Rochester Hills Process Facility

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Rochester Hills Process Facility

• Jeff Fournier
• Rochester Hills Process Team
• April 2009

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Rochester Hills Process

• Process Facility
• Sputter DepositionTools
• MOCVD
• RIE PECVD
• Photolithography
• Wet Chemistry
• Metrology
• Materials Lab

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Facility

• 300 ft2 of Class 1000 clean room
• 1200 ft2 of Class 10000 clean room
• 1500 ft2 of support space
• DI H20 purification loop
• Orbitally welded high purity gas system
• Facilities for CDA, house vacuum, closed loop
  chiller loop, and house N2

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Sputter Deposition Tools

• KDF 3 target
• 3 target inline sputter
• KDF 4 target
• 4 target inline sputter
• OSMP cosputter
• 3 confocal cosputter plus 3 additional
• KDF Ci Cluster tool
• State of the art cluster tool
• Sputter etch / RPC
• 3 confocal cosputter targets
• Degas chamber
• Heated electrodes to 500C

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KDF sputter tools

• Sputter deposition
• 3 or 4 target
• load locked
• Multiple substrate size up to 12 inch
• Sputter etch
• Substrate degas and heat
• DC and RF magnetron
• Reactive sputter capability

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KDF 643 GT
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KDF 3 target Sputter Tool
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KDF 4 target sputter tool
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KDF Ci Cluster Tool

• Description
• PVD deposition cluster tool for materials
  research and device fabrication
• 8 inch capable
• Degas module
• Soft Sputter Etch / RPC module
• 3 magnetron co-sputter module 3 inch guns
• 2 single magnetron modules 6 inch guns
• Brooks Marathon robot module
• All process deposition modules with shutters and
  heat capability to 500C

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OSMP Sputter Tool

• Research Tool
• Three 6 magnetron sources
• Cluster of three 3 inch confocal magnetron
  sources
• High vacuum load lock
• Substrate Heat
• Substrate Rotation
• Large inventory of sputter materials
• Sputter up configuration
• Reactive sputter capability
• RF and DC pulsed power

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Co-sputter Advantages

• 3 magnetron cluster for alloy research
• Co-sputtered materials with two or three sources
• Quick turn alloy development without tooling
  target
• When desired material is achieved targets are
  fabricated in house

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RIE/PECVD

• Trion cluster tool
• 3 process modules dep/etch(2)
• Loadlocked cluster configuration
• HBr/Cl2 Module, metal, chal etch
• F Module breakthrough, carbon etch
• PECVD Module, Si3N4, SiO2
• ICP capability on all modules
• Endpoint detection

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Trion RIE/PECVD
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RIE/PECVD gases

• Etch
• HBr
• Cl2
• SF6
• O2
• CF4
• CHF3
• He

• Deposition
• SiH4
• NH3
• N2O
• H2
• He
• NF3
• TEOS

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CVD Equipment Corporation MOCVD Cluster Tool

• Cluster Tool configuration
• Thru wall installation into cleanroom
• Multi chamber
• MOCVD module
• PECVD module
• Sputter Etch module

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Lithography

• Karl Suss MA6 aligner
• Feature size 0.7 micron
• Contact
• 8 capable
• Currently processing 2x2, 8 wafers and 6
• Raith e-beam
• lithography tool - 50nM min features

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Karl Suss Aligner
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Raith e-beam
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Lithography

• CEE spinner
• Manual load auto dispense
• PR spinning, spin developing
• PR soft and hardbake
• 8 capable, currently processing ¼ 8 and 6
  silicon as well as coupons
• Develop hood
• MTI track system
• 6 spin, bake, develop, cassette to cassette

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MTI Track System
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Wet Chemistry

• Acid bench
• 3 tanks, rinse dumper, sink
• Solvent bench
• 3 tanks, rinse dumper, sink
• Acid bench CMP
• Dedicated CMP clean bench
• Spin Rinse Driers (2)

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Air Control Wet Benches
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Metrology

• Dektak profilometer
• FSM stress temp
• Nanometrics optical thin film thickness
• Geartner Ellipsometer
• Nikon optical microscope
• 4 point probe
• Romulus stud pull/mechanical adhesion tester

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Metrology
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Misc Equipment

• YES vacuum oven
• Glen Asher
• YES Vapor prime oven
• Jiplec RTA
• Strausbaugh CMP
• MRL Tube Furnace

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Materials Lab

• In House Sputter Target Fabrication
• Hot Vacuum Press
• Bonding
• Quick Turn
• Research and Production Tool Products

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Materials Lab