Standards and Specifications The Seven Wonders of Design Innovation

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Standards and SpecificationsThe Seven Wonders of
Design Innovation

• INTRODUCTION TO IPC STANDARDIZATION

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Minimum Standards Tool Kit
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Membership Development

• PCB Manufacturers 382
• EMS Companies 374
• Suppliers 636
• OEMs 753
• Government/Others _198__
• Total 2,343 Companies
• IPC Designers Council 1,100 Individuals

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Major IPC Program Areas

• Management Programs
• Industry Programs
• Technical Programs
• Education, Training Certification
• Market Research/Statistical Programs
• Public Policy Advocacy

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Technical Programs

• Standards Specifications
• Technical Committees
• Activities with Other Organizations
• International Activities
• Current Major Initiatives

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Technical Programs

• Standards Specifications
• Standards, specifications and guidelines
  developed for PCB design, manufacture and
  assembly
• ANSI-Accredited Standards Developing Organization
  (SDO)
• Industry technology roadmaps
• Software Code Standards for Interoperability

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Technical Programs

• Technical Committees
• 21 General Committees
• 160 Subcommittees and Task Groups
• Consist of industry peers
• Started writing standards in 1959 (46 years ago)
• Responsible for round robin test programs
• Managed by Technical Activities Executive
  Committee (TAEC)

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Technical Programs

• Activities with Other Organizations
• Membership and Active Participation
• National Electronics Manufacturing Initiative
  (NEMI) now iNEMI
• American National Standards Institute (ANSI)
• Underwriters Laboratories (UL)

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Technical Programs

• Activities with Other Organizations
• Joint Standards Activity
• Japan Printed Circuit Association (JPCA)
• Wiring and Harness Manufacturers Association
  (WHMA)
• Electronic Industries Alliance (EIA)
• Joint Electron Device Engineering Council (JEDEC)
• Jisso International Council (JIC)

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Technical Programs

• International Activities
• Liaison D Status to IEC TC91
• U.S. Technical Advisor (TA) IEC TC91 on SMT
• Chairmanship of IEC TC91 on SMT
• Secretary, US TAG on IEC TC93 on EDA
• US TAG of ISO Task group on Solder materials
• IPC standards internationally recognized

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Technical Programs

• World Electronic Circuits Council
• China Printed Circuit Association (CPCA)
• European Federation of Interconnection and
  Packaging (EFIP)
• Hong Kong Printed Circuits Association (HKPCA)
• Indian Printed Circuit Association (IPCA)
• Japan Printed Circuits Association (JPCA)
• Taiwan Printed Circuits Association (TPCA)
• Korea Printed Circuits Association

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Technical Programs

• Current Major Initiatives
• Optoelectronics
• Lead-Free Halogen Free issues
• Embedded components
• Wire Harness workmanship
• Electronics enclosures
• 2004/2005 International Technology Roadmap
• Material Declaration
• Enterprise Communication Standards

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004/2005
2004/2005
2002 - 2003
2004-2005
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IPC Membership Location

• A Global Membership
• 78 North America
• 11 Europe
• 9 Asia
• 2 Rest of World
• Members in 47 Countries

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How Does the Standards Process Work?

• Task groups develop drafts of new standards and
  resolve comments at IPC meetings
• Participants represent their company
• Four stages to get comments from industry
• Project Submission - TAEC approves form
• Working Draft - gets project started
• Proposal -solicits comments from industry
• Interim Final - resolves comments for
  balloting

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Standard Development Cycle
Industry Needs
Working Drafts
Project Approval
Expert review
Proposal
Final Ballot
Distribution
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Terms and Definitions

• Terminology is the key to good communication
• IPC-T-50 initial release in 1965
• Next revision is H scheduled for 2007
• Use of the Treutler Classification Code
• Builds on the standardization process
• Contains over 2000 terms
• Has international recognition
• IEC 60194 identical except spelling

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Classification Code

• 1-Administration
• 2-Engineering and Design for elect. pkg
• 3-Components for electronic packaging
• 4-Materials for electronic packaging
• 5-Interconnect board fabrication processes
• 6-Types/performance for Interconnections
• 7-Assembly processes
• 8-Types/performance for assemblies
• 9-Quality/reliability for boards/assembly

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Second Digit Family 6 ID

• 60-General terms
• 61-Rigid printed boards (organic)
• 62-Flexible printed boards (organic)
• 63-Flex-rigid printed boards (organic)
• 64-Discrete wiring boards (organic)
• 65-Inorganic printed boards (ceramic etc.)
• 66-Molded structures (three dimensional)
• 67-Hybrid/Multichip module structures
• 68-(Reserved for future expansion)
• 69-Other interconnecting structure terms

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CC Description Examples
22. PRINTED BOARD AND PRINTED BOARD ASSEMBLY
DESIGN Contains terms related to printed board
and printed board assembly. Includes, but is not
limited to computer aided design (CAD) equipment
and software algorithms, such items as design
rule checks, direct input from CAE work stations,
gate assignment or gate swapping, fixed grid
snap-in, force field component manipulation, heat
sensitivity analysis, multi-directional conductor
routing etc.
77. REWORK, REPAIR AND MODIFICATION Contains
terms related to the techniques, tools, materials
and equipment used to remove, replace, or add
components to an interconnecting structure, or to
correct/change a circuit feature in the structure
itself, and terms related to restoring the
assembly to its proper function.
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IPC-T-50 Published

• Embedded Component 30.0436
• A discrete or active component that is
  fabricated as an integral part of a printed
  board. (See Figure E-1.)

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IPC-T-50 Published

• Discrete Component 30.0392
• A separate part of a printed board assembly that
  performs a circuit function, e.g., a resistor, a
  capacitor, a transistor,etc.
• Active Device 30.0016
• An electronic component whose basic character
  changes while operating on an applied signal.
  (This includes diodes, transistors, thyristors,
  and integrated circuits that are used for the
  rectification, amplification, switching, etc., of
  analog or digital circuits in either monolithic
  or hybrid form.)
• Passive Component (Element) 30.1468
• A discrete electronic device whose basic
  character does not change while it processes an
  applied signal. (This includes components such as
  resistors, capacitors, and inductors.)

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Terms and Definitions
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Terminology

• Blank 41.1339
• An unprocessed or partially processed piece of
  base material or metal- clad base material, that
  has been cut from a sheet or panel, that has the
  rough dimensions of a printed board. (See also
  Panel.)
• Panel 41.1463
• A rectangular sheet of base material or
  metal-clad material of predetermined size that is
  used for the processing of one or more printed
  boards and, when required, one or more test
  coupons. (See also Blank.)
• Fabrication Panel
• A rectangular sheet of base material or
  metal-clad material of predetermined size that is
  used by a printed board manufacturer for the
  processing of one or more printed boards and,
  when required, one or more test coupons. (See
  also Blank.)
• Board 60.0118
• see Printed Board, and Multilayer Printed
  Board.
• Printed Board (PB) 60.1485
• The general term for completely processed
  printed circuit and printed wiring
  configurations. (This includes single-sided,
  double-sided and multilayer boards with rigid,
  flexible, and rigid-flex base materials.)

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Terminology

• Multilayer Printed Board 60.1227
• The general term for a printed board that
  consist of rigid or flexible insulation materials
  and three or more alternate printed wiring and/or
  printed circuit layers that have been bonded
  together and electrically interconnected.
• Finished Board
• see Printed Board
• Finished Panel
• A rectangular sheet of base material or
  metal-clad material of predetermined size that is
  used for the processing of one or more printed
  board designs and, when required, one or more
  test coupons which is extracted from the
  fabrication panel to deliver to the customer or
  to the next level of fabrication. (see Assembly
  Pallet)
• Assembly 80.1327
• A number of parts, subassemblies or combinations
  thereof joined together. (Note This term can be
  used in conjunction with other terms listed
  herein, e.g., Printed Board Assembly)
• Printed Board Assembly 80.0911
• The generic term for an assembly that uses a
  printed board for component mounting and
  interconnecting purposes.
• Array 22.0049
• A group of elements or circuits arranged in rows
  and columns on a base material.

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Terminology

• Printed Board Assembly Array
• A group of assemblies, all of the same design,
  arranged in rows and columns on a panel.
• Assembly Pallet
• The generic term for the assembly that uses a
  finished panel, as delivered from the board
  fabricator, of the same or different designs, for
  element and circuit component mounting and
  attachment to the board interconnections layers.
  The board arrangement on the pallet may be random
  or in the form of an array the pallet may also
  include coupons for testing.

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Hierarchy of IPC Design Standards(2220 Series)
IPC-2220
IPC-2221
GENERIC
IPC-2222
IPC-2223
IPC-2224
IPC-2225
IPC-2226
RIGID
FLEX
PCMCIA
MCM-L
HDI
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Hierarchy of Printed Board Performance
Standards(6010 Series)
IPC-6010
IPC-6011
GENERIC
IPC-6012
IPC-6013
IPC-6014
IPC-6015
IPC-6016
RIGID
FLEX
PCMCIA
MCM-L
HDI
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Applicable IPC Standards

• -SM-782 Land Pattern Considerations
• -7095 BGA Process Implementation
• -2315 HDI Microvia Design Guide
• -SM-785 SMT Reliability Testing
• -D-279 Design for SMT Reliability
• J-STD-001 Soldering Requirements
• -A-610 Assembly Acceptability
• -6010 Printed Board Series
• J-STD-004/005 Solder Flux/Paste

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Scope Example (land patterns)

• This standard provides information on land
  pattern geometries used for surface attachment
  of electronic components.
• The intent of the information presented is to
  provide the appropriate size, shape and tolerance
  of surface mount land patterns to insure
  sufficient area for the appropriate solder fillet
  or solder volume.
• Also to allow for inspection, testing, and
  rework of those solder joints.

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Scope (continued)

• Land pattern geometry may be different based on
  the type of soldering used to attach the
  electronic part, however land patterns are
  defined in such a manner that they are
  transparent to the process.
• Standard configurations are for manual designs
  for computer-aided design.
• Parts are mounted on one or both sides,
  subjected to wave, reflow, or other type of
  soldering

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Scope (continued)

• Although patterns are dimensionally defined
  and since they are a part of the printed board
  circuitry geometry, they are subject to the
  producibility levels and tolerances associated
  with plating, etching, assembly or other
  conditions.
• The producibility aspects also pertain to the
  use of solder mask and the registration required
  between the solder mask and the conductor
  patterns.

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Performance Classes

• Three performance classes have been
  established to reflect progressive increases in
  sophistication, functional performance
  requirements and testing/ inspection frequency.
• There may be an overlap of equipment categories
  in different classes.
• The user is responsible to specify, in the
  contract or purchase order, the product
  performance class.

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Class 1 - General Electronic Products

• Includes consumer products, some computer and
  computer peripherals suitable for applications
  where cosmetic imperfections are not important
  and the major requirement is function of the
  completed printed board.

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Class 2 - Dedicated Service Electronic Products

• Includes communications equipment, sophisticated
  business machines, instruments where high
  performance and extended life is required and for
  which uninterrupted service is desired but not
  critical. Certain cosmetic imperfections are
  allowed.

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Class 3 - High Reliability Electronic Products

• Includes the equipment and products where
  continued performance or performance on demand is
  critical. Equipment downtime cannot be tolerated
  and must function when required such as in life
  support items or flight control systems.
  Applications where high levels of assurance are
  required and service is essential.

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Interpretation

• Shall, the emphatic form of the verb, is used
  throughout this specification whenever a
  requirement is intended to express a provision
  that is binding. Deviation from a shall
  requirement may be considered if sufficient data
  is supplied to justify the exception.
• The words should and may are used whenever it
  is necessary to express non-mandatory provisions.
• Will is used to express a declaration of
  purpose. To assist the reader, the word shall
  is presented in bold characters.

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Complexity Levels

• Land pattern determination methods
• Exact details based on component specifications,
  board manufacturing and component placement
  accuracy. The land patterns are restricted to a
  specific component, and have an identifying land
  pattern number
• Equations used for new components or to alter the
  given information to achieve a more robust
  solder connection, when used in particular
  situations

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Level A Maximum

• For low-density product applications, the
  'maximum' land pattern condition have been
  developed to accommodate wave or flow solder of
  leadless chip devices and leaded gull- wing
  devices.
• The geometry furnished for these devices, as
  well as inward and J-formed lead contact device
  families, may provide a wider process window for
  reflow solder processes as well.

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Level B Median

• Products with a moderate level of component
  density should consider adapting the 'median'
  land patterns.
• The median land patterns furnished for all
  device families will provide a robust solder
  attachment condition for reflow solder processes.
• The condition should suitable for wave or reflow
  soldering of leadless chip and leaded gull-wing
  type devices.

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Level C Minimum

• High component density typical of portable and
  hand-held product applications may consider the
  'minimum' land pattern geometry variation.
• Selection of the minimum land pattern geometry
  may not be suitable for all product use
  categories.

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Combination of Issues

• Performance classes 1, 2, and 3 are combined
  with that of complexity and density levels A, B,
  and C in defining electronic assembly conditions.
  
• As an example, combining the description as
  Levels 1A or 3B or 2C, would indicate the
  different combinations of performance and
  component density to understand fabrication and
  assembly requirements for manufacturing and end
  use environment.

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Test Requirements

• Prior to starting a design, a testability
  review meeting should be held with fabrication,
  assembly, and testing.
• Testability concerns, such as circuit
  visibility, density, operation, circuit
  controllability, partitioning, and special test
  requirements and specifications are discussed as
  a part of the test strategy

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Test Requirements

• During the design testability review meeting,
  tooling concepts are established, and
  determinations are made as to the most effective
  tool cost versus board layout concept conditions.
• During the layout process, any circuit board
  changes that impact the test program, or the test
  tooling, should be reported to determine the best
  compromise.

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Board Test Requirements

• The testing concept should develop approaches
  that can check the board for problems, and also
  detect fault locations wherever possible.
• The test concept and requirements should
  economically facilitate the detection, isolation,
  and correction of faults of the design
  verification, manufacturing, and field support of
  the printed board assembly life cycle.

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Assembly Testability

• The printed board assembly testability
  philosophy also needs to be compatible with the
  overall integration, testing and maintenance
  plans. This includes
• The factory testers to be used
• How integration and test is planned
• When conformal coated is applied
• Depot field test equipment capability
• Personnel skill level

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Need for Automation

• Standards needed for design and assembly
• New concepts in Business process optimization for
  competitiveness
• A need for lower operating costs in business and
  Information Transfer (IT).
• Tight business alignment with IT is essential
• Development of internal and external Service
  Oriented Architecture is needed in order to
  manage the new culture change.
• Shorten product development cycles
• Increase product flexibility
• Solutions require continuous monitoring of
  industry progress infrastructure growth

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IPC to IEC Deployment

• IPC-SM-782 provided by US to IEC
• Countries agree to standardize
• Japan found that one land pattern is insufficient
  to design Sony Minicam assemblies
• Discussions review principles of mathematical
  model tighten requirements
• Three geometries proposed for future
• IEC starts work on IEC-61188-5-1 thru -8
• IPC supersedes SM-782A with IPC-7351
• Computer model tested with PCB Libraries

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IPC-7351 Land Pattern Variations
Density Level A Maximum (Most) Land Protrusion -
for low component density applications and
products exposed to high shock or vibration. The
solder pattern is the most robust and can be
easily reworked if necessary. Density Level B
Median (Nominal) Land Protrusion - for products
with a moderate level of component density and
providing a more robust solder attachment. Density
Level C Minimum (Least) Land Protrusion - for
miniature devices where the land pattern has the
least amount of solder pattern to achieve the
highest component packing density.
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IPC-7351 Land Pattern Variations for Rectangular
Two Terminal Devices
Density Level A Very Robust Solder Joint
Density Level B General Purpose Solder Joint
Density Level C Minimal Solder Joint for High
Density Applications
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IPC-7351 Land Pattern Variations for Flat Ribbon
L and Gull Wing Leads
Density Level A Very Robust Solder Joint
Density Level B General Purpose Solder Joint
Density Level C Minimal Solder Joint for High
Density Applications
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Ribbon Leads greater than 0.625
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Ribbon Leads less than 0.625
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J LeadedParts
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RectangularSquare endTerminations
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Metal Electrical Face
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Bottom Only Terminations
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Leadless Chip Carriers
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Inward L shapedLeads
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Flat Lug Leads
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Quad Flat No Lead
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Small Outline No Lead
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Design Considerations

• Land pattern concepts
• Component selection
• Mounting substrate design
• Assembly methods
• Method of test
• Phototool generation
• Meeting solder joint requirements
• Stencil fixture requirements
• Providing access for inspection
• Access for rework and repair

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Manufacturing Allowance

• Manufacturing allowance must be considered in
  the design process
• The courtyard represents the starting point of
  the minimum area needed for the component and the
  land pattern
• Manufacturing, assembly and testing
  representatives should assist in determining the
  additional room needed to accommodate placement,
  testing, modification and repair

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IPC-7351 Land Pattern Courtyard Determination
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IPC-7351 Land Pattern Naming Convention

• The numbering convention used in IPC-SM-782A was
  very basic
• Fixed number range assigned to a specific
  component family (prone to exhaustion)
• No intelligence embedded within them
• A new land pattern naming convention was
  designed for IPC-7351 to convey a number of
  attributes
• Component family prefix
• Component pin pitch
• Component body dimensions
• Component Pin Quantity
• Land Pattern Geometry

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IPC-7351 Land Pattern Naming Convention Example

• Using an 0.80 mm pitch Quad Flat Package (QFP),
  the IPC-7351 Land Pattern Naming Convention is as
  follows
• QFP80PLead Span L1 Nominal X Lead Span L2
  Nominal Pin Qty
• where the (plus sign) stands for in addition
  to (no space between the prefix and the body
  size),
• the X (capital letter X) is used instead of the
  word by to separate two numbers such as height
  X width,
• the (dash) is used to separate the pin
  quantity,
• and the suffix letters L, M and N signify
  when the land protrusion is at their minimum
  (least), maximum (most) or median (nominal)
  geometry variation.

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IPC-7351 Land Pattern Naming Convention Example
(contd)

• QFP80P1720 X 2320-80N
• Therefore, the above land pattern name conveys
  the following information
• The component family prefix of QFP
• The component pin pitch of 0.80 mm
• The component lead span nominal X 17.20 mm for
  1720
• The component lead span nominal Y 23.20 mm for
  2320
• The total component pin quantity of 80 pins
• Density Level B (Nominal) land pattern geometry

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IPC-7351 Zero Component Rotations

• IPC-7351 provides zero component rotations that
  are defined in terms of the standard CAD
  component library with respect to a given PCB
  design
• Acknowledges that a single land pattern may be
  used for the same component part from different
  suppliers, all of whom may provide different
  orientations for tape or reel
• Eliminates scenarios where a PCB designer loses
  the ability to reference a single land pattern
  when the zero component rotation is according to
  the method the component is delivered to the
  assembly machine

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IPC-7351 Zero Component Rotations
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IPC-7351 Land Pattern Software Suite
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Part Selection
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Nominal Library Search
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Component Descriptions
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Land Patterns
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Land Patterns and Courtyards
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Density Level B
Density Level A
Density Level C
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Land Patterns and Courtyards
Density Level A
Density Level B
Density Level C
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IPC-7351 Land Pattern Viewer

• Shareware program included with IPC-7351 standard
  and available at www.ipc.org under PCB Tools and
  Caculators
• Portability doesnt require a Web browser
• Enhanced searching capabilities
• 11 relationship for components/graphics
• Easily updated through free download of .p
  library files and program revisions

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Building on the Standards

• IPC website and listservs will provide feedback
  point for new land pattern generation
• Developing CAD interfaces
• Incorporating the Concepts into OffSpring (the
  child of GenCAM and ODB) IPC-2581 (IEC 61182-2)
• Beta testing to start end of 2005
• Many CAD CAM companies committed

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IPC-2581 Beta Testing

• Data extraction from CAD
• CAM step and repeat plus process tolerance
  inclusion
• Design file review (Pad Stacks) versus layered
  data
• Assembly information tied to CAD libraries
• Provide updated viewer to industry
• Provide Gerber to 2581 converter

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Function Mode
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Logistic Header
Indicates file owner as well as Approved Vendors
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History Record
Configuration Management Section
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Bill of Materials
One to many BOMs including one for Board Material
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Approve Vendor List
One master list referenced to BOM item
enterprise
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The Heart and Stamina
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The Information Vessels
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Step Description
Mandatory Requirements
The step functions define the details of the
electronic assembly. This includes the parts,
conductors, net list, and DFX analysis.
CAD
Library
The individual features
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Home for Land Patterns
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Detail Descriptions
LayerDesc includes BOARD BOARDPANEL ASSEMBLY
ASSEMBLYARRAY COUPON DOCUMENTATION TOOLING
MISCELLANEOUS
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NIST Viewer
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Gerber Conversion Evaluation
NIST Viewer
Original File
Next is conversion of Gerber Macros in read me
file
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IPC-25XX Certification

• Develop concept for matrix
• Examine D-350 and GenCAM test plans
• Keep it simple
• Build on self declaration principles
• Establish legal documents for details
• Ask NIST software engineering for help with
  portal development
• Examine using 3rd party consultants

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Conclusions

• The standard is Alive and Well
• The cooperative efforts are winning
• New parts require continuous monitoring
• The IPC/PCB Libraries arrangement is a major
  benefit to the design community
• The IPC list servers are a way to keep in touch