Who Cares About Quality

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Who Cares About Quality?
US/Canada Dial-in   [phone]
Int'l/Local Dial-In 1 [phone]

• Michael J Smith
• Michael.J.Smith_at_Teradyne.com

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Agenda - Who Cares About Quality?

• Industries that Care About Quality
• Technology Changes that Affect Quality
• XStation MX Quality Advantages
• Customers Who Care
• Summary

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Industries that Care About Quality
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Data Communications- High Reliability, Cutting
Edge Technologies
Source IBM
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Automotive- Life Critical, Harsh Environment
Drive by Wire!
Brake by Wire!
Source Delphi
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Telecommunications- Harsh Environment, Cutting
Edge Technology

• 18 month replacement
• Smaller and thinner
• High expectations
• Drop test!
• Must work

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Defense Aerospace- Mission Critical, Harsh
Environment

• High reliability
• They must work
• High cost of repair
• Limited access
• Limited burn-in
• Thermal layers/coated
• Parts on the boards cost up-to 100,000 each.

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Technology Changes that Effect Quality
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Quality Expectations Have Changed

• The Electronic PCB Assembly Process Produces
  Fewer Defects
• Quality improvements from inspection and ICT
  feedback
• Noise Level Defects in Production Have Now
  Become Important
• Insufficient and excess solder
• Field failures
• Cosmetic look
• Customer acceptance

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Electrical Loss of Access
Electrical Loss of Access
- Component density and geometries
- High frequency signals
- Time to market constraints
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Transition to Area Array from Peripheral Packages
Total Parts
Total Parts
Area Array Connect Packages
Peripheral Connect Packages
Source IPC Roadmap
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Loss of Visual Access
No Visual (AOI) Coverage of
- Area array packages - BGAs
- Shielding and covers fitted as part of the
process
- Other technologies with hidden joints - µBGA
and flip-chips - Fine pitch - Small pad
0201s - Stacked devices
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Lead Free - Can Change Quality

• Different Shaped Joints
• Increased Voiding

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Solder Joint Acceptability/Quality
Marginal Solder Joint

• What AOI Can See
• Leaded devices only
• Angles based on reflection
• No volume measurements
• Toe only

• What AXI Can See
• Full shape of Joint
• Volume measurement
• Full heel and toe measurements
• Angles based on slope of solder density

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XStation MX Quality Advantage
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Teradynes Imaging Quality Tool Suite
High Fault Coverage
Measurement Tools
Double Sided Boards Obscured Devices
ClearVueTM
Single Sided Boards High Throughput
TraXTM
Accurate Image Analysis Automated Defect Detection
X-AlgTM
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ClearVueTM 3D Capabilities

• Makes Obscured Components Clear, Visible and
  Inspectable
• Allows for multiple slicing of top and bottom
  side components.
• Provides Accurate Diagnostics
• Typically less than 500 ppmJ false fail rates.
• No mechanical errors and averaging
• Static image capture increases image quality.
• No moving parts during image capture.

• High Quality Imaging
• High resolution at large FOV to inspect 0201s
• Uses computational techniques to reconstruct
  images No blurring

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TraXTM 2D Capabilities

• Provides Single Sided Board Inspection
• Meets the Fastest Line Rates with Up to 6 Sq
  Inches per Second Throughput
• Provides Accurate Diagnostics,
• Typically less than 500 ppmJ False Fail Rates.
• No mechanical errors and averaging
• Static image capture increases image quality.
• No Moving Parts during image capture.

• High Quality Imaging
• High Resolution at Large FOV to inspect 0201s
• No image reconstruction No blurring

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XFrameTM Off-Line Programming

• Maximize System Utilization
• Tools Focused at Generating the Highest Quality
  Program

CAD Input and Model Generation
Automated Limit Setting and Fine Tuning
Slice Definition and Measurements
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High Quality Defect Detection
BGA
Gull-Wing
Discrete
PTH
J-Lead

• Detection Capabilities Include
• BGA, LCC, QFN, passives, PTH, slugs,
• Excess insufficient solder, voids, lifted
  leads, solder balls,
• Missing, tombstone, billboard, skew,
  off-position, bridging, opens,

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ClearVueTM Provides Maximum Fault Detection and
Lowest False Call Rates

• By Providing High Resolution Without Loss Of
  Original Image Information, All Defect Types Can
  Be Located

ClearVue Slice
Acquired Image
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ClearVueTM vs. Other X-Ray Technologies

• Poor Image Construction Masks Real Problems Using
  Laminography
• Capacitor on back side of board not removed from
  image
• Halo effect on BGA balls
• Poor Image Quality Using Laminography
• Voids are lost due to averaging
• Limited gray scale resolution (256 vs. 4,096)

1
4
2
3
3
XStation MX
Laminography
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ClearVueTM vs. Other X-Ray Technologies
2,303 grey levels delta between ball and
board Signal 83.3 Noise 1.4 SNR
57.4
70 grey levels delta between ball and board
(outer) 35 grey levels delta between ball and
board (Inner) Signal 44.8 Noise 3.5
SNR 12.9
XStation MX
Laminography
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Strength of TraXTM Transmission X-Ray

• High Resolution Transmission Images _at_ 2.2 x 2.2
  FOV
• Throughput
• 6 Sq in/sec

Actual Resolution
2.2
2.2
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Customers Who Care
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Contract Manufacturer of DataCom Boards
With Installation of XStation MX

• Defect Coverage Improved to Over 98
• Incremental Coverage on Difficult to Test Solder
  Joint Types, Including
• Solder bridging on active and passive devices
• Missing solder
• Insufficient solder
• BGA Defects
• Not testable previously

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World-Class Automotive Company
With Installation of XStation MX

• Ability to Achieve lt5 DPMO Total Failure Rates
• gt 99 Component Coverage on AXI
• gt 99 Defect Coverage on AXI
• Fully In-Line Operation
• 14.5 sec Inspection Time
• Within beat-rate
• Sub 100 ppmJ False Failures

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Communications Company
With Installation of XStation MX

• The Ability to Inspect
• Components un-testable by AOI due to shields and
  covers.
• Package on Package (POP) / stacked BGAs that can
  only be inspected by next generation AXI.
• Meets Full Production Beat Rates While Still
  Providing Full Coverage.

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Mil/Aero Company
With Installation of XStation MX

• AXI allowed for non-powered inspection
• AXI does not stress or degrade product life-span
• XStation MX allowed inspection of all aspects of
  every solder joint prior to deployment - Total
  Quality
• XStation MX provides the ability to keep and
  analyze data off line - Traceability
• Highest quality imaging and defect coverage using
  TraX and ClearVue

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Summary
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XStation MX The Quality Benefits

• Highest Quality by the Highest Level of Fault
  Coverage
• ClearVueTM double sided components
• TraXTM single sided components
• XFrameTM - focused at generating the highest
  quality program
• Highest Quality by the Lowest False Call Rates
• Reducing escapes due to false call overload
• Highest Quality by Resolving Technology Issues
• Loss of access
• Product complexity
• Manufacturing changes

Meeting the Markets Expectations!
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Who Cares About Quality?
More Information-http//www.teradyne.com/atd/re
source/type/web_recordings.html ORYour local
sales engineer or Teradyne account representative

• Michael J Smith
• Michael.J.Smith_at_Teradyne.com