Information ber die Sensorikrelevanten Frderprogramme der EU

1
Information über die Sensorik-relevanten
Förderprogramme der EU

• Sensor Test 2008 Nürnberg, 6 Mai 2008
• Thomas REIBEMicrosystems UnitEuropean
  Commission, Brussels

2
Presentation outline

• Microsystems Flexible, organic large area
  electronics Microelectronics Embedded Systems
• Sensors in the EU Framework Programmes
• European Technology Platforms (ETP)
• FP7 outcome of the first 2 ICT calls
• The way ahead in Work Programme 2009-2010

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Micro and nanosystems technologies play a crucial
role in modern knowledge-based economies

• Microsystems technologies is one of the most
  important drivers of ICT, which account for about
  40 of Europes productivity growth

• The relevance of Microsystems comes from

• The importance of the semiconductor and
  micro/nanoelectronics market
• The added value that the smart systems provide
  to the applications and systems where they are
  integrated

• RD institutes play an important role in the
  early phase of the MNT development, prior to
  industrialization

Europe has a traditional leading position in
Microsystems and related advanced technologies
and should capitalize on this competitive
advantage
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RD in Microsystems in the EU Framework
Programmes from MEMS to Smart Systems
FP4
FP5
FP6
FP7
Smart Systems Complex systems combining sensing,
processing and actuating
Micro and Nanosystems Micro and
Nanotechnologies Industrial applications of MEMS
Smart Systems Heterogeneous technologies for
multifunctional systems
MEMS
The EU Framework Programmes have always paid
attention to the area of Microsystems, from a
focus on MEMS in the early 90s to heterogeneous
technologies for multifunctional systems now
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Microsystems is an enabling technology, bringing
together separate technologies and sciences

• Inter-disciplinarity
• Mechanics, electronics, fluidics, biology,
  magnetism, optics, photonics, chemistry,

Applications

• Biomedical
• Transport
• Telecommunications
• Automotive
• Safety
• Environment
• Smart textiles,

• Convergence of heterogeneous technologies
• Micro/nanotechnologies, ICT, bioengineering

• Heterogeneous Materials
• Semiconductors, ceramic, glass, organics and
  polymers, metals

• Multiple functionalities
• Sensing, processing, actuating, energy harvesting
  and storage, communication, memory, logic

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Flexible, Organic and Large Area Electronics
(OLAE), towards heterogeneous integration

• Inorganics/organics combinations, bio
  heterogeneous integration in foils, lab-on-chips,
  printed logic and RFIDs also addressed
• New manufacturing paradigms very low cost
  applications

Enabling functions logic, memory, RFIDs,
sensing, lighting, signage, energy
scavenging/storage power management,
visualisation systems and displays
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Sensors/Microsystems OLAE activities in FP6
Wireless sensor networks
Total budget 301M
6 projects
104 projects (21 IPs, 2 NoEs)
Sensor-based systems storage
Micro/Nano-bio ICT
24 projects (6 IPs)
55 M
101 M
11 projects (4 IPs)
Organic electronics displays
5 projects (3 IPs, 1 NoE)
AmI
35 M
54 M
10 projects (3 IPs, 1 NoE)
Smart textiles
8 projects (4 IPs)
Mfg/Process integr.
11 projects
Support Coordination
31 M
6 M
47 M
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ETPs, an industry led forum conceived to support
the European Research and Innovation Area
A spiral model of innovation

• Capitalising on the multiple reciprocal
  relationships between public private
  stakeholders,
• Addressing major technological challenges in
  specific domains
• Aiming to leverage public private investment
  for RD innovation
• Bundling fragmented RD efforts towards agreed
  goal
• Boosting Europes competitiveness via research
  and innovation

ETPs are defining and implementing the Strategic
Research Agendas (SRAs) medium to long term key
objectives for the technology
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ETPs, a key organisational innovation in the
creation and exploitation of innovation-friendly
markets

• ... And some figures
• 34 ETPs, 9 in ICT
• More than 700 organizations involved in ETPs
  (large companies, SMEs, universities, research
  labs, ...)
• 9 SRAs in ICT field, a very important input to
  ICT WPs

• Some benefits from ETPs
• Speed up innovation by knowledge sharing
• Pool of resources to overcome technology
  roadblocks
• Build partnership to share risk
• Attract higher research investment in Europe
• Optimise the return of public private
  research investment
• Help turn research results into marketable
  products and services
• Boost industrial competitiveness and meet
  societys needs

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There are 34 ETPs successfully working, 9 in ICT

To boost the development of robotics business
bringrobotics services to Europes
citizens New software services
architecturebased on open standards To
reinforce Europes world leadership in mobile
wireless communications services To explore
the almost limitless applications of lightfor
ICT, lighting, manufacturing and health
applications Convergence of existing and new
media technologies creating advanced personalised
servicesAn integral Satcom initiative covering
all aspects ofsatellite communication To address
the needs of silicon-basedtechnologies
beyond Ubiquitous, interoperable
cost-effective embedded systems
www.roboticsplatform.com
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EPoSS, the ETP in Smart System Integration
A multi-disciplinary endeavourCombining optics,
mechanics, electronics, fluidics, thermodynamics,
chemistry, biology Converging scientific
disciplines Looking at the overlapping areas
between nano-, bio-, information cognitive
sciences Multi-material integration
Semiconductors, polymers (plastics), ceramics,
glass, Multi-technology integration
Monolithic, hybrid, multichip, large-area,
miniaturisation techniques Multi-functional
integrationCombining sensing, processing,
actuating
www.smart-systems-integration.org
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Results from ICT first calls

• ICT call 1  Next generation Nanoelectronics
  Components and electronics integration  related
  to More than Moore
• ICT call 1  Organic large area electronics,
  visualisation and display systems 
• ICT call 2 Micro/nanosystems 
• ICT call 2  Networked Embedded and Control
  Systems  related to wireless sensor networks

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FP7 Projects - NanoelectronicsMore than Moore

• FP7 Call 1 in Nanoelectronics covered
• More Moore to advance miniaturization in
  baseline CMOS technology
• More than Moore to master diversification
  targeting non-digital applications, heterogeneous
  integration in Systems-on-Chip (SoC) or
  Systems-in-a-Package (SiP)
• Beyond CMOS to prepare for the technology
  generation beyond the CMOS scaling

• FP7 ICT Call 1on Nanoelectronics
• Total budget 86 M
• More than Moore 32 M
• Beyond CMOS 3 M
• More Moore Miniturisation 51 M.

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FP7 More than Moore Example of projects
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Flexible, Organic and Large Area Electronics, an
emerging field

• FP7 ICT Call 1on Organic and Large Area
  Electronics
• Total budget 63 M
• 20 new projects funded in Organic and Large Area
  Electronics
• 13 new projects in the field with a EU funding
  of 43M
• Emergence of large area/inorganics large area
  sensor and memory.

• Flexible, organic and large area electronics
  have a high potential market growth
• New large area electronic device processing
  capabilities are acting as a powerful driver
• In FP6 and FP7, the EC has funded 31 projects
  in this field with a contribution exceeding 140
  M
• The focus is on large area electronics and
  materials for low cost manufacturing and
  subcomponents like energy scavenging and storage,
  memories, sensors and OLEDs and flexible displays

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(a) Organic Large Area Electronics
Flexible, Organic and Large Area Electronics in
FP7
(b) Display Systems Visualisation
42.5M
20.5M


OLEDs
BIND
POLYNET (NoE) FACESS PRODI (CSA) OLATRONICS
IMVIS MEMI HELIUM3D
FLAME
OPERA (CSA)
AEVIOM POLYMAP (CSA)
Real3D MAXIMUS
AMAZOLED
HYPOLED
COMBOLED FAST2LIGHT (IP)
3PLAST PRIMEBITS
http//cordis.europa.eu/fp7/ict/organic-elec-visua
l-display/projects_en.html
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Micro and nanosystems in FP7
FP7 ICT Call 2 Micro and nanosystems Total
budget 83 M

• Next generation smart systemsSensor-
  actuator-based systemsHigh density mass storage
• Micro/Nano-Bio-ICT convergence
• Biosensors, lab-on-a-chip, bioMEMS,autonomous
  implants
• Integration of smart materials
• Integration of MST and smart systems into new
  traditional materials, e.g. textiles, glass,
  paper
• From smart systems to viable products
• Microsystems manufacturing technologies
• Smart systems for communications data
  management
• Smart micro/nanosystems enabling wireless access
  facilitating intelligent networking
• Support actions
• Technology access, education training,
  coordination and dissemination at EU level

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Areas covered after Call 2 on Micro/nanosystems
Manufacturing (1IP, 3 STPs, 16.85 m)
Under negotiation
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Micro-Nano-Bio Convergence

• Micro/nano/bio technologies, biosensors, LoC
• LabonFoil Ultra low cost laboratories on chip
  
• PYTHIA Monolithically Integrated
  Interferometric Biochips for label-free Early
  Detection of Human Diseases
• MicroFLUID Micro-Fabrication of polymeric
  Lab-on-a-chip by Ultrafast lasers with Integrated
  optical Detection
• ULTRA Ultra-fast electronics for Terahertz
  Rapid Analysis in compact lab-on-chip
  applications
• Micro-robotics and integrated micro-systems for
  endoluminal surgery (ARAKNES)
• Micro-Nano Sensors transducer based systems
• ULTRAsponder In vivo Ultrasonic Transponder
  System for Biomedical Applications
• MiniSurg Miniaturized Stereoscopic Distal
  Imaging Sensor for Minimally Invasive Surgery
• NANOMA Nano-Actuators and Nano-Sensors for
  Medical Applications
• Multichannel Electrode systems
• TIME Transverse, Intrafascicular Multichannel
  Electrode system for induction of sensation and
  treatment of phantom limb pain in amputees

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Micro/Nanosystems for Energy/power

• DATA STORAGE
• SUPARSS Super-Resolution for Advanced Storage
  Systems
• TERAMAGSTOR Terabit Magnetic Storage
  technologies
• ENERGY STORAGE
• E-STARS Efficient Smart sysTems with enhAnced
  eneRgy Storage
• GREENBAT GREEN and SAFE thin film Batteries
  for flexible cost efficient energy storage

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MEMS-NEMS and Integration

• MEMSPACK Zero- and First-level packaging of
  RF-MEMS
• NEMSIC Hybrid Nano-Electro-Mechanical/Integrate
  d Circuit Systems for Sensing and Power
  Management Applications
• ARASCOM MEMS and Liquid Crystal based, Agile
  Reflect-array antennas for Security and
  Communication
• TUMESA MEMS tuneable Metamaterials for Smart
  Wireless Applications
• MAC-TFC MEMS Atomic Clocks for Timing,
  Frequency control and Communications
• MEMFIS Ultra-small MEMS FTIR Spectrometer

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Manufacturing

• MEMS4MMIC Enabling MEMS-MMIC technology for
  cost-effective multifunctional RF-system
  integration
• SMARTHIES Smart inspection system for high
  speed and multifunctional testing of MEMS and
  MOEMS
• TIPS Thin Interconnected Package Stacks
• HERMES Large area manufacturing and high
  density integration of electronic circuits

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Support Actions

• EuroTraining-MST SA on Microsystems and smart
  systems integration training
• SYSTEX CA to enhance the breakthrough of
  intelligent textile systems
• CEPoSS Coordination action on smart systems
  integrated technologies

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Call 2 Strategic Objective Wireless Sensor
Networks

• Target for sub-area wireless sensor networks
• TWO orders of magnitude more sensors
• HALF the maintenance time and cost
• ONE order of magnitude less effort
• New services and applications tailored to
  specific needs

FP7 ICT Call 2 Networked Embedded and Control
Systems Total budget 47 M
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EU-funded Research in FP7 Wireless Sensor
Networks

• Networked Embedded and Control Systems
• CHOsen Automotive and Aerospace
• CONET WSNs and Cooperating Objects
• GINSENG Energy Distribution
• IPAC Plant control Traffic Management Crisis
  management
• LocON Localisation large-scale infrastructures
• PECES Automotive Localisation
• POBICOS Home Automation and Energy-Efficient
  Buildings
• SM4ALL Smart Homes and Home Care

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Photonic Sensors Projects Supported by DG-INFSO
Photonics Unit
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The way ahead the preparation of WP2009-2010
ETPs
ICTC
EC
Dec 07
June 08
Dec 08
June 09
Consultations
Drafting
Decision
Call 4
Call 5
Orientation paper
Draft WP
Final WP
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Microsystems and Smart Systems Work programme
2009-10

• Strengthen project portfolio in the area
• FP6 and FP7 call 2
• Emphasis on intelligence integration
• Multisensing, context awareness
• Smart systems based on innovative nanosensing
  principles
• Nanowires, CNT-based MEMS
• Specific chapter on autonomous energy efficient
  smart systems
• Energy scavenging, power generation, efficient
  communication

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WP 09-10 Flexible, organic and large area
electronics
Vision from 20.2.2008 consulation meeting

• Objective should continue the orientation defined
  in the previous work programme, if no additional
  budget is becoming available.
• Research should focus on material-device
  co-developments and system integration, based on
  functional building blocks, measurement
  inspection, quality control and automation.
• Building blocks are important TFTs, sensors,
  memories, energy sources and power management,
  OLEDs for displays lighting, organic
  photovoltaics etc.
• Emphasis on inorganic / organic material thin
  layer structuring
• Fundamental research should be in parallel with
  applied research leading to device demonstrators
  for short term applications, including field
  tests.
• Support measures should facilitate
  standardisation, training and education
• International collaboration might be beneficial
  but also difficult.
• All instruments IPs, Streps, NoEs, CA SSAs are
  appropriate, but STREPs and IPs should not
  compete for the same budget.
• Next call should be published as soon as
  possible.

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Future calls Nanoelectronics

• FP7 WP09/10
• Miniaturisation and functionalisation
• Manufacturing technologies
• Design of semiconductor components and electronic
  based miniaturised systems (in a separate call)

• ENIAC Call 1 (to be published on 8 May 08 at
  http//www.eniac.eu )
• Nanoelectronics for Transport and Mobility
• Nanoelectronics for security and safety
• Nanoelectronics for energy and environment
• Design methods and tools for nanoelectronics
• Equipment and materials for nanoelectronics

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WP 09-10 - Engineering of Large-Scale, Complex
Networked Systems

• Wireless Sensor Networks
• Facilitate the deployment, activation, operation
  and low-cost maintenance of distributed systems
  composed of heterogeneous networked smart
  objects, e.g. in manufacturing, process plants,
  buildings and large scale infrastructures, aiming
  at flexibility, reliability, dependability,
  safety, security and energy efficiency, as well
  as lower cost
• Focus on
• semantics that allow object/service definition
  and instantiation
• abstractions and support tools to facilitate
  (re)programming
• lightweight operating systems and kernels
• open wireless communication protocols for harsh
  (industrial) environments
• virtual sensing/actuation through aggregation of
  sensors/actuators
• novel large-scale applications of wireless sensor
  networks

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Photonics Work programme 2009-10

• Key applications and social needs
• Lighting and light sources
• Biophotonics
• Communications
• Cost effective high-performance imaging for
  Safety Security
• Highly integrated components for high average and
  high peak power lasers (ICT industrial
  applications)
• Organic Photonics
• Disruptive technologies

Particularly relevant for Heterogeneous
Integration
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Thank you!

• European research on the web
• http//cordis.europa.eu
• http//cordis.europa.eu/fp7
• http//ec.europa.eu/comm/research/future/
• Information Society and Media
• http//cordis.europa.eu/fp7/ict/programme/challeng
  e3_en.html
• Contact
• thomas.reibe_at_ec.europa.eu
• augusto.dealbuquerque_at_ec.europa.eu