ELCT 762 Final Projects

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ELCT 762 Final Projects

• Structure Analysis by using HFSS

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General Project Description

• Given a reference restructure
• Task Compare to s-parameters of reference
  structure to test structure with Ansoft HFSS.
• Before you start, determine a hypothesis.
• Annotate and discuss assumptions
• Identify and discuss issues relating to accuracy.
• Summary Judgment against hypothesis.
• Full mark will be 20 points.

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Report Format is Power Point

• Use outline as described on previous page
• Size of document should be geared to 20 minutes
  if it were presented (20 pages).
• The theme is technical communication
• Audience is electrical engineers who may not
  experience with ANSOFT.
• Grading will be how well you communicate to the
  instructor.
• You need to choose a name for your project case
• Extra Credit determine the convergence of the
  S-parameters relation to the edge of ports (max
  2 points).
• Extra Credit Determine equivalent circuit in
  PSPICE. (Hint lookup peeling and step response.
  Max 4 pints )

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Basic microstrip structure - Cross section
5 mils wide W
s for CU 4.0e8 S/M
1 mil thick - T
er3.7 tan d 0.017
Dielectric height h1 4 mils Width1 inch
er3.7 tan d 0.017
Dielectric height h1 50 mils
er3.7 tan d 0.017
Dielectric height h1 4 mils
Bottom trace will not be used for some projects
Frequency range is 100 MHz to 10GHz
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Your job to create Top view
Start 1 square max for dielectric Need to
adjust dielectric Dimensions to structure
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Terminology
Terminal_1
Terminal_1
Terminal_2
Terminal_2
Port_1
Port_2
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Project 1 Compare DS21 and DS11 between
structures
s

• Between lines, s (edge to edge) 25 mils
• All lines 1in length
• 10 bends. 25 mils jog
• Line length is defined as the center of the
  lines.

s
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Project 2 Compare DS21 and DS11 between
structures
Via cross section

• Between lines, s (edge to edge) 25 mils
• All 1 length
• 10 vias. 10 mils cylinder, 20 mil anti via.
• Via spacing center to center is 50 mils

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Project 3 Compare DS21 and DS11 between
structures
Via cross section

• Between lines, s (edge to edge) 25 mils
• All 1 length ( include via length)
• 10 vias. 10 mils cylinder, 20 mil anti via.
• Via spacing center to center is 50 mils
• Trace connect on other side of board

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Project 4 Compare reference db s21 to 10 times
db of s21 small section

• Between lines, s (edge to edge) 25 mils
• All 1 length
• Test case is 100 mils long

100 mils wide
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Project 5 Compare DS21 and DS11 between
structures

• Between lines, s (edge to edge) 25 mils for
  reference
• 5 mils space (edge to edge) for test case.
• All 1 length
• Trace connect on other side of board

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Stackup for last
1 mil thick - T
er3.7 tan d 0.017
Total height b 57mils
Dielectric height h1 55mils
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Differential S Parameters
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Differential S Parameters (contd)