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Mass Market Wireless Multimedia

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TI Wireless Technology. Consumer Brand OEMs. Communications. OEMs. China Local Brands ... Architectural and Technology Solutions for Wireless Multimedia ... – PowerPoint PPT presentation

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Title: Mass Market Wireless Multimedia


1
  • Mass Market Wireless Multimedia
  • The Chipset Challenge of Smaller, Faster,
    Cheaper

Tom PollardWorldwide Chipset Marketing
DirectorTexas Instruments Incorporated
2
Evolution in TI Wireless Chipset BusinessDiverse
Customers with Varying Product Requirements
TI has shipped over 1 Billion cellular digital
baseband processors for wireless handsets
3
Giving Consumers What They WantExpectations
derived from 2G Wireless and the Internet
Small size, stylish design Handsets as a fashion
statement
Long battery life Learn from the mistakes of
initial WCDMA handsets
Rapid reductions in handset cost Consumer market
pricing for broad acceptance
User choice of applications and content In search
of the killer app
Simplicity and immediate gratification Fully
integrated wireless appliances
The Challenge Handheld Wireless Multimedia for
the Mass Market
4
Architectural and Technology Solutions for
Wireless MultimediaRequired -- A multi-pronged
approach to meeting the challenge
  • Power-efficient applications and communications
    processing
  • Open Platforms for SW Innovation
  • System Integration for Handset Optimization
  • Integration at the Chipset Level for Power and
    Size Reduction

5
2.5G/3G Handset System IntegrationWireless
Terminals require Antenna to Applications
solutions
  • Communications processing
  • Digital, Analog, and RF chipsets
  • Protocol stack software
  • Applications Processing
  • OMAPTM Applications Processors
  • Operating system support and Java
  • OMAP Developers Network
  • Additional wireless technologies
  • Bluetooth, 802.11, and GPS
  • Complete handset and smartphone reference designs
  • Modules, handsets, smartphones, PDAs
  • Optimized 2.5G and 3G solutions require system
    expertise and integration of all handset blocks!

6
Integration at the Chipset Level Increased
functionality, smaller size, reduced power
consumption
2.5G/3G Terminal Functions
Why Integrate?
  • Reduced cost-per-function
  • Cost reductions at the system level
  • Increased performance for multimedia features
  • Longer battery life better talk and stand-by
    times
  • Smaller form factor to enable small, sleek
    mobile devices
  • Easier design and test for wireless designers due
    to new turn-key, ready-to-manufacture solutions
  • Coming Soon the Single Chip Cell Phone!

7
(No Transcript)
8
2.5G 3G CommunicationsProcessing Complexity
Requirements-- More silicon, More SW, More MIPS
  • Baseband Processing Trends
  • Increased digital baseband horsepower for higher
    data rates
  • Logic migration from SW to HW for performance and
    power consumption
  • Higher memory requirements for protocol stack and
    applications
  • Support for data standards
  • TCP/IP
  • H.263 videoconferencing
  • SMS / EMS / MMS
  • Integration of
  • Communications and applications
  • Functions Bluetooth, USB,802.11, GPS, etc.
  • Encryption and securityrequirements

Digital Baseband Complexity
2G
2.5G
3G
Logic Gates
1x
1.5x
10x
Comms MIPS
1x
1.5x
5x
Comms Memory
1x
2x
6x
9
Power-efficient Multimedia Processing Balancing
flexibility, horsepower, and power consumption
  • Three options for multimedia processing
  • General purpose RISC processor
  • Programmable DSP
  • Dedicated HW accelerators
  • Optimized wireless multimedia requiresappropriate
    use of each processor
  • RISC for maximum flexibility, high-level language
    and OS support
  • DSPs provide flexible acceleration with
    provenpower consumption benefits
  • HW acceleration trades reduced flexibility for
    minimum die-size and maximum performance
  • A multi-processor approach allows
    moreintelligent power management strategies
  • Different operational modes use
    differentprocessor subsets
  • Processor engines are powered-off when not in use
  • Parallel processing increases effective MIPS and
    guarantees QoS
  • Power-efficient wireless multimedia requires
    optimal silicon-level and system-level
    integration of all three types of processing
    engines

TI OMAP Processor (OMAP1610)
10
2.5G 3G Terminals as Open PlatformsApplication
SW innovation will drive mobile Internet market
growth
  • 2.5G and 3G must deliver compelling applications
    and content
  • Applications SW design and architecturedirectly
    impact the user experience
  • Speed and responsiveness
  • Handset power efficiency and battery life
  • Handsets are evolving into moreopen platforms
  • Open software environment atthe handset and
    chipset level
  • Flexibility for the handset OEM,wireless
    operator, and consumer
  • High-level OS and/or Java willbecome standard
    for 2.5G 3G
  • The search for killer apps requiresa thriving
    SW developer base
  • ISV diversity ensures the best applications and
    wireless experience

11
First Tri-Wireless PDA Concept DesignGSM/GPRS,
Wireless LAN, and Bluetooth
  • Simultaneous functions with multiple wireless
    connections
  • GSM phone calls
  • Always-on cellular GPRS or high-speed Wireless
    LAN web browsing and e-mail
  • Bluetooth file transfer, printing, and headset
  • DSP-accelerated Multimedia Applications
  • High performance digital still camera
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