POWER SEMICONDUCTORS LIMITED

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POWER SEMICONDUCTORS LIMITED

• COMPANY PROFILE

THERMAL MANAGEMENT POWER ELECTRONICS SOLUTIONS
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Head Office St.Albans, Hertfordshire
Head Office Component Sales Manufacturing
17,000 sq.ft. Facility 13,200 sq.ft Production
Area
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Company Profile
Company Head Office Production Sites Joint
Venture Company St Albans St.Albans ETMI
Harpenden (Eupec Thermal Management
Inc) Established 1972 Employees Approx.
25 Privately Owned
Business UK Power Electronics Industry Exports
to EIRE, Europe and USA Turnover Approx.
5,000,000
Products Power Semiconductors Thermal
Management Solutions Semiconductor Stack
Assemblies Capacitor Filter Products Semiconduct
or Fuses
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Applications Power Electronics

• Variable Speed Drives

• Traction

• UPS

• HVDC

• Inductive Heating

• Wind Power

• Battery Charging

• Welding

• Medical Equipment

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Product Scope Components
COMPONENT SALES
Product
Manufacturer
Power Semiconductors
Capacitors
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Partner Infineon / eupec
LATEST (3RD) GENERATION IGBTs 600V 6500V /
10A 3600A THYRISTOR DIODE PRODUCTS MODULES
PRESSPACKS IGBT DRIVER SOLUTIONS STACK ASSEMBLIES
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Partner POWERSEM
THYRISTOR AND DIODE MODULES RECTIFIER
BRIDGES AC CONTROLLER MODULES SOLID STATE
RELAYS TRIGGER UNITS
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Partner ICAR
Power Electronic Capacitors
LNK TYPE FOR DC LINK MSR / BIOENERGY
TYPES (SELF HEALING FOR AC / DC) THY TYPE
SNUBBER RFI FILTERS / PULSE CAPACITORS
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Partner Itelcond
ELECTROLYTIC CAPACITORS EXTENSIVE SPECIFICATION
RANGE 33uF TO 470,000uF 6.3V TO 500V
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Product Scope Manufactured Products
MANUFACTURED PRODUCTS
Thermal Management Solutions Heatsinks
Extruded
Liquid Cooled
Bonded Fin
Components
Semiconductor Stack Assemblies
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HEATSINKS STANDARD EXTRUDED
WIDE RANGE OF PROFILES 66mm 750mm
WIDE MACHINING CAPABILITIES UP TO 1500mm
LONG LATEST CNC MACHINING CENTRES AUTOMATIC
SAWS LARGE STOCKS 25 YEARS EXPERIENCE IN THERMAL
MANAGEMENT SOLUTIONS DIVERSE RANGE OF APPLICATIONS
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HEATSINKS BONDED FIN
HIGH DENSITY FINS FLEXIBLE DESIGN APPROACH HIGH
EFFICIENCY PROVEN TECHNOLOGY 10 YEARS
EXPERIENCE IN-HOUSE PRODUCTION LOW DESIGN
PRODUCTION TIME HIGH CAPACITY COMPETITIVE C/W
PRICING LOW TOOLING COSTS
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HEATSINKS LIQUID COOLED
FLEXIBLE DESIGN APPROACH TO SUIT COMPONENT
LAYOUT ALUMINIUM / COPPER OR STAINLESS STEEL
PIPES HIGH EFFICIENCY PROVEN TECHNOLOGY 10 YEARS
EXPERIENCE LOW DESIGN PRODUCTION
TIME COMPETITIVE C/W PRICING LOW TOOLING COSTS
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SEMICONDUCTOR STACK ASSEMBLIES
WIDE RANGE OF CIRCUIT CONFIGURATIONS DIFFERENT
COOLING OPTIONS BIPOLAR IGBT SOLUTIONS LAMINATE
BUSBARS AVAILABLE IN-HOUSE ENGINEERING LATEST
AUTOCAD SOFTWARE LOW DESIGN TO PRODUCTION
TIME COMMITTED SUPPLY PARTNERS 20 YEARS
EXPERIENCE COMPETITIVE PRICING