THERMAL ISSUES J' Burger, M' Molina

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THERMAL ISSUESJ. Burger, M. Molina
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• C. Vettore
• M. Cova
• W. Du
• G. Xin
• A. Assenza
• R. Zambra
• A. Moroni
• H. Zhang
• J. Zheng
• A. Franzoso

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AMS-02 TCSStructural Test Article

• H. Zhang J. Zheng
• R. Zambra A. Assenza

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WHY NEED STA?
Requested by NASA when FE Analysis of the Flight
Model shows frequency lt 50Hz
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WHAT IS STA?

• Represent the static and dynamic behavior of the
  Flight Model
• Constraints
• Mass
• Center of Gravity
• Moments of Inertia
• Frequencies / Effective Mass

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FM OF RAM RADIATOR
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Crate Structure
STA
FM
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XPD Structure
STA
FM
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SHVGPS Structure
STA
FM
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RAM Radiator for STA
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Mass, CoG MoI
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Frequency and Effective Mass Comparisonfor RAM
Radiator
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RAM Radiator FM mode 1
RAM Radiator STA mode 1
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RAM Radiator FM mode 5
RAM Radiator STA mode 4
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RAM Radiator FM mode 9
RAM Radiator STA mode 9
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Frequency and Effective Mass Comparisonfor WAKE
Radiator
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WAKE Radiator FM mode 1
WAKE Radiator STA mode 1
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WAKE Radiator FM mode 4
WAKE Radiator STA mode 4
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WAKE Radiator FM mode 8
WAKE Radiator STA mode 8
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CONCLUSIONDifferences between FM and STA

• MASS lt2Kg
• CoG lt8.2mm
• MoI lt3.5Kgm2
• First Frequency lt3Hz

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AMS CDR
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RIDS status

• 87 RIDS submitted (by Boeing , NASA, MIT, Jacobs,
  CRISA)
• 6 withdrawn
• 13 rejected
• 35 closed
• 33 accepted with actions

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Main TCS requirements

• Allow AMS Electronics to be transported to the
  ISS during various phases (STS in free flight,
  STS docket to the ISS, transfer to ISS, switch
  on) with various power level availability
• Allow charging the magnet through CAB
• Keep Electronics within op / Non op range for 3
  to 5 years mission (and more) namely all Beta
  angle ranges.
• see Thermal ICD

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Main TCS requirements

• Provide a suitable sink to the Tracker TCS to
  perform nominally (i.e. to have a set point
  10C to 15C through the mission)
• Maximize the duration of time AMS electronics can
  survive without power (8 hours are the best
  available design goal for mission success from
  NASA)
• Provide a system of heaters that
• allow starting up AMS (bringing the electronics
  at min. op temp)
• Keep AMS within non.op temp ranges when needed

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Main TCS requirements

• all what above NOT affecting the subdetectors
• Each subdetector, in turn, is requested to
• Be able to be transported to the ISS during
  various phases (STS in free flight, STS docket to
  the ISS, transfer to ISS, switch on) with various
  power level availability
• Remain within op / Non op range for 35 years
  mission (namely all Beta angle ranges)
• see Thermal ICD
• Maximize the duration of time it can survive
  without power (8 hours are the best available
  estimate)
• Have a system of heaters that allow starting up
  or remaining within non.op temp ranges when needed

• We are coordinating this verification effort

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Subdetectors TCS

• Subdetectors TCS DESIGN is a separate task
• CGS is providing data to the subdetectors to
  allow them verifying their thermal design
• Special requests are considered case-by-case

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AMS analytical integration
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SUBDETECTORS THERMAL DESIGN STATUS
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2 TYPE OF ELECTRONIC UNITS
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Heat Pipes Layout
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Inserts and heat pipes

• 15 tested samples
• requested by NASA

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Heaters on Main radiators
Power density issue
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3 TYPE OF BRACKETS
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Tracker Radiator
Face Sheet (0.8mm / Al 2024T81)
CORE (15mm / Rohacell)
Face Sheet (0.2mm / Al 2024T81)
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TCS Radiator Panels
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Bracket between Main and Tracker Radiator
Al 2024 T81
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MLI
Weight issue
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AMS-02 120Vdc Heaters Summary C.Vettore
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PDS Heaters location
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PDS Heater patch panel
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Main Radiators Thermal Analysis

• M.Cova, C. Vettore, W. Du, G. Xin, F. Bodendieck

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Electronics Location
WAKE
RAM
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RAM Nodal Breakdown

• 953 Nodes for radiative face sheet
• 953 Nodes for crates face sheet
• 705 Nodes for ROACHELL
• 258 Nodes for HPs
• ? 2869 nodes

RAM
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WAKE Nodal Breakdown

• 1159 Nodes for radiative face sheet
• 1159 Nodes for crates face sheet
• 824 Nodes for ROACHELL
• 298 Nodes for HPs
• ? 3440 nodes

WAKE
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Thermal Analysis Results
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STS UNMATED ATTITUDE
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Crates I/F temperatures for the Worst Hot Case on
STS free flying

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ON ISS
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Crates main wall I/F temperatures for the Worst
Hot Operative Case on ISS
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Crates main walls I/F temperatures
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On STS free flying
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STS docked - hand off
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On ISS
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On STS free flying
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STS docked - hand off
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On ISS
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Subdetectors thermal analysisConclusions

• ECAL will operate for 97 of mission time
• RICH will operate for 93 of mission time
• No problem for LTA for the subdetectors
• Cooling down after 8 hours power outage is a
  marginal issue for ECAL that reaches -30.9C

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Subdetectors thermal analysis(TOF, ECAL, RICH,
HV BRICKS, E-CRATE)

• M. Cova, W. Du

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Lower ToF Thermal Requirements

• Operative Temperature Range
• -30C55C
• confirmed by test results
• Non Operative Temperature Range
• -40C60C
• confirmed by test results

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ECAL Thermal Requirements

• Operative Temperature Range
• -20C40C
• Non Operative Temperature Range
• -30C50C

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ECAL can work 97.2 in terms of mission time 7
hours survival time with no power
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RICH Thermal Requirements

• Operative Temperature Range
• -30C50C
• Non Operative Temperature Range
• -35C60C
• confirmed by test results

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RICH can work for Beta angles 55?b?75 and so
for 92.7 in terms of mission time
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E-crate Thermal Requirements

• Operative Temperature Range
• -20C50C
• Non Operative Temperature Range
• -40C80C

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EHV Thermal Requirements

• Operative Temperature Range
• -20C60C
• Non Operative Temperature Range
• -40C70C

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Star Tracker CCD Thermal Requirements

• Operative Temperature Range
• -30C55C
• Best Performance Operative Temperature Range
• -30C35C
• Non Operative Temperature Range
• -40C80C

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ACC PMTsThermal Requirements

• Operative Temperature Range
• -30C55C
• Non Operative Temperature Range
• -40C60C

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UPSThermal Requirements

• Operative Temperature Range (magnet charged)
• -25C50C
• Non Operative Temperature Range (magnet
  uncharged)
• -40C50C

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UMA Thermal Requirements

• Passive Half Spring
• Operative Temperature Range
• -67C164C
• Non Operative Temperature Range
• -67C164C
• Connector Backshell
• Operative Temperature Range
• -67C93C
• Non Operative Temperature Range
• -67C93C

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PVGF Thermal Requirements

• Operative Temperature Range
• -70C90C
• Non Operative Temperature Range
• -157C121C

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FRGF Thermal Requirements

• Operative Temperature Range
• -76C168C
• Non Operative Temperature Range
• -156C121C

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Propylene LHP
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Cryo-cooler Thermal Control Design

• LHP evaporator and bypass valve

Cryo-cooler
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Cryo-cooler Thermal Control Design
Two heater (Branch A and Branch B), one on each
evaporator side Each 42,9 W _at_126,5 V 2.52 W/cm2

• LHP assembly

CDR Heater will be smaller to increase power
density. GSFC suggestion from L.A. meeting.
Symmetric heating also to be considered.
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LHP Modelling
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LHP Modelling

• L-level and H-level nodal layout of the AMS
  cryo-cooler radiator

• The coarse H-l nodal break down (part of ESATAN
  Model) has 10 nodes
• The detailed L-l nodal break down (part of LHP
  Model) has 176 nodes

Outlet
Inlet
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Performance Prediction maximum heat transport
capability of 1 LHP LHP performance during
hottest case (Beta 75, YPR -15/-20/-15)

• Q 120 W for 1 LHP gt Tmax,Cryo 37.7C

In the worst hot case only 120 Watt can be
handled by a single LHP
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AMS OFF (coldest case considered)

• Q 158 W on 2 LHPs (bypass valves in radiator
  mode).

• Cooler at T-5.5C before switch-off. After
  switch off cooler temperature decreases to
  evaporator temperature of -22.5C during 25 min.
  Temperature almost constant (1C) during
  following hours.
• Feature to be tested with the EM

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LHP EM requirements

• First round table discussion on test required and
  EM configuration
• April 6, 2005 CERN

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EM testingWHAT CAN BE TESTED?

• Heat transport capability
• Dryout limit
• Power share between the 2 LHPs
• Performance degradation vs. time
• Shut-off capability in case of loss of power
• Performance after vibrations

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EM configuration

• It is composed by 2 LHP
• It has a bypass valve (whose setpoint is manually
  adjustable)
• It is based on the longest LHP geometry (bottom
  cryocooler)
• LHP is in flat config with same number and type
  of bends of the FM

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EM TESTS

• Vibrations
• Life test
• Power outage
• Filling Level
• Bypass valve performance characterization

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CAB thermal control concept for CDR
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CAB TCS design

• New power requirement
• From 600 W to 740 W (800 W in some operating
  modes)
• New (lower) I/F temperature requirements
• 40C instead of 50C
• With one LHP (connected to wake radiator, as
  baselined so far) CAB cannot charge the magnet

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Plans for system level design CGS tasks

• Enhance the heat exchange between CAB base-plate
  and LHP evaporator saddle at contact level (seems
  to be the current bottle-neck wrt. the maximum
  LHP rejection performance)
• Enlarge area
• Enhanced contact conductance, now assumed 1000
  W/m2/K

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Ideas for recovering CAB Thermal design

• Additional LHP(s)
• sunk to the WAKE radiator
• sunk to RAM radiator
• CAB unit on Wake radiator
• Reduce the gradient along the CAB base-plate
• Enhance the internal CAB thermal design
• Micro heat pipes in the modules
• Standard HPs directly in contact with modules
• Carbon fiber straps
• PCM embedded in a sandwich panel

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TCS Weight budget
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Additional MLI
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Missing MLI
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DThermal CDR - conclusions

• Is TCS design completed?
• Freeze the TCS configuration of the radiators
• Main RAM and WAKE standard fixation for CAB LHP
• Tracker radiator available area has been
  maximized wrt Tracker requirements
• TTCS needs to accept current configuration
• Zenith radiator
• EM will be built with curent configuration
• FM will wait until analytical results (LHP CDR,
  Summer 2005)
• No impacts foreseen on radiator area
• Proceed completing the detailed design (now at
  85)

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DThermal CDR - conclusions

• Whats next to get the go-ahead for
  manufacturing?
• Pending
• Heaters rework
• To meet new NASA power density requirement (3
  W/sq(in) instead of 3.5 W/sq(in) )
• Minimum power to switch on RAM electronics in
  coldest cases
• Inserts verification
• More samples tests (15) requested by NASA
• CAB thermal design
• standard fixation for CAB LHP(s)

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DThermal CDR - conclusions

• We know additional analysis will keep going till
  COFR (2 years and more)
• Data have been provided to JSE for the Flight
  Safety Review II

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Short time schedule

• Meeting in the afternoon about CAB
• Heaters design ready in less than 1 month

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Next milestones

• LHP CDR Summer 2005
• TTCS CDR Summer 2005
• LHP EM DELIVERY Fall 2005
• RADIATORS STA DELIVERY
• Fall 2005
• FM DELIVERY 2006

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REMARKS by NASA
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Configuration of TMMs

• I/F data delivery (environment) must undergo
  configuration control
• The way system level model and subsystem level
  model is put together will be documented by CGS
• AMS Thermal model is configured internally at CGS
• This should be documented outside as well
• Each subdetector model should be configured and
  provided to CGS for
• Review, approval and
• integration
• This addtional work requires additional resources

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Subdetector Models

• System level TCS choices vs. Subdetectors TCS
  status
• Are the subdetectors at a CDR stage, too?
• Sophisticated TMM bringing them down to a
  level that can be analytically integrated into
  system level thermal model
• Missing TMM
• Every TMM plan to do a subdetector TMM review
• Anything looks marginal should be thoroughly
  reviewed

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Power Outage Issues

• Concerns of being able to tolerate power off
  conditions for reasonable time period (goal is 8
  hours)
• Evaluating percentage of the year the 8 hours
  goal is respected