Detector Thermal RunawayFacing Thickness

1
Detector Thermal Runaway-Facing Thickness

• Objective for Updating Thermal Runaway Prediction
• Assess stave composite facing thickness reduction
  from 0.7mm to 0.21mm 1m stave length
• Reduction permitted in mid-span support concept
• Fiber lay-up affects in-plane thermal
  conductivity
• 0.70mm thickness W/mK
• 352 axial, 89 transverse
• 0.21mm or 0.28mm thickness W/mK
• 221 axial, 221 transverse
• Result
• Insignificant effect, higher transverse Ks
  offset thickness reduction

10 layers 0.7mm 90/0/0/0/0/s versus 3
layers 0.21mm 90/0/0 or 4 layers 0.28mm
90/0/0/90
2
Thermal Model-10cm Wide Stave

• Description
• One detector module long (10cm by 10cm)
• 80 chips _at_ 250mW/chip
• Surface heating per Nobus curve
• Coolant tube surface temp-22ºC
• Number of elements comprising parts and interface
  contact materials gt 1.1million
• Number of nodes 211123
• Results
• Detector temperature nominally minus 15.7ºC at
  outer edge for second row chips
• Surface heating average 15.9mW/cm2

3
Thermal Model-10cm Wide Stave

• Description
• One detector module long (10cm by 10cm)
• 80 chips _at_ 250mW/chip
• Surface heating per Nobus curve
• Coolant tube surface temp-22ºC
• Number of elements comprising parts and interface
  contact materials gt 1.1million
• Number of nodes211123
• Results
• Detector temperature nominally minus 15.7ºC at
  outer edge for second row chips
• Surface heating average 15.9mW/cm2