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FET Field effect transistor

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just a slab of n-type semiconductor !! like transistor, the drain ... gates, one can build adder, shifter, multiplier, logical unit, memory, and microprocessors ... – PowerPoint PPT presentation

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Title: FET Field effect transistor


1
FET (Field effect transistor)
  • Two main groups
  • JFET (junction FET)
  • MOSFET (metal-oxide-semiconductor FET)
  • Advantage
  • extremely large input impedance
  • Disadvantages
  • Smaller gain (gm) than bipolar transistor
  • More difficult to analyze

2
JFET
  • n-channel JFET
  • just a slab of n-type semiconductor !!
  • like transistor, the drain current is controlled
    by VGS

FET Bipolar Gate base Source
emitter Drain collector
3
JFET
  • n-channel JFET
  • PN junction
  • reversed biased

4
JFET operation
VG0
VD
  • VGS0
  • Max conducting channel, max drain current ID
  • VT ltVGS lt 0
  • pn junction is reverse biased
  • reduce the conducting channel
  • reduce the drain current
  • VGS lt VT (Pinch-off voltage)
  • Further reduce VGS until the depletion layer
    grows so wide that the channel is completely
    blocked
  • ID0

VS0
P
N
ID
VT ltVGlt0
VD
VS0
VGlt VT
VD
VS0
5
JFET as a voltage-controlled resistor
  • If VDS is small
  • VGS controls the channel width, and therefore the
    resistance
  • JFET is a voltage-controlled resistor

VG
VD
VS
6
JFET as a voltage-controlled current source
  • If VDS is large
  • the drain end is more reversed biased !
  • The channel is warped
  • Increase VDS gt increase depletion gt reduce ID
  • But increase VDS gt increase ID
  • Net result
  • ID remains constant even VDS is increased
  • A voltage-controlled current source

7
Saturation region
  • Small VDS - linear region (voltage controlled
    resistor)
  • Large VDS saturation region (constant ID,
    voltage controlled current source)

Linear region Small VDS JFET is like a resistor
8
ID vs VGS (saturation region)
  • IDSS
  • maximum current at VGS0 (widest channel width,
    smallest resistance)
  • different FET has different IDSS

IDSS
VP
9
ID vs VGS
  • The slope of ID vs VGS (gm) is less steep (not an
    exponential)
  • smaller gm, not as good as bipolar transistor
  • FET is difficult to analyze
  • Bipolar is easier to analyze because VBE 0.6V
  • VGS can vary over a wide range, usually analyze
    by graphical method (load-line)
  • The most important advantage
  • Input is connected to an reversed biased pn
    junction
  • Extremely high input impedance (IG0)

10
FET versus bipolar
  • FET is similar to bipolar transistor
  • Voltage-controlled current source
  • bipolar circuits can be used by FET

11
A simple current source
  • What is VGS?
  • What is ID?
  • The simplest current source !
  • But we cannot choose the current, as IDSS
  • may vary from transistor to transistor

12
An adjustable current source
  • Add a resistor RS so as to adjust ID
  • Find by load-line (graphical) method

VSG IDRS VGS -IDRS
13
gm of FET
Curve approx by a parabola
VT
14
Transconductance gm

15
k can be found by measuring gm at two points
  • At VGS0, measure gm (gm is maximum)
  • Find VT (corresponds to gm0)

16
Typical value of gm at ID1mA
  • JFET 2m A/V (from data book)
  • bipolar 40m A/V (by calculation gmIC /25mV)
  • Gain of bipolar is much higher than FET !
  • Why use FET?
  • extremely high input impedance
  • almost zero input current
  • good for picking up signal from source that has
    high source impedance
  • e.g. microphones, input stage of oscilloscope

17
Source Follower
  • Same as emitter follower
  • Output voltage (VS) follows input (VG)
  • DvG , DiD , DiDRS , DvS

18
Source Follower
  • AC signal analysis
  • if RSgm gtgt 1, then DVG DVS gt good follower
  • To have large RS, use current source (active load)

19
Output impedance
  • Fixed gate voltage, what is the output impedance
  • model the gate-source section by a resistor
  • DvOUT / DiD rS 1/gm (because DvOUT
    DVIN)
  • Typical value
  • gm 2m A/V, therefore rS 500W
  • The output impedance of source follower (500W) is
    much higher than emitter follower (25W)

20
Matched FET follower
  • The follower is made of matched FET
  • Q2 is a current source at VGS0 and ID2IDSS
  • Q1 and Q2 are matched,
  • Since ID1 ID2 , therefore
  • VGS1 VGS2 0V (!)
  • zero DC offset

21
FET amplifier
  • DvG , DiD , DvOUT -RDDiD
  • input and output are 180o out of phase, just like
    bipolar amplifier
  • gain
  • DiD gmDvGS
  • DvD -RDDiD
  • -gmRDDvGS
  • voltage gain -gmRD
  • same as bipolar amp except
  • gm is smaller

22
FET amplifier
  • DC bias
  • VGS -ID R
  • use load-line to find the
  • best R for VGS and ID

R
23
Hybrid op amp - best of both worlds
The tail, large impedance gives high CMRR
Push-pull class B amp
Mirror as active load. High gain
amplifier
Follower as buffer
24
Voltage Regulators
  • Input unregulated power supply (voltage is quite
    constant but still has some ripple)
  • Output regulated (constant) voltage

25
Voltage Regulator
  • Regulator Voltage reference follower
  • unregulated input provides the power
  • zener diode (Vref) provides the voltage reference
  • follower provides the output power and current

26
Dropout voltage
  • Dropout voltage
  • difference between input and output voltage

27
Dropout voltage
  • For 723
  • supply voltage of 9.5V (min) produces 5V output
  • Large 4.5V dropout voltage (not good), waste
    power
  • also requires too many external components
  • Modern regulators
  • dropout voltage 2-3V
  • Specialized low-dropout regulators
  • dropout voltage a few tenths of a volt

28
723
29
78xx family
  • A modern regulator that you would use
  • only need to provide a couple smoothing capacitors

30
High current output
  • Use parallel transistors to give high output
    current

31
Thermal runaway
  • Consider the bipolar transistors
  • different discrete transistor has different IC vs
    VBE curve
  • if one transistor conducts more current than the
    other
  • the transistor gets hotter
  • conduct more current !!
  • which makes the transistor hotter still, develops
    a local hot spot, may eventually break down

32
Thermal runaway
  • The use of the resistor R in the emitter follower
  • Negative feedback
  • If a transistor gets hot and conducts more
    current
  • VE is increased, providing a feedback voltage so
    that VBE is reduced, which reduces the current
  • FET does not have the problem of thermal runaway
  • Because FET has ve temperature coefficient
  • Increase in temperature reduces output current
  • Really large power amplifiers can be built using
    MOSFET as the output stage

33
Switching regulators
  • Regulators powered by microprocessors
  • run at 75-90 efficiency, more efficient than
    traditional regulators
  • transformer-less (so that the size is small)
  • but more noisy (high frequency noise)
  • Work by dumping charges into a capacitor via a
    switch
  • charges stored in the capacitor give a constant
    voltage

34
Switching regulators
Dump charge to cap
35
MOSFET (Metal Oxide Semiconductor FET)
  • Any current in the circuit below?
  • No current
  • one end must be reversed biased

n
n
p
36
MOSFET
  • Basic principle - capacitive effect

metal

- - - - - - - - - - - - -
charge
37
Enhancement MOSFET
  • Add a metal gate
  • Capacitive effect builds up a ve charge channel
    that allows electrons to flow

metal
insulator
gate
n
n
- - - - - - - - - - - -
source
drain
p
body
-ve charge, conducting channel
38
NMOS (n-channel MOS)
  • when gate voltage is zero, no drain current
  • drain current increases as gate voltage increased

39
Enhancement mode and depletion mode
  • Enhancement mode operation
  • No gate voltage, no conduction
  • Increase gate voltage increases the conduction
  • JFET
  • Depletion mode
  • no gate voltage, conduction is at its maximum

40
Enhancement MOSFET
  • if VDS is small
  • VGS controls channel width
  • IDS VDS
  • behaves as a variable resistor
  • Large VDS
  • VDS increase, drain becomes more positive
  • conducting channel becomes less -ve charged to
    the point that it will almost be vanished
  • Channel is warped
  • Saturation
  • increase in VDS also increase drain current but
    offset by the reduction in channel
  • Constant ID over a range of VDS

3V
5V
- - - - - - - - -
0V
warped
41
With PMOS (p-channel MOS)
  • Works in opposite polarity

42
MOSFET symbol
43
Digital circuits
  • Logic gates
  • the fundamental building block of digital
    electronics
  • AND, OR, NAND, NOR, INVERTER
  • with these gates, one can build adder, shifter,
    multiplier, logical unit, memory, and
    microprocessors

44
Inverter gate
  • NMOS (n-channel MOSFET) inverters

Output impedance at OFF state
VOUT
ON. Channel is conducting, drain is shorted to
ground, VOUT 0
OFF. Channel is non-conducting, ID0, VOUT VDD
45
Drawback of NMOS
  • ON state
  • draw current though R, large static power
    dissipation
  • OFF state
  • Large output impedance R
  • Large R gives small output current, which slows
    the switching speed of the circuit

46
Problems of NMOS
  • Large RD -gt takes longer to charge up Cstray

47
CMOS inverter (Complementary MOSFET)
  • PMOS NMOS
  • Input 0V, Output 5V
  • for NMOS (bottom one)
  • VGS0V, OFF
  • (open circuit)
  • for PMOS
  • VG 0V, VS 5V
  • VGS -5V, ON
  • (Short circuit)

(5V)
VGS -5V
VGS 0V
48
CMOS inverter (Complementary MOSFET)
  • PMOS NMOS
  • Input 5V, Output 0V
  • for NMOS (bottom one)
  • VGS5V, ON
  • (short circuit)
  • for PMOS
  • VGS 0V, OFF
  • (open circuit)

(5V)
VGS 0V
VGS 5V
49
CMOS
  • Output impedance
  • Either the PMOS or the NMOS is short
  • Zero W , tiny RC, fast switching
  • Static power consumption
  • output 5V
  • NMOS (bottom) is open circuit, draw no current
  • PMOS is short, draw no voltage
  • Power VI 0
  • output 0V (same, power0)
  • ideal for low power applications
  • e.g. mobile phone, notebook PC

50
Dynamic power dissipation
  • Dynamic power dissipation
  • Power consumes when there is a change of state
  • 0 -gt 1 or vice versa
  • CMOS draws power when the MOSFET is changing
    state
  • Both MOSFETs are partially conducting
  • Charging up the stray capacitor of next stage
    consumes energy

51
Both MOSFETs are conducting
52
CMOS - capacitive charging current
53
Dynamic power dissipation
  • Let the total stray capacitance C
  • Energy needs to charge up C
  • Energy needs to discharge C
  • Total energy needs per cycle
  • Total energy dissipation per second
  • High clock rate gt hotter and need larger heat
    sink
  • To reduce power
  • Reduce power supply voltage V
  • Reduce frequency (e.g. asychronous IC)

54
Why digital circuits use CMOS
  • Extremely small output impedance
  • Zero static power dissipation
  • No change of state, dont consume power
  • can go all the way to 0V
  • bipolar can only go as low as 0.2V (min VCE)
  • Simpler processing gt higher yields, lower costs
  • Smaller size gt smaller capacitance gt higher
    speed
  • The main problem is dynamic power dissipation

55
CMOS NAND gate
  • NAND gate can be used to build all other gates

56
Flash memory
  • Non-volatile memory for NMOS and CMOS
  • Add a floating gate
  • A layer of oxide sandwiched between insulators

Control gate
floating gate (layer of oxide)
insulator
n
n
- - - - - - - - - - - -
source
drain
p
body
57
Operation
  • To store logic 1
  • The oxide layer contains no charge
  • positive voltage at the control gate will turn ON
    the MOSFET
  • To store logic 0
  • Apply a high voltage (20V) across the floating
    gate
  • Breakdown the insulator, electrons trapped in the
    oxide layer
  • The electrons stored act as a screen, positive
    voltage at the control gate cannot turn ON the
    MOSFET (MOSFET is OFF)
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