WPI Fiber Optic Solution

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WPI Fiber Optic Solution
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System Level Application diagram
CrosspointSwitch Matrix
Fragm./Cell Interface
Port Controller / Network processor
Optical Front end
Protocol Engines ASICs
Optical Trx DCR
Framer
Port Ctrl
SERDES
Switch
. . . . .
SERDES
Optical Trx DCR
(X)GE MAC
Port Ctrl
Config Interface
Arbiter
Data/CtrlInterfaceCSIX/infiniband
Generic PacketInterface(UTOPIA / POS)
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CMOS Technology

• In CMOS technology, we have partnerships with
  IMEC (process research), STM (process
  development) and TSMC for development of 90 nm
  CMOS processes
• Motorola joined the 90 nm development in April
  2002
• We expect to be among the first manufacturers to
  put 0.12 µm CMOS in MASS production
• Embedded Flash and Embedded DRAM are offered as
  options on all processes from CMOS18 onwards
• Our new CMOS processes have an optional high
  resistivity substrate to enable RF CMOS circuits
  to be integrated on high density digital ICs

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GaAs MMIC Manufacturing capability

• OMMIC is part of the Philips group of Companies
• Located at Limeil-Brévannes near Paris, France
• Design and Support teams
• Manufacturing (Standard Line and Process
  Development group)
• Over 20 years of experience in GaAs
• 800 m2 of clean room
• Please contact OMMIC for more information

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Packaging RoadmapMiniaturisation (CSP, Bumping)
HVQFN / HBCC family
HVQFN 0.4 mm pitch
L/TFBGA 0.5 mm pitch
XFBGA (t 0.5 mm)
Au / PbSn Bumped Die
UltraCSP
2000
2001
2002
2003
2004
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Transceivers (PMD)
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Fiber optic transceivers application areas

• Public Networks
• (Ultra) Long Haul Networks
• Wide Area Networks (WAN)
• Metropolitan Area Networks (MAN)
• Enterprise Networks
• Local Area Networks (LAN)
• Storage Area Networking (SAN)
• Broadband Local Loops
• Switched Digital Video (SDV)
• Hybrid Fiber Coax (HFC)
• Passive Optical Networks (PON)

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General block diagram of fiber optic transceivers
data processing
laser
n
filter
PIN
n
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Philips portfolio
155 Mb/s
622 Mb/s
1.25 Gb/s
A-rate ?
PON
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Goldplated TIA

• PD on top of TIAgt more space in TO can
• Reduce number of wire bondsgt easier bonding
• Reduced length of wire bondsgt better performance
• Available for 155 Mb/s, 622 Mb/s and 1.25 Gb/s
• Sampling now

portfolio
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Goldplated TIA bonding diagram
Old situation
Gold situation
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155, 622 1250 Mb/s 3.3 V LDRs

• TZA3042 TZA3047
• Full temperature range -40 to 85 degrees C
• Qualified and in production
• average or dual loop
• Optimized DC coupling (large swing possible)
• 3.3 V and 5 V laser application possible
• Bias current upto 100 mA
• Enable (ALS)
• Pulse width adjustment
• HBCC32 package
• Pin compatible with 3.2 Gb/s LDR
• Samples and demoboards available

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Average loop laser driver TZA3042

• Suitable for all speeds up to 1.25 Gb/s
• Average loop laser control or direct control
• Input PECL or CML compatible (min 200 mVpp )
• Selectable retiming
• Bias current maximally 100 mA
• Modulation current maximally 60 mA
• Rise and fall times 120 ps (typical)

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Dual loop laser driver TZA3047

• Suitable for all speeds up to 1.25 Gb/s
• Dual loop laser control (and average or direct
  control)
• Input PECL or CML compatible (min 200 mVpp )
• Selectable retiming
• Bias current maximally 100 mA
• Modulation current maximally 100 mA
• Rise and fall times 120 ps (typical)
• Alarm functions

portfolio
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Laser Driver Dual Loop Control

• Main Advantages
• Optical 1 and 0 independently stabilized
• Fixed extinction ratio
• Stabilized over full temperature range laser
• Stabilized over aging laser
• Higher extinction ratio possible
• Higher laser light output
• Longer distance attainable
• Better maximum laser light output control
• Eye safety issues

low rate
A-rate
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Metro networks

• Bandwidth bottleneck is in the metro network
• upgrades needed
• Metro aggregates data from all customers with
  different protocols and speeds
• SDH/SONET
• Ethernet
• Fibre Channel
• switched video, etc
• Flexible solutions give big benefit
• Single PCB design for all rates and protocols
• Remote configurable via SW
• Fast provisioning possible

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A-rate? solutionall rates from 30 to 3200 Mb/s
data processing
laser
4, 8, 10 or 16
TZA3010
TZA3017
TZA3011
DEMUX
DCR
LIM
filter
PIN
4, 8, 10 or 16
TZA3013
TZA3012
TZA3014
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A-rate? solution

• Complete transceiver solution
• All data rates supported from 30 Mb/s to 3.2 Gb/s
• All multiplexing rates supported (14, 18, 110
  116)
• Single reference clock
• programmable frequency
• Easy PCB layout

front-end
transceiver
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A-rate? TIA TZA3013

• Full temperature range -40 to 85 degrees C
• Single 3.3 V supply
• Built-in AGC
• High overload current (2.5 mA)
• Large linear range without output clipping (up to
  1 mA)
• Differential outputs (B-version with switched
  polarity)
• On-chip bias voltage for the PIN
• Adjustable decision level
• Signal strength indicator
• Qualified and in production

new developments
portfolio
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A-rate? laser drivers

• TZA3010 TZA3011
• Full temperature range -40 to 85 degrees C
• Qualified and in production
• 3.3 V supply
• average or dual loop
• Optimized DC coupling (large swing possible)
• 3.3 V and 5 V laser application possible
• Features Alarms, Enable (ALS), Pulse Width
  Adjustment
• HBCC32 package
• Pin compatible with 1.2 Gb/s LDRs
• Samples and demoboards available

dual loop explain
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A-rate? average loop LDR TZA3010

• Suitable for all speeds upto 3.2 Gb/s
• Average loop laser control or direct control
• Input PECL or CML compatible (min 200 mVpp )
• Selectable retiming
• Bias current upto 100 mA
• Modulation current upto 100 mA
• Rise and fall times typical 100 ps

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A-rate? dual loop LDR TZA3011

• Suitable for all speeds up to 3.2 Gb/s
• Dual loop control (average or direct control)
• Input PECL or CML compatible
• Selectable retiming
• Modulation current maximally 100 mA
• Bias current maximally 100 mA
• Rise and fall times 100 ps (typical)

limiter
portfolio
new developments
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A-rate? LIM TZA3014
SSI
LOSTH
TZA3014
LOS
OUT
IN
OUTQ
INQ
INV
LEVEL
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A-rate? LIM TZA3014

• Full temperature range -40 to 85 degrees C
• Single 3.3 V supply
• Features RSSI, LOS (adjustable threshold 3 dB
  hysteresis)
• Small signal gain 17 to 32 dB
• Adjustable output level (200 mVppse to 800
  mVppse)
• Output inversion possibility
• HBCC package
• Ultra Chip Scale Package possible (2.5x2.5 mm)

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A-rate? 2x2 switch TZA3019

• Full temperature range -40 to 85 degrees C
• Single 3.3 V supply
• Features RSSI, LOS (adjustable threshold 3 dB
  hysteresis)
• Automatic strongest channel selection possible
  (B-version)
• Small signal gain 17 to 32 dB per channel
• Adjustable output level
• Output inversion possibility
• Switching possibility between channels (Crossbar)
• HBCC package

portfolio
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Passive Optical Networking
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Access technologies

• Bandwidth demand still increases
• Copper solutions suffer from lack of bandwidth
• xDSL can not pass beyond 10 Mb/s barrier
• Many competing technologies available
• dedicated OC-x connection gt use current
  chip-sets
• Free space optics gt use current chip-sets
• Ethernet solutions (point to point) gt use
  current chip-sets
• Passive optical networking (point to multipoint)

PON explain
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PON battle of standards

• FSAN standard based on ATM (APON)
• ITU-T G 983.1 and G 983.3 already finished
• standardization on going
• Ethernet based PON (EPON)
• standardization on going (EFM group) gt LDR
  available!
• Many proprietary solutions
• APON based
• Ethernet based

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PON products Burst mode laser driver TZA3050

• Speed up to 1.25 Gb/s
• Fully integrated burst mode loop control
• External capacitor to tune maximum storage time
• No external circuitry needed for switching
• Enable/disable time maximally 100 ns
• DC coupling to laser
• 3.3 V supply
• Samples and demoboard available

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What is Passive Optical Networking
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PON access architectures
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Basic PON architecture
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Downstream signaling
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Upstream signaling
PON standards