environmental test
• Demonstrate that planned and completed testing
  meets performance and interface requirements
• Identify and understand all the risks and
  limitations
• TRR is not intended to
• Review TEM/TPS design
• Review flight readiness
• Buy-off hardware or software
• RFAs should only be of sufficient concern to
  stop test
• Prior to start of an given test, any applicable
  TRR RFAs must be closed

10
Test Entrance / Exit Criteria

• Entrance
• All required paperwork released and in place
• Procedures, drawings, etc
• Test configuration verified and approved
• Essential personnel in place
• Pre-test TEM/TPS functional successfully passed
• Exit
• As-run procedures completed
• Correct and accurate application of test
  environment
• Test data acquired and archived
• No damage to TPS/TEM
• TEM/TPS performance within specification limits
• Post-test TEM/TPS functional successful

11
Status

• 3 TEM/TPS
• Qualification unit, Tower A, and Tower B units
• Assembled,
• Functional tested
• Ready for environmental test
• Assembly of balance of 19 TEM and TPS authorized
  to proceed, but not started yet
• All parts at assembler

12
Tests To-Date

• TEM and TPS engineering modules were extensively
  tested
• As EGSE in DAQ/CAL/TKR/IT
• gt50 test-stands were tested with SLAC TPS and TEM
  Test Procedure
• TEM and TPS were used to test functionality and
  performance of TKR and CAL sub-system electronics
• Met requirements by sub-system
• CAL performed vibration tests on coated/staked
  TEM/TPS to CAL levels, passed (exceptions were
  first modules in-house staked)
• Additional TEM/TPS tests
• Informal thermal-vacuum test -40C to 55C, passed
  CPT
• Vibration tests of staked TEM/TPS passed DAQ qual
  levels
• On test-bed
• 16 TEM/TPS connected to EM PDU and GASU and to
  Front-End Simulator modules generating trigger
  and event-data
• Run up to 10 KHz data-rates

13
Tests To-date (cont)

• On fully-instrumented tower
• 36 TKR MCMs
• 4 CAL AFEEs
• Ran tests and passed
• Test results for TEM/TPS performance tests posted
  for the EGSE TEM/TPS
• E.g. TEM/TPS delivered to CAL
• http//www-glast.slac.stanford.edu/Elec_DAQ/EGSE/C
  Al-AFEE/cal.htm
• IO tested to sub-system ICDs
• Configuration and data-taking tested
• Monitoring functions/performance tested
• Tested over
• Frequency (16Mhz to 22 MHz, 20 MHz nominal)
• Temperature (-40C to 55C)
• TEM supply range (3.3V /- 10, 2.5V /-10)
• One flight PCB TEM/TPS was loaded at SLAC with
  mostly parts from flight lots, including
  flight-lot ACTEL FPGAs
• Passed tests from -40C to 55C over voltage and
  frequency
• Three TEM and TPS flight modules assembled at
  flight-assembly vendor individually tested with
  CPT procedures, over temperature, passed tests

14
Requirements

• LAT-SS-00019 Specifications, Level 3 TDF
  Subsystem Specification
• LAT-SS-00284 Specifications, Level 4 Trigger
• LAT-SS-00285 Specifications, Level 4 Dataflow
• LAT-SS-00136 Specifications, Level 3 Power Supply
  System 
• LAT-SS-00183 Specifications, Level 4 Power Supply
  System
• LAT-SS-05522 Specifications, Level 5 TEM
  Specification
• LAT-SS-01281 Specifications, Level 5 TPS ICD
  Specification
• LAT-SS-05533 Specifications, Level 5 TEM/TPS
  Specification

15
Derived Requirements

• LAT-SS-05533 TEM/TPS lists 132 requirements for
  TEM/TPS package (most are from TEM LAT-SS-05522
  (108) with extensions (24) to include TPS
  requirements for the TEM/TPS package)
• Verification Matrix gives approach to verify each
  requirement
• LAT-TD-05536
• Lists verification method used
• Assembly level at which requirement is verified
• All TEM requirements at TEM assembly level
  (LAT-SS-05522)
• ALL TPS requirements at TPS assembly level
  (LAT-SS-01281)
• TEM/TPS package requirements at TEM/TPS assembly
  level (LAT-SS-05533)

16
System Performance

• Level 3 and level 4 DAQ and TRG and power-system
  requirements are met with a combination of DAQ
  modules (TEM/TPS, GASU, SIU, PDU, etc), since the
  DAQ and trigger and power system is comprised of
  several sub-system module types
• Level 5 TEM/TPS requirements which are verified
  are derived from Level 3 and Level 4 DAQ and
  Trigger and Power system specifications (as noted
  in the L5 requirements doc)
• Level 5 requirement doc includes derived
  requirement addressing
• Functionality/performance
• Power
• Mass/C.G.
• EMI/EMC
• Environmental incl temperature and vibration

17
Verification Status

• Engineering Module TEM/TPS
• EM completed full environmental/functional test
  program with exception of EMI/EMC, mass, and C.G.
• Demonstrated compliance with specifications

18
EGSE and Test-Procedures

• EGSE for Functional/Performance Tests
• Test-Stand documented in LAT-DS-04085
• TEM (at TEM module level)
• TEM Stray-Voltage-Test Procedure LAT-TD-04097
• TEM Electrical Interface Continuity and Isolation
  Test procedure LAT-TD-03831
• TEM Test-Procedure LPT LAT-TD-03415
• TPS (at TPS module level)
• TPS Stray-Voltage-Test Procedure LAT-TD-04098
• TPS Electrical Interface Continuity and Isolation
  Test procedure LAT-TD-04099
• TPS Test-Procedure LPT LAT-TD-01652
• TEM/TPS (at combined unit level)
• TEM/TPS Performance Test Procedure LAT-TD-01485

19
EGSE Test-Configuration

• LAT-DS-04085

20
Verification Level Module Detail

• Breakout of verification at TEM/TPS Module Level
• Tests to be conducted after successful TRR
• At assembly vendor
• Functional test
• Vibration
• Functional test
• Thermal cycle
• Functional test
• Pre-ship review
• At SLAC
• Incoming functional test
• Mass properties
• Thermal vacuum (in-situ testing)
• EMI/EMC
• Functional test
• Review
• Deliver to IT
• DAQ (out-going) / IT (incoming) test combined
• In the following slides first the work/tests at
  the assembly vendor is defined, then the
  work/tests at SLAC

21
At Assembly Vendor

• Test-Stand
• Supplied by SLAC
• Operated by SLAC engineers
• Vibration facility at General Technology
• Vibration test-procedure
• http//www-glast.slac.stanford.edu/Elec_DAQ/Review
  s/TEM-TRR/SK-282-SLAC-ESS-Procedure-11-03-04.pdf
• Also includes
• Thermal test procedures
• Environmental chamber (thermal/vibration)
  description
• SLAC engineers present for vibration tests
• Work at assembly vendor specified in SOW
• LAT-PS-02615

22
Process Test Flow-GTC (Assembly Vendor)

• See also in more detail in
• http//www-glast.slac.stanford.edu/Elec_DAQ/Review
  s/TEM-TRR/SK-282-SLAC-ESS-Procedure-11-03-04.pdf

Assemble TEM/TPS
Stake HW
Functional Test
Vibration Test
Source inspection EIDP review
Thermal test
Functional test
Final functional test
Pack ship to SLAC
23
GTC Qualification and Acceptance Test Matrix
24
GTC Environmental Test Requirements
Figure 1. Vibration Levels, Duration, and Spectra
25
Manpower Quality Assurance at Assembly Vendor

• Man-Power
• Thermal and vibration test man-power provided by
  assembler
• Test man-power supplied by SLAC
• TEM L. Sapozhnikov
• TPS D. Nelson
• Test Support J. Ludvik
• Quality assurance see below
• Quality Assurance
• Assembly QA by vendor as required by SOW
• On-site, full-time LAT QA presence (P. Lujan)
• Required changes to documentation at GTC is
  immediately documented on an NCMR and forwarded
  to SLAC for disposition
• All outstanding changes to documents are
  incorporated and a new revision released into LAT
  DOCs prior to final inspection at each
  manufacturing/test level (CCA, Module, Top
  Assembly)

26
At SLAC

• After TEM/TPS module has been shipped from
  assembly vendor to SLAC
• Test-Stand
• Supplied by SLAC, operated by SLAC engineers
• Work flow
• Functional Test
• Mass Property
• Plus C.G. measurement
• Thermal Vacuum (in-situ testing)
• Functional Test
• Ship to EMI/EMC vendor
• EMI/EMC test
• Ship back to SLAC
• Final functional test
• Review

27
Mass Property

• Mass properties checked at SLAC
• Procedure in progress (done at SLAC Metrology)
• Measured on EM (ref LAT-TD-00564)
• TEM 2.710 kg
• TPS 4.340 kg
• TEM/TPS Total 7,050 kg
• Allocation 12 above 7,896 kg
• C.G. to be measured for the qualification unit

28
Thermal Vacuum Test

• Thermal Vacuum facility in Building 33 at SLAC
• Thermal Vacuum Chamber Operating Procedure
  LAT-TD-02541 (draft in review)
• TEM/TPS Thermal Vacuum Test-Procedure
  LAT-TD-03631 ( draft in review)
• Chamber was relocated to Building 33 from Central
  Lab
• Needs earth-quake securing, in progress (by 1/10)
• Needs recalibration (by 1/15)

29
Qual and Flight Acceptance Thermal Vacuum Test

• See TEM/TPS Thermal Vacuum Test-Procedure
  LAT-TD-03631

At lt 10-5 Torr
30
Manpower Quality Assurance at SLAC

• Man-Power
• Thermal Vacuum test (R. Williams, J. Ludvik)
• Test man-power supplied by SLAC
• TEM/TPS L. Sapozhnikov, D. Nelson, J. Ludvik
• Quality Assurance
• LAT QA already present at SLAC
• Required changes to documentation is immediately
  documented on an NCMR

31
EMI/EMC Test

• Qualification Test (Conductive Radiative)
• Sub-contracted to CK Labs
• Statement of Work LAT-PS- 04568
• CE102, CECN, CS102, CSCM, CS06, RE101, RE102,
  RS101, RS103
• Detailed EMI/EMC procedure deliverable by vendor
  (in work)
• Required to be reviewed/released prior to tests
• SLAC engineers present at vendor for tests
• Vendor supplies test-report
• LAT QA at SLAC present for tests
• Flight Acceptance Test (Conductive)
• Performed at SLAC
• Procedure in work
• Required to be reviewed/released prior to tests
• CE102, CS102
• SLAC supplies test-report
• LAT QA at SLAC present for tests

32
Problem Failure Report/ Configuration Management

• Problem Failure Reporting
• Via standard SLAC LAT Non-Conformance Reporting
  (NCR) System
• NCR is entered
• Reviewed/accepted/resolved
• LAT engineering
• LAT QC
• Already exercised during past TEM/TPS assembly
• Configuration Management
• Via standard LATDOC system

33
Planned Tests

• Function/Performance Tests (LAT-TD-01485)
• Verifies all requirements in LAT-SS-05533 except
  below
• Thermal Vacuum Tests
• Verifies performance/function over temperature
• Mass/C.G.
• Verifies/measures mass and C.G.
• Vibrations test
• Verifies vibration performance requirements
• EMI/EMC
• Verifies EMI/EMC performance

34
Equipment Calibration

• Electrical Functional Test Equipment
• EGSE Test-Stand was certified by SLAC (will be
  posted on LAT EGSE web-site shortly)
• EMI/EMC Test Equipment
• Quantitative measurement equipment (sensors,
  antennas, etc) calibrated to NIST standards
• Calibration performed annually
• All item are (will be) within calibration at time
  of testing
• Vibration Test Equipment
• Accelerometers calibrated against a standard
  accelerometer traceable to NIST
• Signal conditioners calibrated annually
• TVAC Equipment
• Thermocouples calibrated against standard
  temperature calibrated prior to test
• Thermocouple reader calibrated very 2 years

35
Sub-System Safety

• EGSE
• Safe-to-mate
• Configuration control
• Calibration verification
• Functionality verification with golden TEM/TPS
  prior to test with flight hardware
• MGSE
• No custom MGSE
• Environment
• Temperature controlled in all test-facilities
• Cleanliness actively controlled in clean-room
  hardware bagged and purged when required
• Training
• ESD training completed
• Clean room training completed

36
Risk Assessment

• GTCC/GCCC TEM ASICs qualification program not
  completed at GSFC
• No issue to-date
• Test completion end of February
• ACTEL FPGAs
• TEMs use relatively new UMC fabrication-line
  space-qualified FPGAs, no flight heritage
• ESD sensitivity of ASICs higher than expected
  (200V, class 0)
• Mate-demate and safe-to-mate are of concern when
  connecting/disconnecting TEM to front-end test
  (simulator) board. Keep cables as short as
  possible, apply handling taught in ESD-training,
  use de-ionizers
• Schedule
• Pressure to deliver flight hardware could force
  less than complete characterization and analysis
  of modules, could result in replicating a problem
  in follow-on modules
• Performance
• None known

37
Test-Schedule

• Depending on assembly vendor, estimate as follows
• 1/10/05 functional test of qual/TwrA/TwrB
• 1/11-12/05 vibration test of qual/TwrA/TwrB
• 1/13/05 functional test of qual/TwrA/TwrB
• 1/14-15/05 TC of qual/TwrA/TwrB
• 1/16/05 functional test of qual/TwrA/TwrB
• 1/17-21 review/shipping
• 1/24/05 functional test of qual/TwrA/TwrB
• 1/25/05 mass, c.g. property test of
  qual/TwrA/TwrB
• 1/26/05 TV start of TwrA, end Feb 2
• 2/3/05 EMI/EMC of TwrA, end 2/5/05
• 2/7/05 TV start of TwrB, end Feb 14
• 2/15/05 EMI/EMC of TwrA, end 2/16/05
• 2/15/05 TV start of Qual, end Feb 22
• 2/22/05 EMI/EMC of Qual, end 3/8/05

38
Status of Main Test Procedures

• TEM/TPS Performance Test Procedure LAT-TD-01485
  released
• Vibration thermal cycle procedure
• GT procedure SK-282-SLAC approved
• EMI/EMC
• Qual
• CKC Lab procedure will be started 2nd week of
  January
• Flight
• Working together with TKR to get procedure
  finished by 3rd week of January (procedures are
  similar)
• Thermal Vaccum
• LAT-TD-03631, in draft form
• All procedures must be released before respective
  test

39
Issue Concerns

• EMI tests
• Concern passing qualification tests
• Schedule
• Tight
• Qualification and Flight acceptance tests of
  flight TEM/TPS are performed with front-end
  simulators, not with actual CAL or TKR
  electronics
• In the planning phase
• Taking qualification module after baseline
  environmental testing is completed
• Connect it to CAL AFEE / TKR MCM electronics
• Test over temperature (no vacuum required)
• Need documentation
• Possible for every flight modules schedule
  issues