Die Attach Process

1
Die Attach Process
2
Die Picking

• Die can be directly picked from the wafer after
  the wafer sawing process.
• Die bonder are often equipped with ejector needle
  system to push against the backside of the wafer
  to eject the die.
• Computer controller vacuum pick-up tools are used
  to lift the dies

3
Epoxy Dispensing

• Die attach epoxy is dispensed in controlled
  volume by dispenser to the substrate
• The viscosity of the epoxy has to be controlled.
• The location of the dispensing is controlled
  computer with vision control

4
Die Placing

• The die pick-up arm of the die attach machine
  will send the die to the appropriate position and
  load the die on the substrate.
• Die bonding pressure has to be controlled.
• The substrate may be heated to facilitate partial
  curing of the epoxy die attach.

5
Epoxy Curing

• The die bonded substrate may need to send for
  curing in ovens to stabilize the polymer.
• There are fast curing epoxy and also UV cured
  epoxy to facilitate the process.