Title: Bottom-Up Microfabrication Using DNA
1Bottom-Up Microfabrication Using DNA
Presentation Given By Ben Burns Janeczka
Oates EE 410/510-
Microfabrication and Semiconductor Processes
University of Alabama in Huntsville
2Outline
- Introduction
- Bottom- Up fabrication
- Self-assembling DNA structures
- DNA tiles
- Single Walled carbon Nano-Tube Field Effect
Transistor (SWNT FET) - DNA shadow lithography
- Conclusion
- Issues
3Bottom-Up Fabrication
- Starts with small-scale components and design
larger structures
4Self-Assembly
DIY
- Self Assembly
- Is a Bottom-up rather than a Top-Down process as
used in manufacturing or lithography - Involves self-ordering substructures into
superstructures - Living organisms are best example
- Life (DNA) is a good basis for artificial
bottom-up design
5What is Deoxyribonucleic Acid (DNA)?
- DNA is the genetic blueprint for all living
organisms - Composed of four nucleic acids adenine(A),
guanine (G), cystosine (C), and thymine (T). - Well understood assembly
- -Watson-Crick pairing
- Easy to make
- -Just order from company!
- Small Size
6Bottom-Up Fabrication
- DNA self-assembly is a bottom-up fabrication
technique that can be used to achieve molecular
scale resolution. - Speed of DNA self-assembly reactions
- Between a few seconds to many minutes.
- Far slower per assembly than silicon technology.
- Concurrent DNA self-assembly
- Concurrent assemblies execute computations
independently. - Massively parallel
- Use
- DNA tilings and/or assembling structures bound to
DNA
7DNA Tiling
- Like a puzzle
- Artificial ssDNA assembles to form a tile
- Sticky ends match to form lattice
8DX and TX Tiles
- Double crossover two strands of DNA fused
- Triple crossover three strands
- Lots of other ways to make tiles
DX
TX
9DNA Tiling
10DNA Tiling
- E) AFM image of the letters D, N, and A
displayed on self-assembled 4 x 4 nano-arrays
(lt80 nm / side)
- TEM image of 6nm gold particles labeled with
15-mer oligo paired with matching strand on
assembled DX lattice
11DNA Tiling
- Can be used for computation....
12DNA used to assemble SWNT FET
Assembly of a DNA-templated FET and wires
contacting it. The following steps are (i)
RecA monomers polymerize on a ssDNA molecule to
form a nucleoprotein filament. (ii) Homologous
recombination reaction leads to binding of the
nucleoprotein filament at the desired address on
an aldehyde-derivatized scaffold dsDNA molecule.
(iii) The DNA-bound RecA is used to localize a
streptavidin-functionalized SWNT, utilizing a
primary antibody to RecA and a biotin-conjugated
secondary antibody. (iv) Incubation in an AgNO3
solution leads to the formation of silver
clusters on the segments that are unprotected by
RecA. (v) Electroless gold deposition, using the
silver clusters as nucleation centers, results in
the formation of two DNA-templated gold wires
contacting the SWNT bound at the gap
13SWNT FET AFM Image Results
- Localization of a SWNT at a specific address on
the scaffold dsDNA molecule using RecA. (A) An
AFM image of a 500-base-long ( 250 nm) RecA
nucleoprotein filament (black arrow) localized at
a homologous sequence on a DNA scaffold molecule.
Bar, 200 nm. (B) An AFM image of a
streptavidin-coated SWNT (white arrow) bound to a
500-base-long nucleoprotein filament localized on
a -DNA scaffold molecule. Bar, 300 nm. (C) A
scanning conductance image of the same region as
in (B). The conductive SWNT (white arrow) yields
a considerable signal whereas the insulating DNA
is hardly resolved. Bar, 300 nm
14SWNT FET SEM Image Results
A DNA-templated carbon nanotube FET and metallic
wires contacting it. SEM images of SWNTs
contacted by self-assembled DNA-templated gold
wires. (A) An individual SWNT. (B) A rope of
SWNTs. Bars, 100 nm
15DNA Shadow NanoLithography
When Top-Down meets Bottom-Up
- Combination of traditional microfabrication and
DNA - DNA bonds to substrate treated with specific
silane, CDMOS (chlorodimethyloctadecylsilane) - thermal deposition of Al (small grain size) lt2 x
10-6 Torr, 4nm _at_ 0.5 Às-1 - Si etch ICP-RIE SF6C4F8, 2x10-7 Torr, 1-4 min
16DNA Combing
- Substrate is treated with CDMOS
- 30 min, 90 C
- DNA attaches
- Substrate then dried
17DNA Shadow NanoLithography Results
Transfer of linear DNA pattern to silicon
surfaces by DSN SEM micrographs of linear (E)
nanometer-scale trenches etched into silicon.
Scale bar on the inset is 50 nm, and the trenches
are 8 nm wide.
- width depends on angle of deposition (7-22nm)
- sidewall quality depends on width (40nm depth)
18Conclusion
- One problem for integrating DNA is its low
melting point. - depends on AT/GC bonds (more GC higher Tm)
30-70 C - DX, TX 60-80 C
- There is no method to implement a chain reaction
of self-assembling design steps - Lots of errors in tiling assembly
- 'D''N''A' tiles yield 30
- hard to check
- fewer steps, fewer errors
- 3D tiles hard to control shape
- DSN
- Poor side walls
Instead of
19References
- J F Allemand et al. pH-dependent specific
binding and combing of DNA. Biophys J. 1997
October 73(4) 20642070. - Héctor A. Becerril and Adam T. Woolley. DNA
Shadow Nanolithography. Small 3.9 (2007)
1534-38 - Kurt V. Gothelf and Thomas H. LaBean.
DNA-programmed assembly of nanostructures. Org.
Biomol. Chem., 2005, 3, 4023 4037 - Kinneret Keren et al. DNA-templated carbon
nanotube field-effect transistor. Science
302.5649 (2003) p1380(3) - T. Kusakabe et al. DNA mediated sequential
self-assembly of nano/micro components. In MEMS
2008. IEEE 21st International Conference on
(2008) 1052-1055 - Thomas H. LaBean et al. "Construction, Analysis,
Ligation, and Self-Assembly of DNA Triple
Crossover Complexes." J. Am. Chem. Soc. 122.9
(2000) 1848-60 - Park, Sung Ha et al. Finite-Size, Fully
Addressable DNA Tile Lattices For7med by
Hierarchical Assembly Procedures Angewandte
Chemie 118.40 (2006) 749-753 - John H. Rief, Thomas H. LaBean, Nadrian C.
Seeman. Challenges and Applications for
Self-Assembled DNA Nanostructures Lecture Notes
In Computer Science Vol. 2054 (2000) 173-198 - John H. Reif, Thom LaBean and Nadrian Seeman
Challenges and Applications for Self-Assembled
DNA Nanostructures (2001) online
http//scai.snu.ac.kr/cec2001/selfassemble.talk.pd
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20Questions?