Airborne Signals Intelligence Payload ASIP Overview Briefing 13 May 03

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Aeronautical Systems Center
Rapidly delivering war-winning capability
Airborne Signals Intelligence Payload (ASIP)
Overview Briefing(13 May 03)
Danny Mullins ASC/RAJS [phone] Danny.Mullin
s_at_wpafb.af.mil
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Directing the SIGINT FightIts Not About the
Sensor
HBS
ASIP
MOBSTR
MCE
AT AOC
DCGS
Its about supporting the Joint Force
Commander to put Weapons on Targets
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ASIP Overview

• Airborne Signals Intelligence Payload will
  provide an end-to-end SIGINT capability to the
  warfighter with
• SIGINT sensors on both U-2 and Global Hawk
  platforms
• Includes integrated high band and low band
  capabilities
• Data exploited within the Air Force Distributed
  Common Ground Station (AF-DCGS)

DCGS
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ASIP Acquisition

• ASIP acquisition strategy affects 3 weapons
  systems (GH, U-2, AF-DCGS)
• Low-med risk program is accomplished by
  leveraging off of existing systems
• Utilizing HBS PCU-GH configuration, hardware
  software architecture, platform datalink
  integration lessons
• Encouraging maximum use of proven technology for
  low band solution
• Encouraging minimum configuration changes in
  ground station to accommodate new sensor

HBS Components

• ASIPs synchronized incentivization is
  accomplished using
• More traditional per-project incentivization
  (ie. award fees, CPARs) that is synchronized
  among industry partners and government
• Objective performance incentivization, which
  depends on successful end-to-end performance

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HBS PCU Program Description

• State of the art system will outperform current
  collectors for modern frequency agile radars
• Widest Bandwidth (1 GHz)
• Improved Geolocation
• Improved Sensitivity/Range
• Simultaneous capabilities for more targets in the
  same frequency range
• Pulse and CW Search DF
• Moving emitter Mapping in SHF
• Exploits Special Signals
• Rapidly re-configurable to new threats through
  software upgrades

• Acquisition Agency ASC/RAJ
• Contract Type CPAF
• Deliverables 1 PCU
• Prime Contractor NG, San Jose, CA
• Major Subcontractors
• Raytheon, Denver, CO ISR, Clarkston,
  WA
• APSG, Sunnyvale, CA NG/SEG, Los
  Angeles, CA

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Small SWaP SIGINT Roadmap
FY01
FY02
FY03
FY04
FY05
FY06
FY07
FY08
FY09

Global Hawk Development
EMD FT
GH Spiral 2 (LR-100 Hyper Wide)
Budgeted
GH Spiral 3A (HW HBS PCU-GH)
HBS PCU-GH SDD FT
Funded
GH Spiral 3B (ASIP)
HBS PCU-GH LB lite SDD FT

GH Out year Spirals
SOI upgrades, DMS, Heavy SIGINT, etc.
AFS Devel/Prod
HBS PCU-GH LB SDD FT
AFS unit 9 (HB PCU LB)
PROD
DEL
PROD
AFS unit 10,11
SOI upgrades, DMS, etc.
AFS Out year Spirals
Global Hawk Production (Potential for ACS)
AF 7-10
AF20-25
Lot3/ FY04 Buy
FY07Buy
AF 11-14
AF26-31
Lot 4/FY05 Buy
FY08 Buy
AF15-19
AF32-37
Lot 5/FY06 Buy
FY09 Buy
AFS Production Unit Qualification (FDE)
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Flt Tst
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Flt Tst
Flt Tst
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U-2 Reconnaissance Aircraft
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THE NEW U-2 EVOLUTION
AF RECENTLY FUNDED AIRFRAME, SENSOR AND HUMAN
FACTORS IMPROVEMENTS ENSURES 21ST CENTURY
WARFIGHTER UTILITY
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U-2 Weapon System CONOPS
SPUR
MOBSTR Mobile Stretch
Downlink to DCGS, dont have to bring Gd Station
BGPHES
MIST/ETRAC Downlink to Army
Direct Line of Sight
CHBDL-ST Downlink to Navy
DCGS Analysis in US
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U-2S Reconnaissance System

• Fleet size
• 31 Operational A/C 4 Trainers
• Sensors
• SIGINT
• Radar w Moving Target Indicator
• Day Night EO/IR
• High Resolution Film Cameras
• Exploitation Segments
• Real Time Assessment
• Dynamic Tasking
• Data Dissemination

• Capabilities
• 4,700 LB Payload
• 6,000 NM Range
• 10 Hrs (Pilot Limited)
• 70,000 Ft
• 410 Kts Cruise
• Real Time Worldwide Comms
• Line of Sight
• Beyond LOS/Satellite

Airframe Structural Life Exceeds 50 years
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On-Going Weapon System Projects
ASARS-2 Improvement Program
Data Links
RAMP
Power/EMI Upgrade
SYERS-2
Defensive Systems
RAS-1R
Modifies Ground Element
Modifies Airborne Element
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Global Hawk
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Future Global HawkCapabilities
ETP/Ku SATCOM
UHF SATCOM
Narrow Band
ABIT Air-to-Air
UHF LOS to LRE
Wide Band
or
Broadcast Network
CDL to MCE
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Global HawkPurpose

• Global Hawk is an unmanned, high altitude, long
  endurance air vehicle
• Supports Department of Defense intelligence,
  surveillance, and reconnaissance missions with
  integrated sensors
• Electro-optical/Infrared Images
• Synthetic aperture radar (SAR) for all weather
• Future signals intelligence (SIGINT) capabilities
• Other potential uses for future users

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Program BackgroundGlobal Hawk System Requirements
Payload Sensor Modes

ORD KPPs

EO/IR

Endurance - 1200 NM

Spot
Radius, 24 hrs on-station
Pt Target

Airspace Coordination -

UHF SATCOM

Wide Area Search
(INMARSAT- C2 Backup)
worldwide employment
SAR


Ground Station - operators

Spot
perform NRT mission

Wide Area Search
control, monitoring and
GMTI

updates/ modifications

Air Vehicle

Satisfy 100 of critical top

60,000 FT Altitude
level IERs
24 hours Time On

Station _at_ 1200 NM Radius
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RQ-4A, Global Hawk
GENERAL DESIGN

• Specifications
• Wing span 116 ft
• Length 44 ft
• Height 15 ft
• Performance Goals
• Range 12,500 nmi
• Endurance 35 hrs
• Endurance _at_1200nm 24 hrs
• Altitude 65,000 ft
• True Airspeed 350 kts
• Gross T/O wt 25,600 lbs
• Payload wt 2,000 lbs
• Payloads EO/IR and SAR
• Comms SATCOM UHF/Ku-Band
• LOS UHF and CDL

MILESTONES

• Advanced Concept Technology Demonstration FY95
  - FY00
• 32 months to 1st flight - Feb 98
• AF assumed program responsibility - 1 Oct 98
• Entered EMD Mar 01

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Global Hawk Contractor Team
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Global Hawk Size and Performance
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Evolution to ASIP
Provide an update of where the HBSS program is
and where it is headed
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Why Spray Cooling

• Extreme temperatures force choices that boost
  cost significantly
• Few vendors build conduction cooled boards (and
  no major vendors)
• Conduction boards cost a lot more (much smaller
  market)
• Conduction boards use down-rev CPUs (long time to
  market)
• Software support for 2nd tier vendors is never as
  good as 1st tier vendors
• Often the prime is forced to design and build
  custom conduction boards
• Even if an air-cooled CCA solution exists, time
  and money must be spent to re-spin a conduction
  cooled variant
• Spray cooling solves all of these problems
• Can use unmodified first-rate, major vendor
  boards (hot off the press)
• High-volume boards have the best software support
  (O/S, compilers, )
• Working air-cooled solutions can be flown almost
  immediately
• Thermal design is simple (reducing design costs)

SHORTENS FIELDING TIME/COST ABLE TO USE LEADING
EDGE TECHNOLOGY
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How Spray Cooling Works
Heat Extraction Electronics are sprayed with a
thin dielectric film using miniature atomizer
arrays. The fluid evaporates to extract heat,
maintaining devices at constant low temperature.
Heat Rejection Vapor travels to the heat
exchanger for local or remote heat rejection and
phase change back to liquid.
Pump/ Reservoir Liquid returns to spray chamber
using an n 1 redundant pump and filtration
system.
Closed Sealed System Creates an isolated, benign
"COMMERCIAL GRADE" environment within a any
environment platform.
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Spray Cooling Details

• Atomizer create mist that is directed in from the
  side
• Custom slot-by-slot atomizer arrangement
• Can spray over CCA (convection CCA) or cool the
  rail (conduction CCA)
• Flourinert cooling fluid 55C vapor point ( 1
  atmosphere)
• Safe non-hazardous, non-toxic, non-flammable
  (usable as a breathing fluid)
• Pressurized chassis
• Slight positive pressure (gt1 atmosphere) due to
  fluid pressure at temperature
• Filters absorb organic contaminants and water
  (fluid stays clean)
• Extremely efficient cooling technique
• Can cool 500W/cm2 and keep component at lt 75C
• Intelligent controller monitor process
• Logs pressure, flow rate, temperatures
• Protects CCAs from low temp extremes (built-in
  heater to warm fluid)
• Automatic shutdown if pressure lost, fluid low,
  temp to high or to low

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Spray Cooling

• Technical
• Stable thermal operating environment - enhances
  reliability cards maintained (warmed/cooled) at
  optimum operating temps
• Vibration damping in chassis - no need to stiffen
  cards
• Misting of cards/filtering of fluid eliminates
  the need to HumiSeal or conformal coat the boards
• Extensive database and testing program to
  evaluate fluid compatibility issues and
  integration of HW
• Business
• 10 year relationship between NSA and ISR
• Contracts with the Marines (AAAV), Navy (EA-6B),
  Army (Crusader) and AFRL (F-16 RADAR Common
  module)
• Technology has flown on Rivet Joint
• Commercial applications - Cell towers

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System Design (Solid Wall Chassis)

• Overall System Wt.
• Main Chassis (with fluid) 74.3 lbs
• Auxiliary Chassis 6.3 lbs
• Total ISR Chassis Wt 85.3 lbs
• Estimated Complete Chassis Wt 137 lbs

-Est.Chassis Input Power 1285W
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Main Chassis Design
17.75
16.75
17.50
18.70
19.50
12.50
4.00
4.00
Dimensions shown at MMC in inches
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Auxiliary Chassis
15.50
5.50
6.92
9.44
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Schedule Advantages
Software
Hardware

• Processor Delivery Timeline
• Custom (Conduction Cooled) 6-12 months
• Commercial (Unmodified) 1 week
• HBSS spray cool design permits the use of
  unmodified 1st tier COTS (Non-Conduction Cooled)
  HW (Motorola, Sun, Intel etc. )
• Other designs require Conduction Cooled boards
• Re-spinning COTS boards to Conduction Cooled
  environment is a lengthy process
• Must wait 12-18 months for conduction cooled
  versions after initial commercial release
• Less than 10 of the market is Conduction Cooled

• Shorter Fielding Timeline
• HBSS open architecture supports timely porting
  of SW from National agenciesSpecial Signals 11
  months vs 10 years
• Board Support packages
• DY-4 (Conduction Cooled) 6-12 months after
  the release of board
• Motorola (COTS) 1 week
• 1st tier HW supported by 1st tier SW vendors
  (Motorola, Sun, Intel) vs conduction cooled
  boards which are supported by 2nd/3rd tier
  vendors

HBSS Design (Spray Cooling) minimizes the impact
of Moores Law (Every 18 Months Capability
Doubles)
I n t e g r i t y - S e r v i c e - E x c e l
l e n c e
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BACKUP SLIDES
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HBS Spray Chassis
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Chassis with plexiglass cover
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HBS Spray Chassis Inverted
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Chassis I/O Panel
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Chassis without Power Supply (two Northrop
Grumman load boards installed)
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P1 Spray Boats and NG-MS Backplane
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P2 Spray Boats
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Fluid Interconnect
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NG-MS Load Board in Chassis (component side
showing)
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Pump Housing
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Heat Exchanger view 1
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Heat Exchanger view 2
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VFTL CCA
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VSDL CCA - top
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VSDL CCA - reverse
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VRFC CCA - top
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VRFC CCA - reverse
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VIFD CCA - top
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VIFD CCA - reverse
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Hysol Application GUN
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Spray Chassis
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SPRAY CHASSIS IN TEST CONFIGURATION
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SPRAY CHASSIS IN TEST CONFIGURATION
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SPRAY CHASSIS IN TEST CONFIGURATION with power
applied