All about eBeam Initiative

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SAN JOSE, CALIF., February 24, 2009
20 Electronics Industry Leaders Collaborate to
Accelerate Development and Adoption of Design for
E-Beam Technology.
eBeam Initiative Aims to Increase Design Starts
and Reduce Time-to-market in Semiconductor
Industry
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Mission  The Initiative provides a forum for
educational and promotional activities regarding
a new design-to-manufacturing approach, known as
Design for e-beam (DFEB), that reduces mask costs
for semiconductor devices.
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• Technology 
• DFEB is a design and software approach to enhance
  the throughput of e-beam lithographic exposure.  
  
• DFEB uses character or cell projection (CP)
  technology combined with design and software
  techniques to reduce a design's required shot
  count.
• This results in increased CP e-beam direct-write
  (EbDW) throughput.

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Applications  Systems companies seeking all-layer
custom SoC prototypes low-to-mid-volume
semiconductor companies producing maskless test
chips, engineering samples, and derivative chips
and supercomputing applications.
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Design Team Advisors  Provide business and
technical insights and requirements to the
Steering Group Ecosystem members.
Martin Deneroff Director of Engineering, D. E.
Shaw Research (DESRES) Martin Deneroff heads the
Engineering subgroup at DESRES. With over thirty
years of experience in the electronics industry,
he is an expert in computer system architecture
and development.
Jack HardingChairman, President CEO, eSilicon
Corporation Jack Harding is responsible for
eSilicon's overall leadership, strategy and
management. Mr. Harding brings more than 25 years
of management experience in the semiconductor
industry, spanning the EDA and IC sectors.
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Design Team Advisors  Provide business and
technical insights and requirements to the
Steering Group Ecosystem members.
Colin Harris Chief Operating Officer, PMC-Sierra
Colin Harris is responsible for all aspects of
worldwide manufacturing, including supplier
relationships, product testing and assembly. He
also oversees quality and reliability, product
engineering, information technology and design
services.
Riko Radojcic Principal Engineer Manager,
Qualcomm Riko Radojcic is a leader of
Design-for-Technology initiatives at Qualcomm
CDMA Technologies-addressing design for 3D
integration, manufacturability, and variability
methodologies at polygon, circuit, logic and
system design levels.
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Design Team Advisors  Provide business and
technical insights and requirements to the
Steering Group Ecosystem members.
Jean-Pierre Geronimi CAD Director,
STMicroelectronics Jean-Pierre Geronimi is CAD
director at STMicroelectronics. Mr. Geronimi
graduated from INPG Grenoble in electrical
engineering and computer science. He has more
than 20 years of experience in design automation
and VLSI implementation.