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ME 350 – Lecture 21 – Chapter 26

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Title: ME 350 – Lecture 21 – Chapter 26


1
ME 350 Lecture 21 Chapter 26
  • NONTRADITIONAL MACHINING PROCESSES
  • Mechanical Energy Processes (USM, WJC, AJM)
  • - high velocity stream of abrasives or fluid (or
    both)
  • Electrochemical Processes (ECM)
  • - reverse of electroplating
  • Thermal Processes (EDM, Wire EDM, EBM, LBM, PAC)
  • - vaporizing of a small area of work surface
  • Chemical Processes (CHM, Chemical Blanking, PCM)
  • - chemical etching of areas unprotected by
    maskant
  • Nontraditional machining is characterized by
    material removal that

2
Nontraditional Processes Used When
  1. Material is either very hard, brittle or both or
    material is very ductile
  2. Part geometry is complex or geometric
    requirements impossible with conventional
    methods
  3. Need to avoid surface damage or contamination
    that often accompanies conventional machining

3
1. Mechanical Energy Processes
  • Ultrasonic machining (USM)
  • Water jet cutting (WJC)
  • Abrasive jet machining (AJM)

4
1a) Ultrasonic Machining (USM)
  • Abrasives in a slurry are driven at high velocity
    against work by a vibrating tool (low amplitude
    high frequency)
  • Tool oscillation is perpendicular to work
    surface
  • Abrasives accomplish material removal
  • Tool is fed slowly into work
  • Shape of tool is formed into part

5
USM Applications
  • Used only on hard and brittle work materials
  • Shapes include non-round holes, holes along a
    curved axis
  • Coining operations - pattern on tool is
    imparted to a flat work surface
  • Produces virtually stress free shapes
  • Holes as small as 0.076 mm have been made

6
1b) Water Jet Cutting (WJC)
  • Uses high pressure, high velocity stream of water
    directed at work surface for cutting

7
WJC Applications
  • Usually automated using CNC or industrial robots
  • Best used to cut narrow slits in flat stock such
    as
  • Not suitable for
  • When used on metals, you need to add to the water
    stream
  • Smallest kerf width about 0.4 mm for metals, and
    0.1mm for plastics and non-metals.
  • More info http//www.waterjets.org/index.html

8
WJC Advantages
  • No crushing or burning of work surface
  • Minimum material loss
  • No environmental pollution
  • Ease of automation

9
1c) Abrasive Jet Machining (AJM)
  • High velocity gas stream containing abrasive
    particles (aka sand blasting or bead blasting)
  • Normally used as a finishing process rather than
    cutting process (e.g. gas sandpaper)
  • Applications deburring, cleaning, and polishing.

10
2. Electrochemical Machining Processes
  • Electrical energy used in combination with
    chemical reactions to remove material
  • Reverse of
  • Work material must be a
  • Feature dimensions down to about 10 µm

Courtesy of AEG-Elotherm-Germany
11
Electrochemical Machining (ECM)
  • Material removal by anodic dissolution, using
    electrode (tool) in close proximity to work but
    separated by a rapidly flowing electrolyte

12
ECM Operation
  • Material is deplated from anode workpiece
    ( pole) and transported to a cathode
    tool ( pole) in an electrolyte
    bath
  • Electrolyte flows rapidly between two poles to
    carry off deplated material, so it does not
  • Electrode materials Cu, brass, or stainless
    steel
  • Tool shape is the
  • Tool size must allow for the gap

13
ECM Applications
  • Die sinking - irregular shapes and contours for
    forging dies, plastic molds, and other tools
  • Multiple hole drilling - many holes can be
    drilled simultaneously with ECM
  • No burrs created no residual stress

Schuster et al, Science 2000
Trimmer et al, APL 2003
14
Material Removal Rate of ECM
  • Based on Faraday's First Law rate of metal
    dissolved is proportional to the current
  • MRR Aƒr ?CI
  • where I current A frontal area of the
    electrode (mm2), ƒr feed rate (mm/s), and ?
    efficiency coefficient

specific removal rate with work material
M atomic weight of metal (kg/mol) r density
of metal (kg/m3), F Faraday constant
(Coulomb) n valency of the ion
15
Equations for ECM (Cont)
Gap, g
  • Resistance of Electrode

Area, A
r is the resistivity of the electrolyte fluid
(Ohmm)
16
Example ECM through a plate
  • Aluminum plate, thickness t 12 mm
  • Rectangular hole to be cut
  • L 30mm, W 10mm
  • Applied current I 1200 amps.
  • Efficiency of 95,
  • Determine how long it will take to cut the hole?

10mm
30mm
Ideal CAl 3.4410-2 mm3/amps - other C
values in Table 26.1
17
Solution
18
3. Thermal Energy Processes - Overview
  • Very high temperatures, but only
  • Material is removed by
  • Problems and concerns
  • Redeposition of vaporized metal
  • Surface damage and metallurgical damage to the
    new work surface
  • In some cases, resulting finish is so poor that
    subsequent processing is required

19
3. Thermal Energy Processes
  • Electric discharge machining (EDM)
  • Electric discharge wire cutting (Wire EDM)
  • Electron beam machining (EBM)
  • Laser beam machining (LBM)
  • Plasma arc cutting or machining (PAC)

20
3a) Electric Discharge Machining (EDM)
  • One of the most widely used nontraditional
    processes
  • Shape of finished work is inverse of tool shape
  • Sparks occur across a small gap between tool and
    work
  • Holes as small as 0.3mm can be made with feature
    sizes (radius etc.) down to 2µm

21
Work Materials in EDM
  • Work materials must be
  • Hardness and strength of work material are
  • Material removal rate depends primarily on
  • Applications
  • Molds and dies for injection molding and forging
  • Machining of hard or exotic metals
  • Sheetmetal stamping dies.

22
3b) Wire EDM
  • EDM uses small diameter wire as electrode to cut
    a narrow kerf in work similar to a

23
Material Removal Rate of EDM
  • Weller Equation (Empirical) Maximum rate RMR
  • where K 664 (C1.23mm3/amps) I discharge
    current Tm melt temp of work material
  • Actual material removal rate
  • MRR vf hwkerf
  • where vf feed rate h workpiece thickness
    wkerf kerf width

While cutting, wire is continuously advanced
between supply spool and take-up spool to
24
Wire EDM Applications
  • Ideal for stamp and die components
  • Since kerf is so narrow, it is often possible to
    fabricate punch and die in a single cut
  • Other tools and parts with intricate outline
    shapes, such as lathe form tools, extrusion dies,
    and flat templates

25
3c) Electron Beam Machining (EBM)
  • Part loaded inside a vacuum chamber
  • Beam is focused through electromagnetic lens,
    reducing diameter to as small as 0.025 mm
  • Material is vaporized in a very localized area

26
EBM Applications
  • Ideal for micromachining
  • Drilling small diameter holes - down to 0.05 mm
    (0.002 in)
  • Cutting slots only about 0.025 mm (0.001 in.)
    wide
  • Drilling holes with very high depth-to-diameter
    ratios
  • Ratios greater than 1001
  • Disadvantage slow and expensive

27
3d) Laser Beam Machining (LBM)
  • Generally used for drilling, slitting, slotting,
    scribing, and marking operations
  • Holes can be made down to 0.025 mm
  • Generally used on thin stock material

28
3e) Plasma Arc Cutting (PAC)
  • Uses plasma stream at very high temperatures to
    cut metal 10,000?C to 14,000?C
  • Plasma arc generated between electrode in torch
    and workpiece
  • The plasma flows through water-cooled nozzle that
    constricts and directs plasma stream to desired
    location

29
Applications of PAC
  • Most applications of PAC involve cutting of
    metal sheets and plates
  • Hole piercing and cutting along a defined path
  • Can be operated by hand-held torch or automated
    by CNC
  • Can cut any
  • Hole sizes generally larger than 2 mm

30
4. Chemical Machining (CHM)
  • CHM Process
  • Cleaning - to insure uniform etching
  • Masking - a maskant (resist, chemically resistant
    to etchant) is applied to portions of work
    surface not to be etched
  • Patterning of maskant
  • Etching - part is immersed in etchant which
    chemically attacks those portions of work surface
    that are not masked
  • Demasking - maskant is removed

31
Maskant - Photographic Resist Method
  • Masking materials contain photosensitive
    chemicals
  • Maskant is applied to work surface (dip coated,
    spin coated, or roller coated) and exposed to
    light through a negative image of areas to be
    etched
  • These areas are then removed using photographic
    developing techniques
  • Remaining areas are vulnerable to etching
  • Applications
  • Small parts on thin stock produced in high
    quantities
  • Integrated circuits and printed circuit cards

32
Material Removal Rate in CHM
  • Generally indicated as penetration rates, i.e.
    mm/min.
  • Penetration rate unaffected by exposed surface
    area
  • Etching occurs downward and under the maskant
  • In general, , Etch Factor Fe
  • (see Table 26.2 pg 637)

33
Chemical Blanking
  • Uses CHM to cut very thin sheetmetal parts - down
    to 0.025 mm thick and/or for intricate cutting
    patterns
  • Conventional punch and die does not work because
    stamping forces damage the thin sheetmetal, or
    tooling cost is prohibitive

Parts made by chemical blanking (photo courtesy
of Buckbee-Mears St. Paul).
34
CHM Possible Part Geometry Features
  • Very small holes
  • Holes that are not round
  • Narrow slots in slabs and plates
  • Micromachining
  • Shallow pockets and surface details in flat parts
  • Special contoured shapes for mold and die
    applications

35
Quotes
  • We are what we repeatedly do. Excellence, then,
    is not an act, but a habit. - Aristotle
  • If you want others to be happy, practice
    compassion. If you want to be happy, practice
    compassion. - Dalai Lama
  • When the heart grieves over what it has lost, the
    spirit rejoices over what it has left. - Sufi
    Epigram
  • A great pleasure in life is doing what people say
    you cannot do. - Walter Bagehot
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