idea

1
idea
simulation
floorplanning
fabrication
preliminary wafer screening test
dice die bond
wire bond
product
2
idea
simulation
floorplanning
fabrication
preliminary wafer screening test
LVS
dice die bond
wire bond
product
DRC
Cadence
DRC Design Rule Check LVS Layout vs Schematic
3
idea
Leon 3
68HC11
simulation
floorplanning
fabrication
preliminary wafer screening test
dice die bond
ADC RF Components
wire bond
product
Delta Sigma ADC
4
idea

• FOUNDRY
• Peregrine
• TSMC
• AMI
• SPAWAR
• Available processes listed on
• www.mosis.com

simulation
floorplanning
fabrication
preliminary wafer screening test
dice die bond
wire bond
product
SOS Wafer 2006 (Peregrine UTSOI Technology)
5
EQUIPMENTS
idea
simulation
8 Cascade Alessi REL-6100 Probe Station
floorplanning
Cascade Alessi RF Probe Station
fabrication
preliminary wafer screening test
dice die bond
wire bond
product
6 Wentworth Wafer Probe Station
8 Wentworth Probecard Repair Station
6
EQUIPMENTS
idea
Agilent Semiconductor Parameter Analyzer
simulation
Agilent Network Analyzer
floorplanning
fabrication
preliminary wafer screening test
dice die bond
wire bond
Agilent Vector Signal Analyzer
product
Audio Precision 2700 Rohde Schwarz 2GHz Signal
Source
7
EQUIPMENTS
idea
Agilent Infiniium Oscilloscope (1.5GHz, 8 GSa/s)
simulation
floorplanning
fabrication
preliminary wafer screening test
dice die bond
Tektronix TLA 720 Pattern Generator Logic
Analyzer
wire bond
product
BLUE M Electric Oven (High Temperature Testing)
8
idea
simulation
floorplanning
fabrication
preliminary wafer screening test
dice die bond
Disco Wafer Dicing Machine
wire bond
product
Westbond Die Bonder
9
idea
Kulicke Soffa Wire Bonder
simulation
floorplanning
fabrication
preliminary wafer screening test
dice die bond
wire bond
product
Westbond Pull Tester
10
idea
simulation
floorplanning
fabrication
preliminary wafer screening test
dice die bond
wire bond
SSEC 2300 Parallel Seam Sealer and Environment
Control
product
Open Package
Sealed Package (Chip)