AMS Tracker Thermal Control System TTCS

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AMS Tracker Thermal Control System (TTCS) TTCS
Progress, Planning Routing, Integration in AMS
NLR-team J. van Es, P. Dieleman, B. Verlaat
(NIKHEF), A. Pauw, G. van Donk, T. Zwartbol, SM.
Bardet, M. BsibsiSun Yat-Sen University team
ZH. He, KH. Guo, JQ. Ni, SS. Lu, XZ. Wang, XM.
Qi, TX. Li, YH Huang, X. Huang, Mo, Xiao et al
INFN-AMS-team R. Battiston, M. Menichelli, C.
Gargiulo, A. Alvino, E. Laudi, et al.CAST-team
M. Jianyin, J. Cao, G. Lin et al. MIT-team V.
Koutsenko, Cai, A. Lebedev AIDC-team B. Hong,
N.J. Lin, B.C.Y. Hsu, W.M. Hsu, A.J.M. Shue,
Chun-Ching Yeh. K.M. Sun, D. Dai, M. Tsang, YT
Ho, Grand Jiang , Tsung-Cheng Lin , David Dai,
Y.T. Ho , Chung Lai, Robert Kuo, Mark Chen,
Bill C.Y. Hsu, N.J. Lin

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TTCS presentations

• TTCS Progress, Planning Routing AMS, J. van Es
  (NLR)
• SYSU activities TTCS EM testing, Accu APS/DPS
  progress, Filling system, Zhenhui He (SYSU)
• Condenser, Heat Exchanger, tubing design, Elisa
  Laudi (INFN/AIDC)
• TTCE progress, Mauro Menichelli, Vladimir
  Koutsenko (INFN/MIT)
• Box Manufacturing Integration activities, DrJ
  (AIDC)(will be presented in Thermal System part)
  

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Contents

• TTCS progress and planning/routing of major
  components to AMS
• NLR activities
• Condenser design finalisation
• Box design and procurement (last but important
  issues)
• Pump testing (pumps arrived in the Netherlands
  31-01-2008)
• Embedded S/W requirements definition
• TTCS beam testing GSTTCS

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TTCS Progress Overview

• Major components
• Evaporators
• Transport tubing (details by INFN)
• Condensers (details by INFN/AIDC)
• TTCE (details and planning by INFN/MIT)
• TTCB Component boxes (Design finalisation NLR,
  integration AIDC)
• Other important tasks
• TTCS EM testing (see presentation Zhenhui He)
• Embedded S/W development (Vladimir Koutsenko and
  Teun Zwartbol) and dynamic modelling (INFN,
  Giuseppe di Mauro, ZC Huang and DC Mo)

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TTCS Planning
Remark QM Vibration testing will be performed
after TTCS delivery to CERN
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Routing delivery of major components

• Evaporator
• All delivered to CERN waiting for integration of
  bottom Tracker
• Implementation of hydraulic connectors
• Cleaning of tubing
• Potentially use of evaporator for beam test
  cooling

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Routing delivery of major components
Transport tubes
2 x VSB TTCS transport tubes AIDC
Integration _at_ SCL England
Bending tools
Clean tubes
Integration of tubes _at_ SCL England
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Routing delivery of major components

• Transport tubes (details see presentation INFN)
• Models ready 30-01-2008
• Manufacturing drawings on-going at AIDC
• Manufacturing support beam tubing and brackets
  part ready 10-04-2008
• Manufacturing of bending tools for non-beam parts
  ready 10-04-2008
• Integration of tubes at SCL
• Bending on site of transport tubes with AIDC
  tools
• Contract with welding company can be done by SCL
  (all equipment available contract to be
  arranged). Alternative is welding at CERN.

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Routing delivery of major components

• Condenser
• Condenser progress is presented by INFN/AIDC
• Major milestones
• QM delivery and TV-testing complete at Terni
  14-04-2008
• FM delivery to CERN 19-06-2008
• Remark Condensers can only be integrated after
  TRD-integration

1 x
QM manufacturing _at_ AIDC
Env. Testing Terni
4 x
FM integration at CERN
FM manufacturing _at_ AIDC
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Routing delivery of major components

• TTCE
• Delivery TTCE to be integrated on Main Wake
  radiator(for planning see Mauro
  Menichelli/Vladimir Koutsenko)

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Routing delivery of major components
TTCS boxes
FM primary
FM primary
FM primary
Primary ready 15-06-2008
Integration at AIDC
Integration on AMS at CERN
Env. testing at Terni
FM secondary
FM secondary
FM secondary
Secondary ready 22-07-2008
Integration at AIDC
Integration on AMS at CERN
Env. testing at Terni
QM primary
QM primary
QM primary
QM box ready 14-08-2008
Integration at AIDC
Performance testing at SYSU
Env. testing at Terni
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NLR tasks

• TTCS condenser design
• Update condenser design (manufacturing QM and FM
  started)
• Manifold adaptations for brazing
• Brazing plate design
• Gluing plate design
• Manifold design update
• Definition condenser integration sequence

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NLR tasks

• TTCS mechanical box design
• Box components
• Update HX manufacturing (to avoid impossible
  welding)
• Update cold orbit heaters manufacturing drawings
  (FM upto completion)
• Update pre-heater manufacturing drawings (FM upto
  completion)
• Box design
• Change sheet metal bending radius
• Box tubing design adaptation (to avoid impossible
  welding)
• Add box bracket design (unsupported length too
  big)
• Add strain relief support bracket for vibration
  testing

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NLR tasks
TTCS boxes
HX and Tube lay-out update to avoid impossible
welding
HX simplification
Cover update
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NLR tasks
TTCS boxes
added bracket
Vibration support jig
TTCB on USS jig with strain relief support
structure for vibration tests
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NLR tasks

• TTCS box design
• Design upto finalisation
• Manufacturing drawings FM QM Primary box to be
  approved
• Manufacturing drawings FM Secondary box ready
  22-02-2008
• TTCS Pump testing and preparations
• Test set-up ready (including filling system)
• Test procedure ready (including vapour start-up)
• Pumps arrive 5 February at NLR
• TTCE dynamic modelling (used to test TTCE)
• CGS/INFN student G. di Mauro has started
• Bi-weekly videoconference with CGS
• Update S/W requirements document and
  discussion/agreement with Vladimir Koutsenko

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TTCS and beam testing

• Tracker needs cooling during beam testing
• But....TTCS condensers/radiators do not operate
  with air cooling without high risk of
  condensation
• To cool the tracker it is proposed to use
  theevaporator with a GScooling system

Ground Support TTCS by B. Verlaat
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TTCS and beam testing

• Possible options to use the GSTTCS
• As proposed by Bart
• Disadvantages
• No access of at evaporator inlet
• Clean pump (high static pressure) to be procured
• Install one TTCS box after beam testing and use
  evaporator inlets at that TTCS box locations.
  Further use GSTTCS
• Disadvantages
• Clean pump (high static pressure) to be procured
• Install both boxes except for connections to
  condensersfor one box. Connect GSTTCS HX to
  that point.
• Advantage Use FM (clean pump)
• Disadvantage Possible contamination flight pump
  

Ground Support TTCS by B. Verlaat