LeadFree Solder Alloy Characterization Task 04003

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Lead-Free Solder Alloy CharacterizationTask
04-003
Description
Benefits

• Continue to characterize the microstructure and
  measure the mechanical properties of the lead
  free solders being studied by the Joint Group on
  Pollution Prevention (JG PP) as a function of
  compositional variation.
• Measure creep properties of Sn-Ag-Cu and
  Sn-Ag-Cu-Bi alloys as a function of composition.
• Characterize the microstructure and the tensile,
  fatigue and creep properties of Sn-Cu as a
  function of composition.

• Compliment the Joint Group on Pollution
  Prevention (JG PP) assembly-level testing of
  these alloys.
• Ensure that compositional variations, intentional
  (for cost or patent reasons) and unintentional
  (manufacturing tolerances), do not present a
  significant reliability risk.

Deliverables
Semi-annual status reports. Final report.
Schedule/Costs
Risks
Total ROM Cost (non-CS) 45K
Red, Yellow, or Green
CS FTEs .05
Non-NASA Organizations/Procurements Auburn 45K

Lead Center/PI MSFC/Auburn/Dr. Wayne
Johnson Co-Is Center Funding Split
Tactical 7 , Slide 15