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FPIX2 for FP420

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Study how fast the BCO clock can go. Designed for 7.5 MHz (132 nsec). Will probably NOT work at 40 MHz. May work at 20 MHz. ~50ns time resolution? ... – PowerPoint PPT presentation

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Title: FPIX2 for FP420


1
FPIX2 for FP420?
  • David Christian
  • April 26, 2005

2
FPIX2 at a glance
  • Designed to be the BTeV pixel chip.
  • 50m x 400m pixels (like ATLAS).
  • 22 columns x 128 rows.
  • Designed to tile chips in one line with 600m long
    pixels between chips not designed to tile two
    lines of chip on one sensor module.
  • High speed, zero suppressed readout.
  • Can be 30ns/hit.
  • All chips read out in parallel on point-to-point
    links.
  • NO TRIGGER.
  • Easy to use.
  • One bias voltage (2.5V)
  • All LVDS I/O No other ASICs required.

3
FPIX2 Block Diagram
Pixel Unit Cells (22 columns of 128 rows each)
Core
Fabricated by TSMC (through MOSIS). Only bias
voltages required are 2.5V ground. All I/O is
LVDS.
End-of-Column logic (22 copies)
Core Logic
DACs
Next Word Block
Clock Control Logic
Data Output Interface
Programmable Registers
Word Serializer
Programming Interface
Steering Logic
Data Output Clock
BCO Clock
Input/Output
High Speed Output
4
FPIX2 Layout
Debugging Outputs
Pixel array End-of-Column Logic e Core
128x22 Pixel array
End-of-Column Logic
Registers and DACs
Data Output Interface
Command Interface
LVDS Drivers and I/O pads
Internal bond pads for Chip ID
5
Pixel Unit Cell
Column Bus
3 bit FADC
Amplifier
Pulse ht 02
Vdda
Ifb
Binary Encoder Register
Token Out
-

Vfb2
Vff
Token Bus Controller
Row 07
Command Interpreter 4 pairs of lines, 4 commands
each Latch Data Output Data Idle
Reset
Sensor
Inject
Token In
Test
Vref
Hit
Bias voltages currents are set by DACs.
6
Pixel Cells (four 50 x 400 mm cells)
12 µm bump pads
Preamp
2nd stage disc
Kill/ inject
ADC encoder
Digital interface
ADC
(Top metal layer not shown)
7
Status Plans
  • Final submission of FPIX2 end of May 05.
  • Fixes two fatal flaws in current chips.
  • Expect chips back in August September.
  • Will construct modules using BTeV sensors
  • Tesla moderated p-spray sensors, VTT solder bump
    bonds
  • 8x, 6x, 5x, 4x, 1x
  • Expect modules Feb. 06
  • Plan bench tests beam tests of modules before
    and after irradiation.
  • Tests will run through fall 06.

8
Possible use for FP420
  • Study how fast the BCO clock can go.
  • Designed for 7.5 MHz (132 nsec).
  • Will probably NOT work at 40 MHz.
  • May work at 20 MHz.
  • 50ns time resolution?
  • Could bond FPIX2s to other detectors and compare
    to BTeV silicon modules.
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