LCTPCLPWP9th phonemeeting

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LCTPC/LPWP-9th phonemeeting

• Date 13 September 2006
• Time
• 700 west coast
• 1000 east coast
• 1600 central Europe
• 2300 Japan
• To join,
• Phone [phone] code 52872

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Agenda for 9th WP phonemeeting(in future the
meetings will be managed via http//ilcagenda.cern
.ch/)

• AGENDA
• -1.News
• Formation of the LCTPC/LP Collaboration
• WWS-RD-panel tracking review at Beijing
• -2.WP meeting
• Status of Paris meeting (Ron,Takeshi,Leif,Jean-Pie
  rre,Ivor,Akira,Paul,Vincent)
• WP meeting, other contributions (whoever is
  ready)
• -3.Future meetings
• -Eudetmeeting at MPI 18-20 October
• -Valencia European WS 6-10 November
• -Beijing Asian WS February 3-7
  February

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• AGENDA
• -1a.Formation of the LCTPC/LP collaboration
• On the next foil are the groups who have replied
  with the name of their CB representative up to
  now marked by ?
• A phonemeeting will be held next week between SP,
  CB and TB to talk about the organizational
  structure (and reported to the groups)

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LCTPC/LP Groups (27 August 06)
Americas Carleton? Montreal? Victoria? Cornell?
Indiana? LBNL? MIT Purdue? Yale
Europe LAL Orsay? IPN Orsay? CEA
Saclay Aachen? Bonn? DESY? UHamburg? Freiburg? Kar
lsruhe MPI-Munich? Rostock? Siegen? NIKHEF? UMM
Krakow Bucharest Novosibirsk? PNPI StPetersburg?
Lund? CERN?
Asia Tsinghua? CDC Hiroshima? KEK? Kinki
U? Saga? Kogakuin? Tokyo UAT? U Tokyo? U
Tsukuba? Minadano SU-IIT?
Other groups interested?
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Formation of the LCTPC/LP collaboration The
proposal is to have 1)Three coordinators, one
chosen by each region. These spokespersons
(SP) coordinate the work of the following two
boards 2)The collaboration board (CB),
consisting of one representative from each group
or set of groups (the group leader, principle
investigator or other chosen member). Each CB
member looks after the resources for its
group(s) (money and people). 3)The technical
board (TB), consisting of the existing
workpackage (WP) conveners. The TB will ensure
the technical integrity of their WP
and compatibility with other WPs while
maintaining close contact with the collaboration.
This structure now exists. 1) We are three
interim coordinators and are to be replaced by
chosen ones in the course of this formation
phase. 2) The CB is (almost) complete. 3) The
workpackages and WP conveners were identified
during the first half of this year. The names of
CB and TB members are listed in the next slide.
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The CB members are --Americas-
Carleton Madhu Dixit Montreal Jean-Pierre
Martin Victoria Dean Karlen Cornell Dan
Peterson Indiana Rick Van Kooten LBNL Mike Ronan
--Asia- Tsinghua Yuanning Gao For the following
CDC groups Akira Sugiyama Hiroshima KEK Kinki Sag
a Kogakuin Tokyo U AT U Tokyo Tsukuba Mindanao
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--Europe- Eudet contact Joachim Mnich LAL
Orsay/IPN Orsay Vincent Lepeltier CEA Sacly
Paul Colas Aachen Stefan Roth Bonn Klaus
Desch Desy/UHamburg Ties Behnke Eudet Joachim
Mnich Freiburg Andreas Bamberger MPI-Munich
Ariane Frey Rostock Henning Schroeder Siegen
Ivor Fleck Nikhef Jan Timmermans Novosibirsk
Alexei Buzulutskov St.Peterburg Anatoliy
Krivchitch Lund Leif Jonsson CERN Michael
Hauschild (deputy Lucie Linsen)
--Groups with Observer status- TU Munich
Bernhard Ketzer Purdue Ian Shipsey --Replies
still missing from MIT Yale Karlsruhe Krakow Buch
arest
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The TB members are 1)
Workpackage Mechanics Ron
Settles a) LP design (incl. endplate structure)
Dan Peterson b) Fieldcage, laser
Ties Behnke c) GEM panels
for endplate Akira Sugiyama
d) Micromegas panels for endplate
Paul Colas e) Pixel panels for endplate
Jan Timmermans f) Resistive foil for
endplate Madhu Dixit 2)
Workpackage Electronics
Leif Jonsson a)"Standard" RO/DAQ sytem for LP
Leif JonssonPostdoc b) CMOS RO
electronics Harry van
der Graaf c) Electronics for LCTPC
Luciano Musa 3) Workpackage Software
Peter Wienemann a) LP SW,
simul./reconstr.framework Peter
Wienemann b) TPC simulation, backgrounds
Stefan Roth c) Full detector
simulation Keisuke Fujii 4)
Workpackage Calibration
Dean Karlen a) Field map
Lucie Linssen b) Alignment
Takeshi Matsuda c)
Distortion correction Dean
Karlen d) Radiation hardness of materials
Anatoliy Krivchitch e) LP Gas/HV
Eudet Postdoc
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• AGENDA
• -1b.Tracking review at Beijing
• no news

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• AGENDA
• -2a.Paris meeting status
• Talks at
• http//www-dapnia.cea.fr/Spp/Meetings/EndPlate/

1 sentence summaries/main questions up to
now -Ron (Overview) -Takeshi (PCMAG) -Leif
(Elelctronics) -Jean-Pierre (Digital
electronics) -Ivor (Fieldcage, German-Gem
discussion) -Akira (Gem endplate) -Paul
(Micromegas endplate) -Vincent (positive ions)
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• AGENDA
• -3.Future meetings
• There are (in addition to bi-weekly
  phonemeetings)
• -Paris Endcap meeting organized by Paul/Akira
  (12-14 September 2006) http//www-dapnia.cea.fr/Sp
  p/Meetings/EndPlate/
• -Eudet annual meeting MPI-Munich (18-20 October
  2006) with
• website
• http//www.eudet.org/AnnualMeeting2006/AnnualMeeti
  ng2006.html
• -European LC workshop Valencia (6-10 November
  2006), see
• http//ific.uv.es/ilc/ECFA-GDE2006/
• -Asian LC workshop Beijing (4-7 February 2007)
• Website
• http//bilcw07.ihep.ac.cn/

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• AGENDA
• -4.AOB

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Back up slides, for reference
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Akira Sugiyama GLD DOD
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(No Transcript)
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RS study - LDC DOD - together with Joel
Pouthas Philippe Rosier (IPN Orsay)
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(No Transcript)
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(No Transcript)
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(No Transcript)
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(No Transcript)
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Aleph Endplate
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(No Transcript)
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(No Transcript)
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(No Transcript)
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(No Transcript)
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• Some features
• Zigzag structure prevented loss of tracks gt ?22
• Sectors mounted from inside using a handling
  tool
• to minimize the dead space between sectors.
  This
• straight-forward operation which was
  performed
• at least 30 times during the lifetime of
  Aleph.
• Alu sandwich structure stiff, lightweight to
• - contain 7mb overpressure
• - provide forced-air thermal insulation
• between electronics and TPC volume
• Water cooling of 1kW electronics/side in addition
• - 22K channels per side
• Combination water/air cooling blocked all heat to
  TPC
• Overall thickness 25Xo (average) w/o cables
• Bending of endplate
• 20 micrometers due to 7mb overpressure
• 5 micrometers due to wire tension

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RD Planning

• 1) Demonstration phase
• Continue work with small prototypes on mapping
  out parameter space, understanding resolution,
  etc, to prove feasibility of an MPGD TPC. For
  CMOS/Si-based ideas this will include a basic
  proof-of-principle.
• 2) Consolidation phase
• Build and operate the LP, large prototype, (Ø
  75cm, drift 100cm), with EUDET infrastructure
  as pedestal, to test manufacturing techniques
  for MPGD endplates, fieldcage and electronics.
  Design is starting---building and testing will
  take another 3 years.
• 3) Design phase
• After phase 2, the decision as to which endplate
  technology to use for the LC TPC would be taken
  and final design started.