Title: Fundamentals of Heat Pipes
1Fundamentals of Heat Pipes
- With Applications to Electronics Cooling
- -- Widah Saied
2Introduction
- Things to be discussed
- Basic components
- Advantages
- Ideal thermodynamic cycle
- Applications
- Types
- Heat transfer limitations
- Resistance network
- Wick design
- Choosing the working fluid
- Container design
- Heat pipes in electronics cooling
- Current research in electronics cooling
3Basic Components
Adiabatic section
evaporator
wick
condenser
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4Advantages of Heat Pipes
- Very high thermal conductivity. Less temperature
difference needed to transport heat than
traditional materials (thermal conductivity up to
90 times greater than copper for the same size)
(Faghiri, 1995) resulting, in low thermal
resistance. (Peterson,1994) - Power flattening. A constant condenser heat flux
can be maintained while the evaporator
experiences variable heat fluxes. (Faghiri, 1995)
- Efficient transport of concentrated heat.
(Faghiri, 1995)
5Advantages of Heat Pipes
- Temperature Control. The evaporator and condenser
temperature can remain nearly constant (at Tsat)
while heat flux into the evaporator may vary
(Faghiri, 1995) . - Geometry control. The condenser and evaporator
can have different areas to fit variable area
spaces (Faghiri, 1995) . High heat flux inputs
can be dissipated with low heat flux outputs only
using natural or forced convection(Peterson,1994)
.
6Thermodynamic Cycle
- 1-2 Heat applied to evaporator through external
sources vaporizes working fluid to a
saturated(2) or superheated (2) vapor. - 2-3 Vapor pressure drives vapor through adiabatic
section to condenser. - 3-4 Vapor condenses, releasing heat to a heat
sink. - 4-1 Capillary pressure created by menisci in wick
pumps condensed fluid into evaporator section. - Process starts over.
-
- (Faghiri, 1995)
7Ideal Thermodynamic Cycle
(Faghiri, 1995)
8Heat Pipe Applications
- Electronics cooling- small high performance
components cause high heat fluxes and high heat
dissipation demands. Used to cool transistors and
high density semiconductors. - Aerospace- cool satellite solar array, as well as
shuttle leading edge during reentry. - Heat exchangers- power industries use heat pipe
heat exchangers as air heaters on boilers. - Other applications- production tools, medicine
and human body temperature control, engines and
automotive industry. - (Faghiri, 1995)
9Types of Heat Pipes
- Thermosyphon- gravity assisted wickless heat
pipe. Gravity is used to force the condensate
back into the evaporator. Therefore, condenser
must be above the evaporator in a gravity field. - Leading edge- placed in the leading edge of
hypersonic vehicles to cool high heat fluxes near
the wing leading edge. (Faghiri, 1995) - Rotating and revolving- condensate returned to
the evaporator through centrifugal force. No
capillary wicks required. Used to cool turbine
components and armatures for electric motors. - Cryogenic- low temperature heat pipe. Used to
cool optical instruments in space. (Peterson,
1994) -
10Types of Heat Pipes
- Flat Plate- much like traditional cylindrical
heat pipes but are rectangular. Used to cool and
flatten temperatures of semiconductor or
transistor packages assembled in arrays on the
top of the heat pipe.
(Faghiri,1995)
11Types of Heat Pipes
- Micro heat pipes- small heat pipes that are
noncircular and use angled corners as liquid
arteries. Characterized by the equation rc /rh?1
where rc is the capillary radius, and rh is - the hydraulic radius of the flow
- channel. Employed in cooling
- semiconductors (improve
- thermal control), laser diodes,
- photovoltaic cells, medical
- devices.
-
- (Peterson,1994)
12Types of Heat Pipes
- Variable conductance- allows variable heat fluxes
into the evaporator while evaporator temperature
remains constant by pushing a non- condensable
gas into the condenser when heat fluxes are low
and moving the gas out of the condenser when heat
fluxes are high, thereby, increasing condenser
surface area. They come in various forms like
excess-liquid or gas-loaded form. The gas-loaded
form is shown below. Used in electronics cooling.
(Faghiri,1995)
13Types of Heat Pipes
- Capillary pumped loop heat pipe- for systems
where the heat fluxes are very high or where the
heat from the heat source needs to be moved far
away. In the loop heat pipe, the vapor travels
around in a loop where it condenses and returns
to the evaporator. Used in electronics cooling. - (Faghiri, 1995)
14Main Heat Transfer Limitations
- Capillary limit- occurs when the capillary
pressure is too low to provide enough liquid to
the evaporator from the condenser. Leads to
dryout in the evaporator. Dryout prevents the
thermodynamic cycle from continuing and the heat
pipe no longer functions properly. - Boiling Limit- occurs when the radial heat flux
into the heat pipe causes the liquid in the wick
to boil and evaporate causing dryout. - (Faghiri, 1995)
15Heat Transfer Limitations
- Entrainment Limit- at high vapor velocities,
droplets of liquid in the wick are torn from the
wick and sent into the vapor. Results in dryout. - Sonic limit- occurs when the vapor velocity
reaches sonic speed at the evaporator and any
increase in pressure difference will not speed up
the flow like choked flow in converging-diverging
nozzle. Usually occurs during startup of heat
pipe. - Viscous Limit- at low temperatures the vapor
pressure difference between the condenser and the
evaporator may not be enough to overcome viscous
forces. The vapor from the evaporator doesnt
move to the condenser and the thermodynamic cycle
doesnt occur. -
- (Faghiri, 1995)
16Heat Transfer Limitations
- Each limit has its own particular range in which
it is important. However, in practical
operation, the capillary and boiling limits are
the most important. The figure below is an
example of these ranges.
(Peterson,1994)
17Heat Transfer Limitations
- Actual performance curves, capillary limit and
boiling limit, are the limiting factors.
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18Capillary Limit
- For a heat pipe to function properly, the
capillary pressure must be greater or equal to
the sum of the pressure drops due to inertial,
viscous, and hydrostatic forces, as well as,
pressure gradients. - If it is not, then the working fluid is not
supplied rapidly enough to the evaporator to
compensate for the liquid loss through
vaporization. If this occurs, there is dryout in
the evaporator.
(Peterson, 1994)
19Capillary Limit
- Equation for minimum capillary pressure
(Peterson, 1994)
20Boiling Limit
- The Boiling limit is due to excessive radial heat
flux all the other limits are due to axial heat
flux. - The maximum heat flux beyond which bubble growth
will occur resulting in dryout is given by
(Peterson, 1994)
21Boiling Limit
- Keff given by the table below
22Resistance Network
(Peterson, 1994)
23Heat Pipe Resistance
- In certain applications the temperature
difference between the evaporator and the
condenser needs to be known, such as in
electronics cooling. This may be done using a
thermal circuit. - The main resistances within the heat pipe are
- Resistance Order of Magnitude
- Rw,a? liquid-wick resistance in the adiabatic
section 104 - Rp,a? axial resistance of the pipe wall 102
- Rw,e? liquid-wick resistance in the
evaporator 101 - Rw,c? liquid-wick resistance in the
condenser 101 - Rp,e? radial resistance of the pipe wall at the
evaporator 10-1 - Rp,c? radial resistance of the pipe wall at the
condenser 10-1 - Other resistances exist but most are small
relative to the above resistances. - The external resistances the resistances
transferring the heat to and from the heat pipe
are also important in some cases.
(Peterson, 1994)
24Heat Pipe Resistance
- The liquid-wick combination for the three heat
pipe sections are given by - Keff given on a previous slide
- The radial and axial resistances can be
determined from traditional resistance equations
for cylindrical shapes and flat plates depending
on the shape of the heat pipe.
(Peterson, 1994)
25The Wick and its Design
- Main Purpose- provides structure and force that
transports the condensate liquid back to the
evaporator. Also, ensures working fluid is evenly
distributed over evaporator surface.
(Peterson, 1994)
26Capillary Pressure
- The driving force that transports the condensed
working liquid through the wick to the evaporator
is provided by capillary pressure. Working fluids
that are employed in heat pipes have concave
facing menisci (wetting liquids) as opposed to
convex facing menisci (non wetting liquids). - Contact angle is defined as the angle between
the solid and vapor regions. Wetting fluids have
angles between 0 and 90 degrees. Non wetting
fluids have angles between 90 and 180 degrees. -
- (Faghiri, 1995)
27Capillary Pressure
Water Wetting liquid
Mercury Non wetting liquid
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28Capillary Pressure
- The shape of a fluids meniscus is dependent on
the fluids surface tension and the solid-fluid
adhesion force. If the adhesion force is greater
than the surface tension, the liquid near the
solid will be forced up and the surface tension
of the liquid will keep the surface intact
causing the entire liquid to move up. - http//hyperphysics.phy-astr.gsu.edu/hbase/hframe
.html - When the liquid in the evaporator vaporizes, the
radius of curvature of the menisci in the wick
decreases. As the vapor condenses in the
condenser, the radius of curvature of the menisci
in the wick increases. The difference in the
radius of curvature results in capillary pressure
(Peterson,1994) . Capillary pressure is also due
to body forces and phase-change interactions
(Faghiri, 1995).
29Capillary Pressure
- The capillary pressure created by two menisci of
different radii of curvature is given by - Where RI and RII are radii of curvature and s is
the surface tension. - Called the Young-Laplace Equation
-
- (Peterson,1994)
30Capillary Pressure
- To maximize capillary pressure, the minimum radii
is needed. For a circular capillary the minimum
radii is - Substituting these values into the formula for
capillary pressure - For max capillary pressure theta must be zero
(Peterson,1994)
31Capillary Pressure
- Wetting fluids have a cos? value that will be
positive. This results in a positive capillary
pressure that creates a pushing force on the
liquid in the wick near the condenser this
forces the liquid to move to the evaporator. - Non-wetting fluids will have cos? values that are
negative, resulting in a negative capillary
pressure that creates a suction force on the
liquid in the wick. The liquid is prevented from
moving to the evaporator. - For this reason, the working liquid in heat pipes
must be a wetting liquid.
(Peterson,1994)
32Wick Design
- Two main types of wicks homogeneous and
composite. - Homogeneous- made from one type of material or
machining technique. Tend to have either high
capillary pressure and low permeability or the
other way around. Simple to design, manufacture,
and install (Faghiri, 1995) . - Composite- made of a combination of several types
or porosities of materials and/or configurations.
Capillary pumping and axial fluid transport are
handled independently (Peterson,1994) . Tend to
have a higher capillary limit than homogeneous
wicks but cost more (Faghiri, 1995).
33Wick Design
- Three properties effect wick design
- 1. High pumping pressure- a small capillary pore
radius (channels through which the liquid travels
in the wick) results in a large pumping
(capillary) pressure. - 2. Permeability - large pore radius results in
low liquid pressure drops and low flow
resistance. - Design choice should be made that balances large
capillary pressure with low liquid pressure drop.
Composite wicks tend to find a compromise between
the two. - 3.Thermal conductivity - a large value will
result in a small temperature difference for high
heat fluxes.
(Peterson,1994)
34Wick Design
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(Peterson,1994).
35Choosing the Working Fluid
- Heat pipes work on a cycle of vaporization and
condensation of the working fluid, which results
in the heat pipes high thermal conductivity.
When choosing a working fluid for a heat pipe,
the fluid must be able to operate within the heat
pipes operating temperature range. For instance,
if the operating temperatures are too high, the
fluid may not be able to condense. However, if
the operating temperatures are too low the fluid
will not be able to evaporate. Watch the
saturation temperature for your desired fluid at
the desired heat pipe internal pressure. - In addition, the working fluid must be compatible
with the wick and container material.
(Peterson, 1994).
36Choosing the Working Fluid
- Operating temperature ranges for various working
fluids
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37Choosing the Working Fluid
- Generally, as the operating temperature range of
the working fluid increases, the heat transport
capability increases. - Choice of working fluid should also incorporate
the fluids interactions with the heat pipe
container and wick.
(Peterson, 1994).
38Choosing the Working Fluid
- Chi(1976) developed a parameter of gauging the
effectiveness of a working fluid called the
liquid transport factor - Where?? is the latent heat of vaporization and ?
is the surface tension. Subscript ? refers to
the liquid -
- For electronics cooling applications, occurring
in low to moderate temperatures, water is the
liquid with the highest liquid transport factor.
Another common fluid is ammonia.
(Peterson, 1994).
39Container Design
- Things that should be considered for container
design - Operating temperature range of the heat pipe.
- Internal operating pressure and container
structural integrity. - Evaporator and condenser size and shape.
- Possibility of external corrosion.
- Prevent leaks.
- Compatibility with wick and working fluid.
- (peterson,1994)
40Container Design
- Stresses
- Since the heat pipe is like a pressure vessel it
must satisfy ASME pressure vessel codes. - Typically the maximum allowable stress at any
given temperature can only be one-fourth of the
materials maximum tensile strength. - (peterson, 1994)
41Container Design
- Typical materials
- Aluminum
- Stainless steel
- Copper
- Composite materials
- High temperature heat pipes may use refractory
materials or linings to prevent corrosion. - (Peterson, 1994)
42Heat pipe Compatibility
- When designing a heat pipe, the working fluid,
wick, and container must function properly when
operating together. For example, the working
fluid may not be wettable with the wick or the
fluid and container may undergo a chemical
reaction with each other.
(Peterson, 1994)
43Heat pipe Compatibility
- Working fluid/
- material
- compatibility.
(Faghiri, 1995)
44Heat Sink/Source Interface
- The contact resistance between the evaporator and
the heat source and between the condenser and the
heat sink is relatively large and should be
minimized. - Methods used to join the parts include use of
thermally conductive adhesives, as well as,
brazed, or soldered techniques.
45Heat Pipes in Electronics Cooling
- Cooling of electronics has one primary goal
maintain a components temperatures at or below
the manufacturers maximum allowable temperature.
As the temperature of an electronic part
increases the rate of failure increases. - (Peterson, 1994)
46Heat Pipes in Electronics Cooling
- Heat pipes are excellent candidates for
electronics cooling because of their high thermal
conductivity, high heat transfer characteristics,
they provide constant evaporator temperatures
with variable heat fluxes, and variable
evaporator and condenser sizes. - Therefore, they are good alternatives to large
heat sinks, especially in laptops where space is
limited. - They are good alternative to air cooling because
of their better heat transport capabilities. Air
cooling may still be used to remove heat from the
condenser.
47Heat Pipes in Electronics Cooling
- Common heat pipes used in electronics cooling
- Micro heat pipes
- Capillary looped heat pipes
- Flat plate heat pipes
- Variable conductance heat pipes
48Heat Pipes in Electronics Cooling
- In single component cooling, the heat pipes
evaporator may be attached to an individual heat
source (power transistor, thyristor, or chip). - The condenser is attached to a heat sink to
dissipate the heat through free or forced
convection.
49Heat Pipes in Electronics Cooling
- Cooling can also occur with multiple arrays of
devices or entire printed wiring boards.
50Heat Pipes in Electronics Cooling
- An arrayed heat pipe cooling system
(Peterson, 1994)
51Heat Pipes in Electronics Cooling
- Heat pipe cooling a component set up in an array
52Heat Pipes in Electronics Cooling
- Since many semiconductors are small, micro heat
pipes may be used for cooling individual
semiconductors or an array. Good for applications
- where space is limited
- like laptops.
- (Peterson, 1994)
53Heat Pipes in Electronics Cooling
- When the electrical power is high and the heat
rejection requirements large and nucleate pool
boiling occurs, another method of cooling a heat
source may be employed. - Nucleate pool boiling causes a large temperature
drop. To reduce the drop, you can make the device
a part of the wick structure to ensure that fresh
liquid is always in contact with the heat source.
Further providing cooling to the transistor. - In the image to the right the heat source (a
transistor chip) is in contact with the working
liquid and the working liquid is being evaporated
away, cooling the transistor.
54Heat Pipes in Electronics Cooling
- Summary
- Heat pipes enable devices with higher density
heat dissipation requirements and greater
reliability. - Low cost
- Proven alternative to conventional methods of
electronics cooling. - (Peterson, 1994)
55Current Research in Electronics Cooling
- Laptops today perform well and are small
therefore, they have high heat dissipation
demands. - Excess heat may slow down the processors speed
or shut the laptop off. (Junnarkar, 2003) - First time a heat pipe used in a laptop was in
1994. Current heat pipes move the heat from the
CPU to a small heat sink. (Ali et al., 1999)
56Current Research in Electronics Cooling
- Because micro heat pipes are small they are very
useful in cooling of laptops where space is
highly restricted. - Wang and Peterson (2003) have come up with two
different micro heat pipe setups for laptop
cooling - Micro heat pipes configured into flat plate
shapes were employed to cool a CPU. The condenser
was attached to a heat sink. The heat sink was
smaller in size than one not attached to a heat
pipe because the base of the heat sink attached
to a heat pipe experiences more uniform
temperatures and therefore, an increased
efficiency.
57Current Research in Electronics Cooling
- Two different configurations were developed
- Both were 152.4 mm long and 25.4 mm wide
- Layers of copper screen mesh, with parallel wires
and two copper sheets were formed, in the shape
of a flat heat pipe, to form an enclosed space. - No capillary wick structure needed because of the
micro heat pipes sharp corners. - The fan is strategically placed to provide forced
convection to the heat sink.
58Current Research in Electronics Cooling
59Current Research in Electronics Cooling
- Main Results
- In configuration 1, tilt angle effected the
amount of heat dissipated - In configuration 2, tilt angle had no effect on
amount dissipated. - Important because laptops experience operation in
many orientations.
60Current Research in Electronics Cooling
Mesh number is defined as the number of openings
per linear inch. (About,2006)
61Current Research in Electronics Cooling
- Things that increased heat transport capacity
- Increasing mesh number
- Increasing wire diameter
62Current Research in Electronics Cooling
- The thermal resistance from the heat sink to the
device junction, due to the cooling of the heat
pipe with forced convection, is greater for case
1 than case 2 at all air velocities. The values
were determined from the relation - Where Qc is the heat dissipated through the heat
sink
63Current Research in Electronics Cooling
64Current Research in Electronics Cooling
- Other discoveries
- Within the CPUs operating temperature limit, the
heat capacity of a micro heat pipe is restricted
by the heat sinks ability to transfer heat
through convection - Heat transfer not restricted by the capillary
limit.
65Current Research in Electronics Cooling
The maximum heat transfer limit provided by the
heat pipe, for the most part, is not reached due
to deficiencies in the heat sinks ability to
transfer heat through convection.
66Current Research in Electronics Cooling
- Case 2 provided a lower thermal resistance and a
greater heat transport capacity than Case 1. - Case 2 transported 52W at 85?C and .85 ?C /W
resistance. - Case 1 transported 24W at 85?C and 1.55 ?C /W
resistance.
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