ITRS 2005 Factory Integration Chapter Facilities Backup

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ITRS 2005 Factory Integration Chapter Facilities
Backup

• Details and Assumptions for Technology
  Requirements and Potential Solutions

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Contributors to the Facility Section

• Mike Alianza (Intel)
• Hal Amick (Colin Gordon Assoc)
• Bill Acorn (ACS)
• Arnold Canales (Kinetics)
• Al Chasey (ASU)
• Kandi Collier (Intel)
• Theron Colvin (Microchip)
• Carl Garrison (Hoffman Const)
• Ken Goldstein (CCI)
• Abbie Gregg (AGI)
• Larry Hennesey (IDC)

• Dave Jones (Air Products)
• Todd Lasater (Intel)
• Bill Matsukado
• Phil Naughton (International SEMATECH)
• Mike Ohalloran (IDC)
• John Plata (TI)
• Jim Wermes (HDR)
• Don Yeamen (MW Zander)

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Backup Outline

• Facility Scope
• How Metrics were Selected
• Facilities Technology Requirements Table
• Translating Facilities Technology Requirements to
  Reality
• Supporting Material for Facilities Technology
  Requirements

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Facilities Scope

• Facilities Definition
• All buildings and infrastructure directly
  associated with manufacturing
• The biggest tool in the factory
• Scope
• Building (Fab, E-Test, Probe, Labs)
• Clean room
• Labs
• Plumbing
• HVAC
• Utilities and piping
• Facilities support space gases, exterior (CUB)
  space, tanks
• UPS
• Direct manufacturing people space
• EHS space scrubbers, showers, emergency
  response areas
• Life Safety Systems LSS
• Factory Management System or BAS
• Waste treatment
• Power and Power Generation (outside US)
• All infrastructure up to the back of the
  production equipment (pipes, power lines, etc.) 

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Pictorial of the Facility
Filters, Airflow and HVAC
Production Equipment (not included)
Material Handling Equipment (not included)
Labs
UPS
Central Utility Building (CUB) Support space for
gases, exterior tanks, waste treatment,
emissions, etc.
EHS Support
Mfg People Space
Telecom
Cleanroom
Network
Pipes, Gases, Plumbing
Sub-Fab
Support Equipment
Power Generation
Factory Management Systems
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How Metrics were selected

• Almost every metric is a best in class or close
  to best in class
• Sources are Rob Leachmans published 200mm
  benchmarking data, individual IC maker feedback,
  Trecenti/UMC 300mm joint venture published data,
  and I300I Factory Guidelines for 300mm tool
  productivity
• It is likely a factory will not achieve all the
  metrics outlined in the roadmap concurrently
• Individual business models will dictate which
  metric is more important than others
• It is likely certain metrics may be sacrificed
  (periodically) for attaining other metrics
  (Example OEE/Utilization versus Cycle time)
• The Factory Integration metrics are not really
  tied to the technology nodes as in other chapters
  such as Lithography
• However, nodes offer convenient interception
  points to bring in new capability, tools,
  software and other operational potential
  solutions
• Inclusion of each metric is dependent on
  consensus agreement

We think the metrics provide a good summary of
stretch goals for most companies in todays
challenging environment.
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Construction, Equipment, and Manufacturing
Timeline

• Metrics
• Facilities Ground Break to Area ready for 1st
  tool
• Facilities Ground Break to all facilities
  systems go
• Equipment From PO to move-in
• Equipment Area ready to 1st tool move-in
• Equipment 1st tool move-in to tool qual
  complete
• Equipment Qual complete to full throughput
  capable
• Operations 1st tool move-in to 1st full loop out

Ground Break
Ground Break to Area ready for 1st tool
Tool install and facility systems operational
1st tool move-in to tool qual complete
PE Purchase Order to 1st tool move-in
Qualify complete to full throughput capable
Pilot Line operating
Factory Ramp
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Translating Facilities metrics to Reality (1)
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Translating Facilities metrics to Reality (2)
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Translating Facilities metrics to Reality (3)
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Translating Facilities metrics to Reality (4)
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Translating Facilities metrics to Reality (5)
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Prod Equipment Backup slides based on
Facilities WG inputs
Reduce Make-up and exhaust requirements for
production equipment
Design tools to ensure isolation for Clean
Maintenance during routine maintenance activities
Design tools to operate within mainstream
facilities services capabilities
Provide better quality utility data requirements
for equipment
Heat load removal by increased use of
Process Cooling Water
Limit Size and Weight of move-in modules to
minimize move-in aisle widths
Predictable consistent tool connections for
Utilities, Drains, Exhaust, Interconnects
Use higher efficiency (higher Voltage not
current) power distribution. (gt 480V, 3 phase,
today most are 208V, single phase, very high
current)
Production equipment must not be affected by use
of mainstream wireless technologies (cell
phones, pagers, PDA, etc)
Side view (Prod Equip)
Raised floor
Physical Separation of waste streams
Develop Power and Waste Reduction capabilities
Develop adaptor plates/docking stations for
interfacing tools to facility infrastructure
Shadow footprint in sub-fab
See Next Page for Additional Details
Sub-fab space support equipment must fit into
shadow footprint as determined by prime
manufacturing area
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Feedback to Prod Equip Team from Facilities
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Facilities Standards
SEMI E6 - Guide for Semiconductor Equipment
Installation Documentation SEMI E26.1 Radial
Cluster Tool Footprint 300mm Standard SEMI E51 -
Guide for Typical Facilities Services and
Termination Matrix SEMI E49 Series Guide for
Standard Performance, Practices, and Sub-Assembly
for High Purity Piping Systems and Final Assembly
for Semiconductor Manufacturing Equipment SEMI
E70 - Guide for Tool Accommodation Process SEMI
E72 Specification and Guide for 300mm Equipment
Footprint, Height, and Weight SEMI E76 Guide
for 300mm Process Equipment Points of Connection
to Facility Services
Standards Needed Raised Floor Heights
Routing Layers of Plumbing Use of Space below
Aisles for Equipment Support Energy Efficiency
Ratings (energy Star) Cleanroom Height
Standards (Equipment in E72)
Legend -gt Standards Exist -gt Standards Are Under
Development -gt Standards Are Needed
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Vibration Criteria Curves
Ref New vibration criteria to be implemented in
IEST RP-CC012.1, Considerations in Cleanroom
Design, Institute of Environmental Sciences and
Technology, Mt Prospect, IL,
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Ref Numerical definition of criterion curves in
IEST RP-CC012.1, Considerations in Cleanroom
Design, Institute of Environmental Sciences and
Technology, Mt Prospect, IL
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Next Generation Wafer Size Facility Input
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Next Generation Wafer Size Facility Boundary
Conditions
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450mm Facility Boundary Conditions
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450mm Facility Boundary Conditions
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AMHS Thrust Team Feedback

• Facility
• Why a 14' ceiling height? Tool height, move in
  path? What drives this recommendation?
• What about retrofits into existing facilities w/
  12, 16, 20, etc. ?
• What about under-floor transport concepts?

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First draft 450mm Factory Design with conveyor
solution ( floor installation )
How does this impact tool installation with under
floor utility distribution?
space for one carrier ?
LP1
LP2
LP3
LP1
LP2
LP3
Transfer units
Buffer 4
IN( Fast Lane )
OUT
Courtesy of H. Heinrich Infineon Technologies
Dresden
Buffer 3
Buffer 1
Buffer 2