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Fundamentals of Heat Pipes

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Title: Fundamentals of Heat Pipes


1
Fundamentals of Heat Pipes
  • With Applications to Electronics Cooling
  • -- Widah Saied

2
Introduction
  • Things to be discussed
  • Basic components
  • Advantages
  • Ideal thermodynamic cycle
  • Applications
  • Types
  • Heat transfer limitations
  • Resistance network
  • Wick design
  • Choosing the working fluid
  • Container design
  • Heat pipes in electronics cooling
  • Current research in electronics cooling

3
Basic Components
Adiabatic section
evaporator
wick
condenser
http//www.lightstreamphotonics.com/images/tech_or
angecontainer_small.png
4
Advantages of Heat Pipes
  • Very high thermal conductivity. Less temperature
    difference needed to transport heat than
    traditional materials (thermal conductivity up to
    90 times greater than copper for the same size)
    (Faghiri, 1995) resulting, in low thermal
    resistance. (Peterson,1994)
  • Power flattening. A constant condenser heat flux
    can be maintained while the evaporator
    experiences variable heat fluxes. (Faghiri, 1995)
  • Efficient transport of concentrated heat.
    (Faghiri, 1995)

5
Advantages of Heat Pipes
  • Temperature Control. The evaporator and condenser
    temperature can remain nearly constant (at Tsat)
    while heat flux into the evaporator may vary
    (Faghiri, 1995) .
  • Geometry control. The condenser and evaporator
    can have different areas to fit variable area
    spaces (Faghiri, 1995) . High heat flux inputs
    can be dissipated with low heat flux outputs only
    using natural or forced convection(Peterson,1994)
    .

6
Thermodynamic Cycle
  • 1-2 Heat applied to evaporator through external
    sources vaporizes working fluid to a
    saturated(2) or superheated (2) vapor.
  • 2-3 Vapor pressure drives vapor through adiabatic
    section to condenser.
  • 3-4 Vapor condenses, releasing heat to a heat
    sink.
  • 4-1 Capillary pressure created by menisci in wick
    pumps condensed fluid into evaporator section.
  • Process starts over.
  • (Faghiri, 1995)

7
Ideal Thermodynamic Cycle
(Faghiri, 1995)
8
Heat Pipe Applications
  • Electronics cooling- small high performance
    components cause high heat fluxes and high heat
    dissipation demands. Used to cool transistors and
    high density semiconductors.
  • Aerospace- cool satellite solar array, as well as
    shuttle leading edge during reentry.
  • Heat exchangers- power industries use heat pipe
    heat exchangers as air heaters on boilers.
  • Other applications- production tools, medicine
    and human body temperature control, engines and
    automotive industry.
  • (Faghiri, 1995)

9
Types of Heat Pipes
  • Thermosyphon- gravity assisted wickless heat
    pipe. Gravity is used to force the condensate
    back into the evaporator. Therefore, condenser
    must be above the evaporator in a gravity field.
  • Leading edge- placed in the leading edge of
    hypersonic vehicles to cool high heat fluxes near
    the wing leading edge. (Faghiri, 1995)
  • Rotating and revolving- condensate returned to
    the evaporator through centrifugal force. No
    capillary wicks required. Used to cool turbine
    components and armatures for electric motors.
  • Cryogenic- low temperature heat pipe. Used to
    cool optical instruments in space. (Peterson,
    1994)

10
Types of Heat Pipes
  • Flat Plate- much like traditional cylindrical
    heat pipes but are rectangular. Used to cool and
    flatten temperatures of semiconductor or
    transistor packages assembled in arrays on the
    top of the heat pipe.

(Faghiri,1995)
11
Types of Heat Pipes
  • Micro heat pipes- small heat pipes that are
    noncircular and use angled corners as liquid
    arteries. Characterized by the equation rc /rh?1
    where rc is the capillary radius, and rh is
  • the hydraulic radius of the flow
  • channel. Employed in cooling
  • semiconductors (improve
  • thermal control), laser diodes,
  • photovoltaic cells, medical
  • devices.
  • (Peterson,1994)

12
Types of Heat Pipes
  • Variable conductance- allows variable heat fluxes
    into the evaporator while evaporator temperature
    remains constant by pushing a non- condensable
    gas into the condenser when heat fluxes are low
    and moving the gas out of the condenser when heat
    fluxes are high, thereby, increasing condenser
    surface area. They come in various forms like
    excess-liquid or gas-loaded form. The gas-loaded
    form is shown below. Used in electronics cooling.
    (Faghiri,1995)

13
Types of Heat Pipes
  • Capillary pumped loop heat pipe- for systems
    where the heat fluxes are very high or where the
    heat from the heat source needs to be moved far
    away. In the loop heat pipe, the vapor travels
    around in a loop where it condenses and returns
    to the evaporator. Used in electronics cooling.
  • (Faghiri, 1995)

14
Main Heat Transfer Limitations
  • Capillary limit- occurs when the capillary
    pressure is too low to provide enough liquid to
    the evaporator from the condenser. Leads to
    dryout in the evaporator. Dryout prevents the
    thermodynamic cycle from continuing and the heat
    pipe no longer functions properly.
  • Boiling Limit- occurs when the radial heat flux
    into the heat pipe causes the liquid in the wick
    to boil and evaporate causing dryout.
  • (Faghiri, 1995)

15
Heat Transfer Limitations
  • Entrainment Limit- at high vapor velocities,
    droplets of liquid in the wick are torn from the
    wick and sent into the vapor. Results in dryout.
  • Sonic limit- occurs when the vapor velocity
    reaches sonic speed at the evaporator and any
    increase in pressure difference will not speed up
    the flow like choked flow in converging-diverging
    nozzle. Usually occurs during startup of heat
    pipe.
  • Viscous Limit- at low temperatures the vapor
    pressure difference between the condenser and the
    evaporator may not be enough to overcome viscous
    forces. The vapor from the evaporator doesnt
    move to the condenser and the thermodynamic cycle
    doesnt occur.
  • (Faghiri, 1995)

16
Heat Transfer Limitations
  • Each limit has its own particular range in which
    it is important. However, in practical
    operation, the capillary and boiling limits are
    the most important. The figure below is an
    example of these ranges.

(Peterson,1994)
17
Heat Transfer Limitations
  • Actual performance curves, capillary limit and
    boiling limit, are the limiting factors.

http//www.electronics-cooling.com/Resources/EC_Ar
ticles/SEP96/sep96_02.htm
18
Capillary Limit
  • For a heat pipe to function properly, the
    capillary pressure must be greater or equal to
    the sum of the pressure drops due to inertial,
    viscous, and hydrostatic forces, as well as,
    pressure gradients.
  • If it is not, then the working fluid is not
    supplied rapidly enough to the evaporator to
    compensate for the liquid loss through
    vaporization. If this occurs, there is dryout in
    the evaporator.

(Peterson, 1994)
19
Capillary Limit
  • Equation for minimum capillary pressure

(Peterson, 1994)
20
Boiling Limit
  • The Boiling limit is due to excessive radial heat
    flux all the other limits are due to axial heat
    flux.
  • The maximum heat flux beyond which bubble growth
    will occur resulting in dryout is given by

(Peterson, 1994)
21
Boiling Limit
  • Keff given by the table below

22
Resistance Network
(Peterson, 1994)
23
Heat Pipe Resistance
  • In certain applications the temperature
    difference between the evaporator and the
    condenser needs to be known, such as in
    electronics cooling. This may be done using a
    thermal circuit.
  • The main resistances within the heat pipe are
  • Resistance Order of Magnitude
  • Rw,a? liquid-wick resistance in the adiabatic
    section 104
  • Rp,a? axial resistance of the pipe wall 102
  • Rw,e? liquid-wick resistance in the
    evaporator 101
  • Rw,c? liquid-wick resistance in the
    condenser 101
  • Rp,e? radial resistance of the pipe wall at the
    evaporator 10-1
  • Rp,c? radial resistance of the pipe wall at the
    condenser 10-1
  • Other resistances exist but most are small
    relative to the above resistances.
  • The external resistances the resistances
    transferring the heat to and from the heat pipe
    are also important in some cases.

(Peterson, 1994)
24
Heat Pipe Resistance
  • The liquid-wick combination for the three heat
    pipe sections are given by
  • Keff given on a previous slide
  • The radial and axial resistances can be
    determined from traditional resistance equations
    for cylindrical shapes and flat plates depending
    on the shape of the heat pipe.

(Peterson, 1994)
25
The Wick and its Design
  • Main Purpose- provides structure and force that
    transports the condensate liquid back to the
    evaporator. Also, ensures working fluid is evenly
    distributed over evaporator surface.

(Peterson, 1994)
26
Capillary Pressure
  • The driving force that transports the condensed
    working liquid through the wick to the evaporator
    is provided by capillary pressure. Working fluids
    that are employed in heat pipes have concave
    facing menisci (wetting liquids) as opposed to
    convex facing menisci (non wetting liquids).
  • Contact angle is defined as the angle between
    the solid and vapor regions. Wetting fluids have
    angles between 0 and 90 degrees. Non wetting
    fluids have angles between 90 and 180 degrees.
  • (Faghiri, 1995)

27
Capillary Pressure
  • Wetting angle

Water Wetting liquid
Mercury Non wetting liquid
http//cwx.prenhall.com/petrucci/medialib/media_po
rtfolio/text_images/FG13_04.JPG
28
Capillary Pressure
  • The shape of a fluids meniscus is dependent on
    the fluids surface tension and the solid-fluid
    adhesion force. If the adhesion force is greater
    than the surface tension, the liquid near the
    solid will be forced up and the surface tension
    of the liquid will keep the surface intact
    causing the entire liquid to move up.
  • http//hyperphysics.phy-astr.gsu.edu/hbase/hframe
    .html
  • When the liquid in the evaporator vaporizes, the
    radius of curvature of the menisci in the wick
    decreases. As the vapor condenses in the
    condenser, the radius of curvature of the menisci
    in the wick increases. The difference in the
    radius of curvature results in capillary pressure
    (Peterson,1994) . Capillary pressure is also due
    to body forces and phase-change interactions
    (Faghiri, 1995).

29
Capillary Pressure
  • The capillary pressure created by two menisci of
    different radii of curvature is given by
  • Where RI and RII are radii of curvature and s is
    the surface tension.
  • Called the Young-Laplace Equation
  • (Peterson,1994)

30
Capillary Pressure
  • To maximize capillary pressure, the minimum radii
    is needed. For a circular capillary the minimum
    radii is
  • Substituting these values into the formula for
    capillary pressure
  • For max capillary pressure theta must be zero

(Peterson,1994)
31
Capillary Pressure
  • Wetting fluids have a cos? value that will be
    positive. This results in a positive capillary
    pressure that creates a pushing force on the
    liquid in the wick near the condenser this
    forces the liquid to move to the evaporator.
  • Non-wetting fluids will have cos? values that are
    negative, resulting in a negative capillary
    pressure that creates a suction force on the
    liquid in the wick. The liquid is prevented from
    moving to the evaporator.
  • For this reason, the working liquid in heat pipes
    must be a wetting liquid.

(Peterson,1994)
32
Wick Design
  • Two main types of wicks homogeneous and
    composite.
  • Homogeneous- made from one type of material or
    machining technique. Tend to have either high
    capillary pressure and low permeability or the
    other way around. Simple to design, manufacture,
    and install (Faghiri, 1995) .
  • Composite- made of a combination of several types
    or porosities of materials and/or configurations.
    Capillary pumping and axial fluid transport are
    handled independently (Peterson,1994) . Tend to
    have a higher capillary limit than homogeneous
    wicks but cost more (Faghiri, 1995).

33
Wick Design
  • Three properties effect wick design
  • 1. High pumping pressure- a small capillary pore
    radius (channels through which the liquid travels
    in the wick) results in a large pumping
    (capillary) pressure.
  • 2. Permeability - large pore radius results in
    low liquid pressure drops and low flow
    resistance.
  • Design choice should be made that balances large
    capillary pressure with low liquid pressure drop.
    Composite wicks tend to find a compromise between
    the two.
  • 3.Thermal conductivity - a large value will
    result in a small temperature difference for high
    heat fluxes.

(Peterson,1994)
34
Wick Design
http//www.electronics-cooling.com/Resources/EC_Ar
ticles/SEP96/sep96_02.htm
(Peterson,1994).
35
Choosing the Working Fluid
  • Heat pipes work on a cycle of vaporization and
    condensation of the working fluid, which results
    in the heat pipes high thermal conductivity.
    When choosing a working fluid for a heat pipe,
    the fluid must be able to operate within the heat
    pipes operating temperature range. For instance,
    if the operating temperatures are too high, the
    fluid may not be able to condense. However, if
    the operating temperatures are too low the fluid
    will not be able to evaporate. Watch the
    saturation temperature for your desired fluid at
    the desired heat pipe internal pressure.
  • In addition, the working fluid must be compatible
    with the wick and container material.

(Peterson, 1994).
36
Choosing the Working Fluid
  • Operating temperature ranges for various working
    fluids

http//www.cheresources.com/htpipes.shtml
37
Choosing the Working Fluid
  • Generally, as the operating temperature range of
    the working fluid increases, the heat transport
    capability increases.
  • Choice of working fluid should also incorporate
    the fluids interactions with the heat pipe
    container and wick.

(Peterson, 1994).
38
Choosing the Working Fluid
  • Chi(1976) developed a parameter of gauging the
    effectiveness of a working fluid called the
    liquid transport factor
  • Where?? is the latent heat of vaporization and ?
    is the surface tension. Subscript ? refers to
    the liquid
  • For electronics cooling applications, occurring
    in low to moderate temperatures, water is the
    liquid with the highest liquid transport factor.
    Another common fluid is ammonia.

(Peterson, 1994).
39
Container Design
  • Things that should be considered for container
    design
  • Operating temperature range of the heat pipe.
  • Internal operating pressure and container
    structural integrity.
  • Evaporator and condenser size and shape.
  • Possibility of external corrosion.
  • Prevent leaks.
  • Compatibility with wick and working fluid.
  • (peterson,1994)

40
Container Design
  • Stresses
  • Since the heat pipe is like a pressure vessel it
    must satisfy ASME pressure vessel codes.
  • Typically the maximum allowable stress at any
    given temperature can only be one-fourth of the
    materials maximum tensile strength.
  • (peterson, 1994)

41
Container Design
  • Typical materials
  • Aluminum
  • Stainless steel
  • Copper
  • Composite materials
  • High temperature heat pipes may use refractory
    materials or linings to prevent corrosion.
  • (Peterson, 1994)

42
Heat pipe Compatibility
  • When designing a heat pipe, the working fluid,
    wick, and container must function properly when
    operating together. For example, the working
    fluid may not be wettable with the wick or the
    fluid and container may undergo a chemical
    reaction with each other.

(Peterson, 1994)
43
Heat pipe Compatibility
  • Working fluid/
  • material
  • compatibility.

(Faghiri, 1995)
44
Heat Sink/Source Interface
  • The contact resistance between the evaporator and
    the heat source and between the condenser and the
    heat sink is relatively large and should be
    minimized.
  • Methods used to join the parts include use of
    thermally conductive adhesives, as well as,
    brazed, or soldered techniques.
  • (Peterson, 1994)

45
Heat Pipes in Electronics Cooling
  • Cooling of electronics has one primary goal
    maintain a components temperatures at or below
    the manufacturers maximum allowable temperature.
    As the temperature of an electronic part
    increases the rate of failure increases.
  • (Peterson, 1994)

46
Heat Pipes in Electronics Cooling
  • Heat pipes are excellent candidates for
    electronics cooling because of their high thermal
    conductivity, high heat transfer characteristics,
    they provide constant evaporator temperatures
    with variable heat fluxes, and variable
    evaporator and condenser sizes.
  • Therefore, they are good alternatives to large
    heat sinks, especially in laptops where space is
    limited.
  • They are good alternative to air cooling because
    of their better heat transport capabilities. Air
    cooling may still be used to remove heat from the
    condenser.
  • (Peterson, 1994).

47
Heat Pipes in Electronics Cooling
  • Common heat pipes used in electronics cooling
  • Micro heat pipes
  • Capillary looped heat pipes
  • Flat plate heat pipes
  • Variable conductance heat pipes

48
Heat Pipes in Electronics Cooling
  • In single component cooling, the heat pipes
    evaporator may be attached to an individual heat
    source (power transistor, thyristor, or chip).
  • The condenser is attached to a heat sink to
    dissipate the heat through free or forced
    convection.
  • (Peterson, 1994)

49
Heat Pipes in Electronics Cooling
  • Cooling can also occur with multiple arrays of
    devices or entire printed wiring boards.
  • (Peterson, 1994)

50
Heat Pipes in Electronics Cooling
  • An arrayed heat pipe cooling system

(Peterson, 1994)
51
Heat Pipes in Electronics Cooling
  • Heat pipe cooling a component set up in an array
  • (Peterson, 1994)

52
Heat Pipes in Electronics Cooling
  • Since many semiconductors are small, micro heat
    pipes may be used for cooling individual
    semiconductors or an array. Good for applications
  • where space is limited
  • like laptops.
  • (Peterson, 1994)

53
Heat Pipes in Electronics Cooling
  • When the electrical power is high and the heat
    rejection requirements large and nucleate pool
    boiling occurs, another method of cooling a heat
    source may be employed.
  • Nucleate pool boiling causes a large temperature
    drop. To reduce the drop, you can make the device
    a part of the wick structure to ensure that fresh
    liquid is always in contact with the heat source.
    Further providing cooling to the transistor.
  • In the image to the right the heat source (a
    transistor chip) is in contact with the working
    liquid and the working liquid is being evaporated
    away, cooling the transistor.
  • (Peterson, 1994)

54
Heat Pipes in Electronics Cooling
  • Summary
  • Heat pipes enable devices with higher density
    heat dissipation requirements and greater
    reliability.
  • Low cost
  • Proven alternative to conventional methods of
    electronics cooling.
  • (Peterson, 1994)

55
Current Research in Electronics Cooling
  • Laptops today perform well and are small
    therefore, they have high heat dissipation
    demands.
  • Excess heat may slow down the processors speed
    or shut the laptop off. (Junnarkar, 2003)
  • First time a heat pipe used in a laptop was in
    1994. Current heat pipes move the heat from the
    CPU to a small heat sink. (Ali et al., 1999)

56
Current Research in Electronics Cooling
  • Because micro heat pipes are small they are very
    useful in cooling of laptops where space is
    highly restricted.
  • Wang and Peterson (2003) have come up with two
    different micro heat pipe setups for laptop
    cooling
  • Micro heat pipes configured into flat plate
    shapes were employed to cool a CPU. The condenser
    was attached to a heat sink. The heat sink was
    smaller in size than one not attached to a heat
    pipe because the base of the heat sink attached
    to a heat pipe experiences more uniform
    temperatures and therefore, an increased
    efficiency.

57
Current Research in Electronics Cooling
  • Two different configurations were developed
  • Both were 152.4 mm long and 25.4 mm wide
  • Layers of copper screen mesh, with parallel wires
    and two copper sheets were formed, in the shape
    of a flat heat pipe, to form an enclosed space.
  • No capillary wick structure needed because of the
    micro heat pipes sharp corners.
  • The fan is strategically placed to provide forced
    convection to the heat sink.

58
Current Research in Electronics Cooling
59
Current Research in Electronics Cooling
  • Main Results
  • In configuration 1, tilt angle effected the
    amount of heat dissipated
  • In configuration 2, tilt angle had no effect on
    amount dissipated.
  • Important because laptops experience operation in
    many orientations.

60
Current Research in Electronics Cooling
Mesh number is defined as the number of openings
per linear inch. (About,2006)
61
Current Research in Electronics Cooling
  • Things that increased heat transport capacity
  • Increasing mesh number
  • Increasing wire diameter

62
Current Research in Electronics Cooling
  • The thermal resistance from the heat sink to the
    device junction, due to the cooling of the heat
    pipe with forced convection, is greater for case
    1 than case 2 at all air velocities. The values
    were determined from the relation
  • Where Qc is the heat dissipated through the heat
    sink

63
Current Research in Electronics Cooling
64
Current Research in Electronics Cooling
  • Other discoveries
  • Within the CPUs operating temperature limit, the
    heat capacity of a micro heat pipe is restricted
    by the heat sinks ability to transfer heat
    through convection
  • Heat transfer not restricted by the capillary
    limit.

65
Current Research in Electronics Cooling
The maximum heat transfer limit provided by the
heat pipe, for the most part, is not reached due
to deficiencies in the heat sinks ability to
transfer heat through convection.
66
Current Research in Electronics Cooling
  • Case 2 provided a lower thermal resistance and a
    greater heat transport capacity than Case 1.
  • Case 2 transported 52W at 85?C and .85 ?C /W
    resistance.
  • Case 1 transported 24W at 85?C and 1.55 ?C /W
    resistance.

67
References
  • About, Inc. (2006). May 2006. http//composite.abo
    ut.com/library/glossary/m/bldef-m3304.htm
  • Ali, A., Dehoff, R., and Grubb, K., 1999.
    Advanced Heat Pipe Thermal Solutions For Higher
    Power Notebook Computers.
  • Basilius, A., Tanzer, H., and McCabe, S., 1987
    Heat Pipes for Cooling of High Density Printed
    Wiring Boards, Proc. 6th Int. Heat Pipe Conf.,
    Grenoble, France, pp.531-536.
  • The Chemical Engineers Resource Page. 2004.
    March 2006. http//www.cheresources.com/htpipes.sh
    tml
  • Chi, 1976, Heat Pipe Theory and Practice,
    McGraw-Hill, New York.
  • Dunn, P.D., and Reay, D.A., 1982, HJeat Pipes,
    3rd.ed., Pergamon, Oxford.
  • Faghri, Amin, 1995. Heat Pipe Science and
    Technology. US Taylor Francis
  • Junnarkar, Sandeep. Laptops Cool off with
    Smart Heat Pipes. Cnet News.com. January22,
    2003. March 2006.
  • Lightstream Photonics (2003). March 2006.
  • http//www.lightstreamphotonics.com/images/tech_o
    rangecontainer_small.png
  • Murase, T., Yoshida, K., Koizumi, T., and Ishida,
    N., 1982, Heat Pipe Heat Sink Heat Kicker for
    Cooling of Semi-Conductors, Furukama Review,
    Tokyo, Japan, Vol.2, pp24-33.
  • Nave, R. Hyperphysics -capillary action. 2006.
    March 2006. http//hyperphysics.phy-astr.gsu.edu/
    hbase/hframe.html
  • Nelson, L., Sekhon, K., and Fritz, J. E., 1978,
    Direct Heat Pipe Cooling of Semiconductor
    Devices, Proc. 3rd Int. Heat Pipe Conf., Palo
    Alto, CA, pp373-376.
  • Peterson, G.P., 1994. An Introduction to Heat
    Pipes. Canada John Wiley Sons, Inc.
  • Petrucci, R.H., Harwood, W.S., Herring, G.
    General Chemisty Principles and Modern
    Applications. 2001, Prentice-Hall, Inc.
    Compainion Website. Narayan S. Homane. March
    2006. http//cwx.prenhall.com/petrucci/medialib/me
    dia_portfolio/text_images/FG13_04.JPG
  • Warner, S. (2006) May 2006. http//www.electronics
    -cooling.com/Resources/EC_Articles/SEP96/sep96_02.
    htm
  • Wang, Y., and Peterson, G., 2003. Flat Heat
    Pipe Cooling Devices for Mobile Computers. ASME
    International Mechanical Engineering Congress,
    Washington, D.C., Nov. 15-21,2003.
  • Zorbil, V., Stulc, P., and Polasek, F., 1988,
    Enhancement Cooling of the Boards with Integrated
    Circuits by Heat Pipes, Proc. 3rd. Int. Heat
    Pipe Symp., Tsukuba, Japan, pp273-279.
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